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1. 发明授权

US10987373B2 DNA origami nanostructures for treatment of acute kidney injury 有权
公开(公告)号：US10987373B2
公开(公告)日：2021-04-27
申请号：US16492099
申请日：2018-03-08
申请人： Hao Yan , Dawei Jiang , Zhilei Ge , Hyung-jun Im , Christopher England , Peng Huang , Chunhai Fan , Weibo Cai
发明人： Hao Yan , Dawei Jiang , Zhilei Ge , Hyung-jun Im , Christopher England , Peng Huang , Chunhai Fan , Weibo Cai
IPC分类号： A61K31/711 , A61P13/12 , A61K9/51 , A61K49/00 , G01N33/543 , G01N33/58 , A61K9/00 , B82Y5/00
摘要： Disclosed herein are methods of treating acute kidney injury. The A method can include administering a sufficient amount of a DNA origami nanostructure to a subject afflicted with AKI to increase an excretory function of said subject. In some examples, the DNA origami nanostructure includes a scaffold strand and a plurality of staple strands, in which the scaffold strand comprises a M1 3 viral genome having a length of 7249 base pairs; and each staple strand of the plurality of staple strands has a length of about 20 to 60 base pairs.

2. 发明授权

US08674828B2 Real time location system and method for caching location information based on finger printing 有权
标题翻译：基于手指打印的实时定位系统和缓存位置信息的方法
公开(公告)号：US08674828B2
公开(公告)日：2014-03-18
申请号：US12958301
申请日：2010-12-01
申请人： Chang Jun Im
发明人： Chang Jun Im
IPC分类号： G08B1/08
CPC分类号： G01S5/0252
摘要： Disclosed is a location tracking system and the method thereof for storing location information. The location tracking system includes at least one beacon apparatus arranged to transmit a beacon signal to a tag; a tag at any position respectively measuring a signal intensity of beacon signals received from surrounding at least one beacon apparatus, and transmitting a measured per-beacon signal intensity to a specific beacon apparatus; and a server arranged to determine if at least any one of signal intensities exceeds a set maximum value by analyzing a per-beacon signal intensity input from the specific beacon apparatus, and store a location-based signal intensity into a database by equally dividing a distance between corresponding beacon apparatuses and then distributing a measured signal intensity into a divided each position in multiple cases the signal intensity exceeds a set maximum value.
摘要翻译：公开了一种用于存储位置信息的位置跟踪系统及其方法。位置跟踪系统包括至少一个信标装置，被布置成将信标信号发送到标签; 分别测量从周围的至少一个信标装置接收的信标信号的信号强度的任何位置处的标签，以及将测量的每信标信号强度发射到特定信标装置; 以及服务器，被配置为通过分析从特定信标设备输入的每个信标信号强度来确定信号强度中的至少任一个是否超过设定的最大值，并且通过将距离在相应的信标装置之间，然后在多个情况下将测量的信号强度分配到划分的每个位置，信号强度超过设定的最大值。

