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    • 2. 发明申请
    • PROCESS FOR DEPOSITING LAYERS CONTAINING SILICON AND GERMANIUM
    • 沉积含有硅和锗的层的工艺
    • US20090081853A1
    • 2009-03-26
    • US11572101
    • 2005-02-22
    • Marcus SchumacherPeter BaumannJohannes LindnerTimothy McEntee
    • Marcus SchumacherPeter BaumannJohannes LindnerTimothy McEntee
    • H01L21/205
    • C23C16/4411C23C16/4481C23C16/52Y10S438/933
    • The invention relates to a method for depositing at least one semiconductor layer on at least one substrate in a processing chamber (2). Said semiconductor layer is composed of several components which are evaporated by non-continuously injecting a liquid starting material (3) or a starting material (3) dissolved in a liquid into a tempered evaporation chamber (4) with the aid of one respective injector unit (5) while said vapor is fed to the processing chamber by means of a carrier gas (7). The inventive method is characterized in that the mass flow rate parameters, such as the preliminary injection pressure, the injection frequency, the pulse/pause ratio, and the phase relation between the pulses/pauses and the pulses/pauses of the other injector unit(s), which determine the progress of the mass flow rate of a first silicon-containing starting material and a germanium-containing second starting material (3) through the associated injector unit (5), are individually adjusted or varied.
    • 本发明涉及一种用于在处理室(2)中的至少一个衬底上沉积至少一个半导体层的方法。 所述半导体层由若干组分组成,这些组分通过一个相应的注射器单元不间断地将溶解在液体中的液体原料(3)或起始材料(3)蒸发到回火蒸发室(4)中来蒸发, (5),同时所述蒸气通过载气(7)供给到处理室。 本发明的方法的特征在于,质量流量参数,例如初步注射压力,注射频率,脉冲/暂停比率以及脉冲/停顿之间的相位关系和另一个注射器单元的脉冲/停顿( s),其通过相关联的注射器单元(5)确定第一含硅起始材料和含锗的第二起始材料(3)的质量流率的进度被单独调整或变化。
    • 4. 发明申请
    • Apparatus and method for high-throughput chemical vapor deposition
    • 高通量化学气相沉积的装置和方法
    • US20080096369A1
    • 2008-04-24
    • US11573325
    • 2005-07-01
    • Piotr StrzyzewskiPeter BaumannMarcus SchumacherJohannes LindnerAntonio Meequilda Kusters
    • Piotr StrzyzewskiPeter BaumannMarcus SchumacherJohannes LindnerAntonio Meequilda Kusters
    • H01L21/36C23C16/00
    • C23C16/458B05C3/18B05D1/36C23C16/45551
    • The invention relates to a device for depositing at least one especially thin layer onto at least one substrate (9). Said device comprises a process chamber (1, 20, 11, 11′, 40, 21), housed in a reactor housing (2) and comprising a movable susceptor (20) which carries the at least one substrate (9). A plurality of gas feed lines (24) run into said process chamber and feed different process gases which comprise coat-forming components. Said process gases can be fed to the process chamber in subsequent process steps, thereby depositing the coat-forming components onto the substrate (9). In order to increase the throughput of said method, the process chamber is provided with a plurality of separate deposition chambers (11, 11′) into which different gas feed lines (24, 24′) run, thereby feeding individual gas compositions. The substrate (9) can be fed to said chambers one after the other by moving the susceptor (20) and depositing different layers or layer components.
    • 本发明涉及一种用于将至少一个特别薄的层沉积在至少一个基底(9)上的装置。 所述装置包括容纳在反应器壳体(2)中并包括承载至少一个基板(9)的可移动基座(20)的处理室(1,20,11,11',40,21)。 多个气体供给管线(24)进入所述处理室并且供给包括涂层成分的不同工艺气体。 所述工艺气体可以在随后的工艺步骤中进料到处理室,从而将涂层形成组分沉积到衬底(9)上。 为了增加所述方法的生产量,处理室设置有多个分离的沉积室(11,11'),不同的气体供给管线(24,24')运行到其中,从而供给单独的气体组成。 基板(9)可以通过移动基座(20)并沉积不同的层或层部件而一个接一个地馈送到所述腔室。
    • 5. 发明授权
    • Method for self-limiting deposition of one or more monolayers
    • 用于自限制沉积一个或多个单层的方法
    • US08114480B2
    • 2012-02-14
    • US11763231
    • 2007-06-14
    • Peter BaumannJohannes Lindner
    • Peter BaumannJohannes Lindner
    • C23C16/00
    • C23C16/45525C23C16/18C23C16/40C23C16/45553
    • The invention relates to a method for deposition of at least one layer containing at least one first component on at least one substrate in a process chamber, wherein first and second starting materials are introduced in gaseous form into the process chamber in alternation cyclically, at least the first starting material of which contains the first component, to deposit essentially only one layer of the first component in each cycle. To widen the spectrum of available starting materials suitable for the process, it is proposed that the first starting material shall consist of two β-diketones and one diene coordinated with one ruthenium atom, and a limiter shall be introduced into the process chamber simultaneously with or some time after the first starting material, such that deposition of the first component on the substrate is automatically concluded after the first layer is completed, wherein the limiter is or contains octane, butyl acetates, tetrahydrofuran, methanol, ethanol, isobutylamines, triethylamines, butanol, cyclohexane, isooctane, dioxane, dimethylformamide, pyridine and/or toluene.
