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1. 发明授权

US08802997B2 Multi layer circuit board and manufacturing method of the same 有权
标题翻译：多层电路板及其制造方法相同
公开(公告)号：US08802997B2
公开(公告)日：2014-08-12
申请号：US13063631
申请日：2008-12-18
申请人： Jeong Don Kwon , Seung Min Hong , Ju Ho Shin
发明人： Jeong Don Kwon , Seung Min Hong , Ju Ho Shin
IPC分类号： H05K1/03
CPC分类号： H05K3/4655 , H05K1/0263 , H05K3/4652 , H05K2201/0195 , H05K2201/0293 , Y10T428/24479 , Y10T428/24917 , Y10T442/3431
摘要： Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.
摘要翻译：公开了具有多层重铜的PCB。具有非织造玻璃网状基材的预浸料单独使用或与具有玻璃织物基材的另一种预浸料一起使用，使得可以有效地填充与厚膜相当的重铜之间的空间而不产生空隙。 PCB包括在芯基板的一个表面或两个表面上图案化的第一铜的覆铜层压板; 层叠在覆铜层压板的一个表面或两个表面上的至少一个第一预浸料，用作第一预浸料的基材的非织造玻璃纤维网; 在所述第一预浸料的一个表面或两个表面上层叠的至少一个第二预浸料，用作所述第二预浸料的基材的玻璃织物; 和第二铜层压在第二预浸料的一个表面或两个表面上。

2. 发明申请

US20110214907A1 MULTI LAYER CIRCUIT BOARD AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：多层电路板及其制造方法
公开(公告)号：US20110214907A1
公开(公告)日：2011-09-08
申请号：US13063631
申请日：2008-12-18
申请人： Jeong Don Kwon , Seung Min Hong , Ju Ho Shin
发明人： Jeong Don Kwon , Seung Min Hong , Ju Ho Shin
IPC分类号： H05K1/09 , B32B37/02
CPC分类号： H05K3/4655 , H05K1/0263 , H05K3/4652 , H05K2201/0195 , H05K2201/0293 , Y10T428/24479 , Y10T428/24917 , Y10T442/3431
摘要： Disclosed is a PCB having multiple layers of heavy copper. A prepreg having a nonwoven glass web substrate is used alone or together with another prepreg having a glass fabric substrate so that the space between heavy copper, which is comparable to a thick film, can be filled efficiently without creating voids. The PCB includes a copper clad laminate having first copper patterned on one surface or both surfaces of a core substrate; at least one first prepreg laminated on one surface or both surfaces of the copper clad laminate, nonwoven glass web being used as the substrate of the first prepreg; at least one second prepreg laminated on one surface or both surfaces of the first prepreg, glass fabric being used as a substrate of the second prepreg; and second copper laminated on one surface or both surfaces of the second prepreg.
摘要翻译：公开了具有多层重铜的PCB。具有非织造玻璃网状基材的预浸料单独使用或与具有玻璃织物基材的另一种预浸料一起使用，使得可以有效地填充与厚膜相当的重铜之间的空间而不产生空隙。 PCB包括在芯基板的一个表面或两个表面上图案化的第一铜的覆铜层压板; 层叠在覆铜层压板的一个表面或两个表面上的至少一个第一预浸料，用作第一预浸料的基材的非织造玻璃纤维网; 在所述第一预浸料的一个表面或两个表面上层叠的至少一个第二预浸料，用作所述第二预浸料的基材的玻璃织物; 和第二铜层压在第二预浸料的一个表面或两个表面上。

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