3. 发明授权

US08637969B2 Stacked chips in a semiconductor package 有权
标题翻译：半导体封装中的堆叠芯片
公开(公告)号：US08637969B2
公开(公告)日：2014-01-28
申请号：US13908728
申请日：2013-06-03
申请人： Teak-hoon Lee , Won-keun Kim , Dong-hyeon Jang , Ho-geon Song , Sung-jun Im
发明人： Teak-hoon Lee , Won-keun Kim , Dong-hyeon Jang , Ho-geon Song , Sung-jun Im
IPC分类号： H01L23/02 , H01L21/00
CPC分类号： H01L23/49811 , H01L21/561 , H01L21/563 , H01L21/568 , H01L21/6835 , H01L23/291 , H01L23/3121 , H01L23/481 , H01L24/02 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/81 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/02372 , H01L2224/024 , H01L2224/0401 , H01L2224/0557 , H01L2224/13023 , H01L2224/13024 , H01L2224/13025 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/83005 , H01L2224/83104 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2225/06568 , H01L2924/00014 , H01L2924/01013 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/12042 , H01L2924/1434 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/1811 , H01L2924/18161 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/05552
摘要： A method of forming a semiconductor package having a large capacity and a reduced or minimized volume includes: attaching a semiconductor substrate on a support substrate using an adhesive layer, wherein the semiconductor substrate includes a plurality of first semiconductor chips and a chip cutting region, wherein first and second ones of the plurality of first semiconductor chips are separated each other by the chip cutting region, and the semiconductor substrate includes a first surface on which an active area is formed and a second surface opposite to the first surface; forming a first cutting groove having a first kerf width, between the first and second ones of the plurality of first semiconductor chips, so that the semiconductor substrate is separated into a plurality of first semiconductor chips; attaching a plurality of second semiconductor chips corresponding to the first semiconductor chips, respectively, to the plurality of first semiconductor chips; forming a molding layer so as to fill the first cutting groove; and forming a second cutting groove having a second kerf width that is less than the first kerf width, in the molding layer, so as to separate the molding layer into individual molding layers covering one of the plurality of first semiconductor chips and corresponding one of the plurality of second semiconductor chips.
摘要翻译：一种形成具有大容量和减小或最小化体积的半导体封装的方法包括：使用粘合剂层将半导体衬底附着在支撑衬底上，其中半导体衬底包括多个第一半导体芯片和切屑区域，其中多个第一半导体芯片中的第一和第二半导体芯片通过芯片切割区域彼此分离，并且半导体衬底包括其上形成有源区域的第一表面和与第一表面相对的第二表面; 在所述多个第一半导体芯片中的第一和第二半导体芯片之间形成具有第一切口宽度的第一切割槽，使得半导体基板被分离成多个第一半导体芯片; 分别将对应于第一半导体芯片的多个第二半导体芯片附着到多个第一半导体芯片; 形成模塑层以填充第一切割槽; 以及在成形层中形成具有小于第一切口宽度的第二切口宽度的第二切割槽，以将模制层分离成覆盖多个第一半导体芯片中的一个的各个成型层和相应的一个多个第二半导体芯片。

4. 发明授权

US08637350B2 Method of manufacturing chip-stacked semiconductor package 有权
标题翻译：芯片堆叠半导体封装的制造方法
公开(公告)号：US08637350B2
公开(公告)日：2014-01-28
申请号：US13439447
申请日：2012-04-04
申请人： Jung-seok Ahn , Dong-hyeon Jang , Ho-geon Song , Sung-jun Im , Chang-seong Jeon , Teak-hoon Lee , Sang-sick Park
发明人： Jung-seok Ahn , Dong-hyeon Jang , Ho-geon Song , Sung-jun Im , Chang-seong Jeon , Teak-hoon Lee , Sang-sick Park
IPC分类号： H01L21/00
CPC分类号： H01L25/50 , H01L21/561 , H01L21/6835 , H01L21/76898 , H01L23/3192 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/18 , H01L2221/68327 , H01L2221/68381 , H01L2224/0346 , H01L2224/0401 , H01L2224/05008 , H01L2224/05009 , H01L2224/05568 , H01L2224/0557 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/06181 , H01L2224/11009 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/2929 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2224/92143 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06544 , H01L2225/06568 , H01L2924/00014 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/18161 , H01L2224/81 , H01L2224/11 , H01L2224/03 , H01L2924/014 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other.
摘要翻译：一种制造芯片堆叠的半导体封装的方法，所述方法包括制备包括多个第一芯片的基片，每个第一芯片均具有穿硅通孔（TSV）; 将包括多个第一芯片的基底晶片接合到支撑载体; 准备多个第二芯片; 通过将所述多个第二芯片接合到所述多个第一芯片来形成堆叠的芯片; 用密封部分密封堆叠的芯片; 并将堆叠的芯片彼此分离。

5. 发明授权

US08400057B2 Sealing substrate, organic electroluminescence apparatus and method of fabricating the same 失效
标题翻译：密封基板，有机电致发光装置及其制造方法
公开(公告)号：US08400057B2
公开(公告)日：2013-03-19
申请号：US12949445
申请日：2010-11-18
申请人： Oh-Seob Kwon , Dong-Seop Park , Jung-Jun Im , Jae-Sang Ro , Won-Eui Hong , Seog-Young Lee
发明人： Oh-Seob Kwon , Dong-Seop Park , Jung-Jun Im , Jae-Sang Ro , Won-Eui Hong , Seog-Young Lee
IPC分类号： H01J1/62 , H01J9/26 , H05K1/00 , H05K1/09
CPC分类号： H01L51/5246 , H01L51/524
摘要： An organic electroluminescence apparatus comprises: a substrate having a pixel region and sealing regions; an organic electroluminescence device located in the pixel region of the substrate; and a sealing substrate having a pixel region and sealing regions corresponding to the pixel region and the sealing regions of the substrate. The sealing regions of the sealing substrate comprise conductive layers continuously connected to each other. In a method of manufacturing organic electroluminescence apparatus by sealing the substrate and the sealing substrate using a glass frit, manufacturing costs and process time can be greatly reduced.
摘要翻译：一种有机电致发光装置，包括：具有像素区域和密封区域的基板; 位于所述基板的像素区域中的有机电致发光元件; 以及密封基板，具有像素区域和对应于基板的像素区域和密封区域的密封区域。密封基板的密封区域包括彼此连续连接的导电层。在通过使用玻璃料密封基板和密封基板来制造有机电致发光装置的方法中，可以大大降低制造成本和处理时间。

