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    • 3. 发明申请
    • Method and system for fabricating integrated circuit chips with unique identification numbers
    • 用于制造具有唯一识别号的集成电路芯片的方法和系统
    • US20050224590A1
    • 2005-10-13
    • US11104517
    • 2005-04-13
    • John MelngailisWilliam Bandy
    • John MelngailisWilliam Bandy
    • G06K1/12G06K19/06
    • G06K1/126
    • A method, system, and apparatus for writing data to integrated circuits is described. A charged particle source supplies a beam of charged particles. A wafer plate mounts a wafer having a plurality of transistors distributed among an array of integrated circuits on a surface. A beam column receives the beam of charged particles and selectively passes the beam of charged particles to the surface of the wafer. The selectively passed beam of charged particles irradiates selected transistors of the plurality of transistors to cause the selected transistors to permanently change from a first state to a second state. The second state can be a fully “on” state, a fully “off” state, or a state in between for the selected transistors. Each integrated circuit of the array includes at least one of the selected transistors and at least one non-selected transistor. A combination of selected and non-selected transistors of the integrated circuit corresponds to data for the integrated circuit.
    • 描述了将数据写入集成电路的方法,系统和装置。 带电粒子源提供带电粒子束。 晶片板在表面上安装具有分布在集成电路阵列中的多个晶体管的晶片。 束柱接收带电粒子束并选择性地将带电粒子束传递到晶片的表面。 选择通过的带电粒子束照射多个晶体管中的选定晶体管,以使所选择的晶体管永久地从第一状态改变到第二状态。 第二状态可以是完全“接通”状态,完全“断开”状态,或者是所选晶体管之间的状态。 阵列的每个集成电路包括至少一个所选择的晶体管和至少一个未选择的晶体管。 集成电路的选定晶体管和非选择晶体管的组合对应于集成电路的数据。
    • 5. 发明授权
    • Acoustic wave device
    • 声波装置
    • US4342970A
    • 1982-08-03
    • US233320
    • 1981-02-11
    • John MelngailisHermann A. HausAna L. Lattes
    • John MelngailisHermann A. HausAna L. Lattes
    • H03H9/02H03H9/25H03H9/64
    • H03H9/0296H03H9/02653H03H9/02622
    • A surface acoustic wave (SAW) device including a crystal substrate having two substantially planar surfaces and at least one SAW-to-plate mode coupler positioned on one of the surfaces. The SAW-to-plate mode coupler includes a plurality of parallel, linear surface perturbations. The surface perturbations are adapted to convert a portion of an incident SAW to a bulk acoustic wave (BAW). In addition, the coupler is adapted to convert a portion of an incident BAW (from the crystal bulk region) to a SAW at those surface perturbations. In addition, the planar surfaces of the crystal substrate are adapted to reflect portions of incident BAW's. The coupler is positioned with respect to the crystal characteristics so that SAW's and BAW's resonantly interact at the coupler. In alternative configurations, a second SAW-to-plate mode coupler is positioned on the second surface of the crystal substrate. This second surface coupler also is adapted to convert a portion of an incident SAW to a bulk acoustic wave (BAW) at a plurality of parallel surface perturbations, and to convert a portion of an incident BAW to a SAW at those perturbations. The couplers are positioned in view of the crystal characteristics so that the BAW's and SAW's resonantly interact at the couplers.
    • 一种表面声波(SAW)装置,包括具有两个基本平坦的表面的晶体基板和位于其中一个表面上的至少一个SAW至板模式耦合器。 SAW至板模式耦合器包括多个平行的线性表面扰动。 表面扰动适于将入射SAW的一部分转换为体声波(BAW)。 另外,耦合器适于将入射的BAW(从晶体块区域)的一部分转换成在那些表面扰动处的SAW。 此外,晶体衬底的平面表面适于反映事件BAW的部分。 耦合器相对于晶体特性定位,使得SAW和BAW在耦合器处共振地相互作用。 在替代配置中,第二SAW至板模式耦合器位于晶体衬底的第二表面上。 该第二表面耦合器还适于在多个平行的表面扰动下将入射的SAW的一部分转换为体声波(BAW),并且在这些扰动下将入射的BAW的一部分转换为SAW。 鉴于晶体特性,耦合器被定位,使得BAW和SAW在耦合器处共振地相互作用。
    • 8. 发明授权
    • Acoustic wave device
    • 声波装置
    • US4268808A
    • 1981-05-19
    • US40667
    • 1979-05-21
    • John Melngailis
    • John Melngailis
    • H03H9/25H03H3/08H03H9/02H03H9/64H03H9/54
    • H03H9/02653H03H9/02622H03H9/0296
    • A surface acoustic wave (SAW) device including a crystal substrate having two substantially planar surfaces and at least one SAW-to-plate mode coupler positioned on one of the surfaces. The SAW-to-plate mode coupler includes a plurality of parallel, linear surface perturbations. The surface perturbations are adapted to convert a portion of an incident SAW to a bulk acoustic wave (BAW). In addition, the coupler is adapted to convert a portion of an incident BAW (from the crystal bulk region) to a SAW at those surface perturbations. In addition, the planar surfaces of the crystal substrate are adapted to reflect portions of incident BAW's. The coupler is positioned with respect to the crystal characteristics so that SAW's and BAW's resonantly interact at the coupler. In alternative configurations, a second SAW-to-plate mode coupler is positioned on the second surface of the crystal substrate. This second surface coupler also is adapted to convert a portion of an incident SAW to a bulk acoustic wave (BAW) at a plurality of parallel surface perturbations, and to convert a portion of an incident BAW to a SAW at those perturbations. The couplers are positioned in view of the crystal characteristics so that the BAW's and SAW's resonantly interact at the couplers.
    • 一种表面声波(SAW)装置,包括具有两个基本平坦的表面的晶体基板和位于其中一个表面上的至少一个SAW至板模式耦合器。 SAW至板模式耦合器包括多个平行的线性表面扰动。 表面扰动适于将入射SAW的一部分转换为体声波(BAW)。 另外,耦合器适于将入射的BAW(从晶体块区域)的一部分转换成在那些表面扰动处的SAW。 此外,晶体衬底的平面表面适于反映事件BAW的部分。 耦合器相对于晶体特性定位,使得SAW和BAW在耦合器处共振地相互作用。 在替代配置中,第二SAW至板模式耦合器位于晶体衬底的第二表面上。 该第二表面耦合器还适于在多个平行的表面扰动下将入射的SAW的一部分转换为体声波(BAW),并且在这些扰动下将入射的BAW的一部分转换为SAW。 鉴于晶体特性,耦合器被定位,使得BAW和SAW在耦合器处共振地相互作用。