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    • 3. 发明授权
    • Method of fabricating a superconducting junction using cubic YBa.sub.2
Cu.sub.3 O .sub.x thin film as a barrier layer
    • 使用立方YBa2Cu3O x薄膜作为阻挡层制造超导结的方法
    • US6004907A
    • 1999-12-21
    • US119394
    • 1998-07-21
    • Jeong Dae SuhGun Yong Sung
    • Jeong Dae SuhGun Yong Sung
    • H01L39/22H01L39/24
    • H01L39/2496Y10S505/702
    • The present invention forms a superconducting junction using a cubic YBa.sub.2 Cu.sub.3 Ox thin film as a barrier layer. The present invention forms a first YBCO superconducting thin film, a SrTiO.sub.3 insulating layer thin film on the substrate, etches a side of them in the form of inclination, subsequently integrates a non-superconducting cubic YBCO barrier thin film, a second YBCO superconducting thin film, a SrTiO.sub.3 protecting layer thin film in series on the whole surface of the substrate, etches an opposite side of the etched part of the SrTiO.sub.3 insulating layer thin film in the form of inclination, fabricates a superconducting junction by forming a metal electrode to said aperture after forming apertures which expose said first YBCO superconducting thin film, the second YBCO superconducting thin film, fabricates a superconducting junction upon forming the metallic electrode to the apertures, and deposits a cubic YBa.sub.2 Cu.sub.3 Ox barrier thin film at a temperature of 600-650.degree. C. and a depositing velocity of 6.5-12.2 nm/s.
    • 本发明使用立方YBa2Cu3Ox薄膜作为阻挡层形成超导结。 本发明在衬底上形成第一YBCO超导薄膜,SrTiO3绝缘层薄膜,以斜面的形式蚀刻它们的一面,随后将非超导立方YBCO阻挡薄膜,第二YBCO超导薄膜 ,在基板的整个表面上串联的SrTiO3保护层薄膜,以倾斜的形式蚀刻SrTiO 3绝缘层薄膜的蚀刻部分的相对侧,通过在所述孔径上形成金属电极来制造超导结 在形成暴露所述第一YBCO超导薄膜的孔之后,第二YBCO超导薄膜在向孔隙形成金属电极时制造超导结,并在600-650℃的温度下沉积立方YBa2Cu3Ox势垒薄膜。 并且沉积速度为6.5-12.2nm / s。
    • 7. 发明授权
    • Method for making a superconducting field-effect device with grain
boundary channel
    • 制造具有晶界通道的超导场效应装置的方法
    • US5846846A
    • 1998-12-08
    • US560962
    • 1995-11-20
    • Jeong-Dae SuhGun-Yong Sung
    • Jeong-Dae SuhGun-Yong Sung
    • H01L39/00H01L29/78H01L39/22H01L39/24H01L21/00
    • H01L39/2496H01L39/228
    • Disclosed is a method for making a superconducting field-effect device with a grain boundary channel, the method comprising the steps of depositing a first superconducting thin film on a substrate; patterning the first superconducting thin film to form a patterned superconducting thin film having an opening; depositing a template layer thereon; selectively etching back the template layer to form a patterned template layer; growing a second superconducting thin film to form a grain boundary therebetween; depositing an insulating layer on the second superconducting thin film to protect the second superconducting thin film from degrading in property in the air; selectively etching back the insulating layer to form a patterned insulating layer; forming a gate insulating layer on the patterned insulating layer; and coating metal electrodes thereon, source/drain being formed respectively on the etched portions, and a gate electrode being formed on the deposited portion of the gate insulating layer directly above the grain boundary. In the superconducting FET manufactured thus, since a gate electrode is formed directly above a grain boundary, current flowing between source and drain can be controlled by a voltage applied through an gate insulating layer. Also, since the grain boundary serving as a channel can be formed in a cheaper oxide crystal substrate by variation in a growing temperature of thin film without using an expensive by-crystal substrate, a high-temperature superconducting FET can be economically fabricated.