6. 发明申请

US20120319123A1 Display Device and Method of Manufacturing the Same 审中-公开
标题翻译：显示装置及其制造方法
公开(公告)号：US20120319123A1
公开(公告)日：2012-12-20
申请号：US13453466
申请日：2012-04-23
申请人： Byung-Uk Han , Oh-Seob Kwon , Jung-Jun Im , Dong-Seop Park
发明人： Byung-Uk Han , Oh-Seob Kwon , Jung-Jun Im , Dong-Seop Park
IPC分类号： H01L33/08
CPC分类号： H01L51/5246 , H01L27/3244 , H01L51/529
摘要： A display device may include a first substrate comprising a display region and a non-display region surrounding the display region, a first metal wiring formed in the display region of the first substrate, a second metal wiring formed in the non-display region of the first substrate, a sealing member formed on the second metal wiring, and a second substrate disposed on the sealing member so as to face the first substrate. The first metal wiring and the second wiring are made of the same material.
摘要翻译：显示装置可以包括包括显示区域和围绕显示区域的非显示区域的第一基板，形成在第一基板的显示区域中的第一金属布线，形成在第一基板的非显示区域中的第二金属布线第一基板，形成在第二金属布线上的密封件，以及设置在密封件上以面对第一基板的第二基板。第一金属布线和第二布线由相同的材料制成。

7. 发明申请

US20120074838A1 FLAT PANEL DISPLAY AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：平板显示器及其制造方法
公开(公告)号：US20120074838A1
公开(公告)日：2012-03-29
申请号：US13243946
申请日：2011-09-23
申请人： Jung-Jun Im , Oh-Seob Kwon , Byung-Uk Han , Sung-Soo Koh , Jae-Sang Ro , Won-Eui Hong , Seog-Young Lee
发明人： Jung-Jun Im , Oh-Seob Kwon , Byung-Uk Han , Sung-Soo Koh , Jae-Sang Ro , Won-Eui Hong , Seog-Young Lee
IPC分类号： H01J5/20 , H01J9/26 , H05B33/14
CPC分类号： H01J5/20 , H01L27/3276 , H01L51/5246 , H05B33/04 , H05B33/10
摘要： Flat panel displays and methods of manufacturing the displays are disclosed. In one embodiment, the flat panel display includes: i) a substrate, ii) a display unit formed over the substrate, iii) an encapsulation substrate formed so as to face the display unit and iv) a sealing member formed between the substrate and the encapsulation substrate so as to substantially surround the display unit. The display may further include i) a wiring unit formed between the substrate and the encapsulation substrate so as to substantially overlap with the sealing member, wherein the wiring unit includes at least one via hole and ii) an inlet unit connected to the wiring unit and connectable to an external power source.
摘要翻译：公开了平板显示器和制造显示器的方法。在一个实施例中，平板显示器包括：i）衬底，ii）形成在衬底上的显示单元，iii）形成为面对显示单元的封装衬底，以及iv）形成在衬底和衬底之间的密封构件封装基板，以便基本上围绕显示单元。所述显示器还可以包括：i）形成在所述基板和所述封装基板之间的布线单元，以便与所述密封构件基本重叠，其中所述布线单元包括至少一个通孔，以及ii）连接到所述布线单元的入口单元，可连接到外部电源。