    • 本发明涉及一种用于在处理室中的至少一个基底上沉积含有至少一种第一组分的至少一层的方法,其中将第一和第二起始材料以气态形式循环地以交替方式引入所述处理室,至少 其第一起始材料包含第一组分,以在每个循环中仅基本沉积第一组分的一层。 为了扩大适用于该工艺的可用起始材料的光谱,提出第一起始材料应由两个二酮和一个与一个钌原子配位的二烯构成,并且限制器应与 或者在第一起始材料之后的一段时间,使得在第一层完成之后,第一组分在衬底上的沉积自动结束,其中限制器是或含有辛烷,乙酸丁酯,四氢呋喃,甲醇,乙醇,异丁胺,三乙胺, 丁醇,环己烷,异辛烷,二恶烷,二甲基甲酰胺,吡啶和/或甲苯。
    • 7. 发明授权
    • Process for depositing layers containing silicon and germanium
    • 用于沉积含硅和锗的层的工艺
    • US07732308B2
    • 2010-06-08
    • US11572101
    • 2005-02-22
    • Marcus SchumacherPeter BaumannJohannes LindnerTimothy McEntee
    • Marcus SchumacherPeter BaumannJohannes LindnerTimothy McEntee
    • H01L21/00
    • C23C16/4411C23C16/4481C23C16/52Y10S438/933
    • The invention relates to a method for depositing at least one semiconductor layer on at least one substrate in a processing chamber (2). Said semiconductor layer is composed of several components which are evaporated by non-continuously injecting a liquid starting material (3) or a starting material (3) dissolved in a liquid into a tempered evaporation chamber (4) with the aid of one respective injector unit (5) while said vapor is fed to the processing chamber by means of a carrier gas (7). The inventive method is characterized in that the mass flow rate parameters, such as the preliminary injection pressure, the injection frequency, the pulse/pause ratio, and the phase relation between the pulses/pauses and the pulses/pauses of the other injector unit(s), which determine the progress of the mass flow rate of a first silicon-containing starting material and a germanium-containing second starting material (3) through the associated injector unit (5), are individually adjusted or varied.
    • 本发明涉及一种用于在处理室(2)中的至少一个衬底上沉积至少一个半导体层的方法。 所述半导体层由若干组分组成,这些组分通过一个相应的注射器单元不间断地将溶解在液体中的液体原料(3)或起始材料(3)蒸发到回火蒸发室(4)中来蒸发, (5),同时所述蒸气通过载气(7)供给到处理室。 本发明的方法的特征在于,质量流量参数,例如初步注射压力,注射频率,脉冲/暂停比率以及脉冲/停顿之间的相位关系和另一个注射器单元的脉冲/停顿( s),其通过相关联的注射器单元(5)确定第一含硅起始材料和含锗的第二起始材料(3)的质量流率的进度被单独调整或变化。
    • 10. 发明申请
    • Method for self-limiting deposition of one or more monolayers
    • 用于自限制沉积一个或多个单层的方法
    • US20070293055A1
    • 2007-12-20
    • US11763231
    • 2007-06-14
    • Peter BaumannJohannes Lindner
    • Peter BaumannJohannes Lindner
    • H01L21/31
    • C23C16/45525C23C16/18C23C16/40C23C16/45553
    • The invention relates to a method for deposition of at least one layer containing at least one first component on at least one substrate in a process chamber, wherein first and second starting materials are introduced in gaseous form into the process chamber in alternation cyclically, at least the first starting material of which contains the first component, to deposit essentially only one layer of the first component in each cycle. To widen the spectrum of available starting materials suitable for the process, it is proposed that the first starting material shall consist of two β-diketones and one diene coordinated with one ruthenium atom, and a limiter shall be introduced into the process chamber simultaneously with or some time after the first starting material, such that deposition of the first component on the substrate is automatically concluded after the first layer is completed, wherein the limiter is or contains octane, butyl acetates, tetrahydrofuran, methanol, ethanol, isobutylamines, triethylamines, butanol, cyclohexane, isooctane, dioxane, dimethylformamide, pyridine and/or toluene.
    • 本发明涉及一种用于在处理室中的至少一个基底上沉积含有至少一种第一组分的至少一层的方法,其中将第一和第二起始材料以气态形式循环地以交替方式引入所述处理室,至少 其第一起始材料包含第一组分,以在每个循环中仅基本沉积第一组分的一层。 为了扩大适用于该方法的可用原料的光谱,提出第一起始原料应由两个β-二酮和一个与一个钌原子配位的二烯构成,并且限制器应与 在第一起始材料之后的一段时间,使得第一层完成后第一组分沉积在基底上自动结束,其中限制器是或含有辛烷,乙酸丁酯,四氢呋喃,甲醇,乙醇,异丁胺,三乙胺,丁醇 ,环己烷,异辛烷,二恶烷,二甲基甲酰胺,吡啶和/或甲苯。