    • 公开了一种制造具有晶界通道的超导场效应器件的方法,该方法包括以下步骤:在衬底上沉积第一超导薄膜; 图案化第一超导薄膜以形成具有开口的图案化超导薄膜; 在其上沉积模板层; 选择性地蚀刻模板层以形成图案化的模板层; 生长第二超导薄膜以在其间形成晶界; 在所述第二超导薄膜上沉积绝缘层以保护所述第二超导薄膜不会降低空气中的性能; 选择性地蚀刻回绝缘层以形成图案化的绝缘层; 在所述图案化绝缘层上形成栅极绝缘层; 并在其上涂覆金属电极,分别在蚀刻部分上形成源极/漏极,以及形成在晶界正上方的栅极绝缘层的沉积部分上的栅电极。 在这样制造的超导FET中,由于栅电极直接形成在晶界之上,所以可以通过栅极绝缘层施加的电压来控制在源极和漏极之间流动的电流。 此外,由于可以通过在不使用昂贵的晶体基板的情况下通过薄膜的生长温度的变化而在较便宜的氧化物晶体基板中形成作为沟道的晶界,因此可以经济地制造高温超导FET。
    • 9. 发明授权
    • Method for making a high-temperature superconducting field-effect
transistor with thick superconducting channel layer
    • 制造具有厚超导通道层的高温超导场效应晶体管的方法
    • US5663081A
    • 1997-09-02
    • US352045
    • 1994-11-30
    • Gun-Yong SungJeong-Dae Suh
    • Gun-Yong SungJeong-Dae Suh
    • H01L39/22H01L39/02H01L39/14H01L39/24H01B12/00
    • H01L39/146Y10S505/701
    • Disclosed is a method for making a high-temperature super-conducting field-effect transistor with a thick super-conducting channel, the method comprising the steps of depositing a template layer on an oxide crystal substrate by using a pulse laser depositing apparatus; forming a YBa.sub.2 Cu.sub.3 O.sub.7-x layer on the template layer; patterning the YBa.sub.2 Cu.sub.3 O.sub.7-x layer to form a patterned YBa.sub.2 Cu.sub.3 O.sub.7-x layer having an opening and expose a surface portion of the template layer; depositing a YBa.sub.2 Cu.sub.3 O.sub.7-x channel layer on the surface portion of the template layer and over the patterned YBa.sub.2 Cu.sub.3 O.sub.7-x layer, the channel layer having a thickness of from 60 to 100 nm; sequentially forming an SrTiO.sub.3 protective layer and an SrTiO.sub.3 insulating layer on the channel layer; dry-etching back portions of the insulating and protective layers using an etching mask so as to expose surface portions of the channel layer; and forming source/drain electrodes on both the surface portions of the channel layer and at the same time forming a gate electrode on the insulating layer in the opening. In the superconducting FET, the channel layer is formed from 60 to 100 nm in thickness between the substrate and the SrTiO.sub.3 layers. Even through the channel layer is affected by the stress-strain up to approximately 25 nm in depth from each surfaces thereof, since total depth of surface regions of the channel layer affected thus is about 50 nm, the channel layer has a super-conducting center region of from 10 to 50 nm in thickness in which a strain is completely eliminated.
    • 公开了一种制造具有厚超导通道的高温超导场效应晶体管的方法,所述方法包括以下步骤:通过使用脉冲激光沉积设备在氧化物晶体衬底上沉积模板层; 在模板层上形成YBa2Cu3O7-x层; 图案化YBa2Cu3O7-x层以形成具有开口并且暴露模板层的表面部分的图案化的YBa2Cu3O7-x层; 在模板层的表面部分和图案化的YBa2Cu3O7-x层上沉积YBa2Cu3O7-x沟道层,沟道层的厚度为60〜100nm; 在沟道层上依次形成SrTiO3保护层和SrTiO3绝缘层; 使用蚀刻掩模对绝缘和保护层的后蚀刻部分进行干蚀刻,以暴露沟道层的表面部分; 以及在沟道层的两个表面部分上形成源/漏电极,同时在开口中的绝缘层上形成栅电极。 在超导FET中,在衬底和SrTiO 3层之间的沟道层的厚度为60〜100nm。 即使通过沟道层也受到其每个表面深度约25nm的应力应变的影响,因此受影响的沟道层的表面区域的总深度约为50nm,沟道层具有超导中心 其中应变完全消除的厚度为10至50nm的区域。