8. 发明申请

US20120056523A1 Flat panel display apparatus and mother substrate for flat panel display apparatus 失效
标题翻译：平板显示装置和平板显示装置用母板
公开(公告)号：US20120056523A1
公开(公告)日：2012-03-08
申请号：US13137658
申请日：2011-09-01
申请人： Byung-Uk Han , Oh-Seob Kwon , Sung-Soo Koh , Jung-Jun Im , Dong-Seop Park , Jae-Sang Ro , Seog-Young Lee , Won-Eui Hong
发明人： Byung-Uk Han , Oh-Seob Kwon , Sung-Soo Koh , Jung-Jun Im , Dong-Seop Park , Jae-Sang Ro , Seog-Young Lee , Won-Eui Hong
IPC分类号： H01J1/88
CPC分类号： H01L51/5246 , H01L27/3276 , H01L51/529
摘要： A flat panel display apparatus includes a first substrate having a display region, a second substrate facing the first substrate and bonded to the first substrate, a groove portion in an edge of at least one of the first substrate and the second substrate, and a wiring portion and a bonding member arranged in the groove portion. The bonding member contacts the wiring portion. The wiring portion is configured to receive power and to supply heat to the bonding member. The bonding member is configured to bond the first substrate and the second substrate using the heat supplied from the wiring portion disposed in the groove portion.
摘要翻译：平板显示装置包括具有显示区域的第一基板，与第一基板对置并与第一基板接合的第二基板，第一基板和第二基板中的至少一个的边缘的槽部，配线部分和布置在凹槽部分中的接合构件。接合部件接触配线部。配线部被配置为接收电力并向接合部件供给热量。接合部件被配置为使用从设置在槽部中的配线部供应的热量来接合第一基板和第二基板。

9. 发明授权

US07999465B2 Organic light emitting diode (OLED) display device 有权
标题翻译：有机发光二极管（OLED）显示装置
公开(公告)号：US07999465B2
公开(公告)日：2011-08-16
申请号：US12318855
申请日：2009-01-09
申请人： Dong-Su Yee , Kuen-Dong Ha , Chan-Kyoung Moon , Hyun-Hee Lee , Ji-Ho Kang , Oh-June Kwon , Jung-Jun Im , Hyun-Min Hwang , Jae-Wook Lee , Song-Hark Lee , Joung-Chung Kim , Min-Su Kim
发明人： Dong-Su Yee , Kuen-Dong Ha , Chan-Kyoung Moon , Hyun-Hee Lee , Ji-Ho Kang , Oh-June Kwon , Jung-Jun Im , Hyun-Min Hwang , Jae-Wook Lee , Song-Hark Lee , Joung-Chung Kim , Min-Su Kim
IPC分类号： H01J1/62 , H01L51/50
CPC分类号： H01L51/5237 , G06F1/1601
摘要： An Organic Light Emitting Diode (OLED) display reduces damage to a panel assembly with an improved bezel structure. The OLED display includes a panel assembly including a display area, a pad area, and a plurality of OLEDs arranged in the display area and a bezel attached to the panel assembly. The bezel is has a rebound resilience in a range of 50-70%. The bezel is made of a silicon-based rubber.
摘要翻译：有机发光二极管（OLED）显示器可减少对具有改进的挡板结构的面板组件的损坏。 OLED显示器包括面板组件，其包括显示区域，焊盘区域和布置在显示区域中的多个OLED以及附接到面板组件的边框。该挡板具有50-70％的反弹弹性。表圈由硅橡胶制成。

10. 发明授权

US07966861B2 Jig frame for drop test of flat panel display device 有权
标题翻译：平板显示装置跌落试验用夹具框架
公开(公告)号：US07966861B2
公开(公告)日：2011-06-28
申请号：US12289977
申请日：2008-11-07
申请人： Dong-Su Yee , Kuen-Dong Ha , Hyun-Min Hwang , Chan-Kyoung Moon , Hyun-Hee Lee , Jung-Jun Im , Oh-June Kwon , Ji-Ho Kang
发明人： Dong-Su Yee , Kuen-Dong Ha , Hyun-Min Hwang , Chan-Kyoung Moon , Hyun-Hee Lee , Jung-Jun Im , Oh-June Kwon , Ji-Ho Kang
IPC分类号： G01N3/00
CPC分类号： G01N3/303 , G02F1/1309
摘要： A jig frame for a drop test of a flat panel display, which is designed to allow a tester to effectively identify if the flat panel display is damaged and to easily adjust its weight and degree of deformation is provided. The jig frame for a drop test of a flat panel display includes a base plate having a groove for receiving the flat panel display and a cover plate fixing the flat panel display by covering the flat panel display and being coupled to the base plate. The cover plate is formed of transparent material so that the flat panel display installed in the jig frame is visible to outside of the cover plate.
摘要翻译：提供了一种用于平板显示器跌落试验的夹具框架，其被设计成允许测试仪有效地识别平板显示器是否损坏并且容易地调节其重量和变形程度。用于平板显示器跌落试验的夹具框架包括具有用于接收平板显示器的凹槽的基板和通过覆盖平板显示器并且连接到基板来固定平板显示器的盖板。盖板由透明材料形成，使得安装在夹具框架中的平板显示器对于盖板的外部是可见的。

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