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    • 2. 发明授权
    • Charge trap memory with avalanche generation inducing layer
    • 具有雪崩产生诱导层的电荷陷阱存储器
    • US07615821B2
    • 2009-11-10
    • US11346659
    • 2006-02-03
    • Jae Sung SimByung Gook ParkJong Duk LeeChung Woo Kim
    • Jae Sung SimByung Gook ParkJong Duk LeeChung Woo Kim
    • H01L29/792
    • G11C16/0466G11C16/0483H01L29/66833H01L29/792
    • The present invention discloses a charge trap flash memory cell with multi-doped layers at the active region, a memory array using of the memory cell, and an operating method of the same. The charge trap memory cell structure of the present invention is characterized by forming multi-doped layers at the active region appropriately, and it is a difference from the conventional art. The present invention induces electrons to band-to-band tunnel at the PN junction with the source/drain region by the multi-doped layers, and accelerates the electrons at the reverse bias to generate an avalanche phenomenon. Therefore, the method for operating a memory array of the present invention comprises programming by injecting holes which are generated by the avalanche phenomenon into multi-dielectric layers of each memory cells, and erasing by injecting electrons through an F-N tunneling from channels into the multi-dielectric layers of each memory cells.
    • 本发明公开了一种在有源区域具有多掺杂层的电荷陷阱闪存单元,使用存储单元的存储器阵列及其操作方法。 本发明的电荷陷阱存储单元结构的特征在于在有源区适当地形成多层掺杂层,与现有技术不同。 本发明通过多掺杂层在与源/漏区的PN结处引起电子到带 - 带隧道,并且以反向偏压加速电子以产生雪崩现象。 因此,用于操作本发明的存储器阵列的方法包括通过将由雪崩现象产生的空穴注入到每个存储单元的多个电介质层中来进行编程,以及通过从通道的FN隧道注入电子到多层电介质来擦除, 每个存储单元的电介质层。
    • 7. 发明申请
    • Integrated Circuit Memory Devices Having Vertically Arranged Strings of Memory Cells Therein and Methods of Operating Same
    • 具有垂直排列的存储器单元串的集成电路存储器件及其操作方法相同
    • US20110266607A1
    • 2011-11-03
    • US13181037
    • 2011-07-12
    • Jae-Sung SimJung-Dal Choi
    • Jae-Sung SimJung-Dal Choi
    • H01L27/088
    • H01L27/11551G11C5/02G11C16/0483H01L27/11519H01L27/11556H01L27/11565H01L27/11578
    • Nonvolatile memory devices include a first NAND-type string of EEPROM cells having a first plurality of string selection transistors therein electrically connected in series within the string. This first plurality of string selection transistors includes a first plurality of depletion-mode transistors and a first enhancement-mode transistor. A second NAND-type string of EEPROM cells is also provided with a second plurality of string selection transistors therein that are electrically connected in series. The second plurality of string selection transistors includes a second plurality of depletion-mode transistors and a second enhancement-mode transistor. According to these embodiments of the invention, the first enhancement-mode transistor is stacked vertically relative to one of the second plurality of depletion-mode transistors and the second enhancement-mode transistor is stacked vertically relative to one of the first plurality of depletion-mode transistors. A first string selection plug is configured to electrically connect a gate electrode of the first enhancement-mode transistor to a gate electrode of one of the second plurality of depletion-mode transistors. Similarly, a second string selection plug is configured to electrically connect a gate electrode of the second enhancement-mode transistor to a gate electrode of one of the first plurality of depletion-mode transistors.
    • 非易失性存储器件包括第一NAND型EEPROM单元串,其具有在串中串联电连接的第一多个串选择晶体管。 该第一多个串选择晶体管包括第一多个耗尽型晶体管和第一增强型晶体管。 EEPROM单元的第二NAND型串还在其中设置有串联电连接的第二多个串选择晶体管。 第二多个串选择晶体管包括第二多个耗尽型晶体管和第二增强型晶体管。 根据本发明的这些实施例,第一增强型晶体管相对于第二多个耗尽型晶体管中的一个垂直堆叠,并且第二增强型晶体管相对于第一多个耗尽型晶体管之一垂直堆叠 晶体管。 第一串选择插头被配置为将第一增强型晶体管的栅极电连接到第二多个耗尽型晶体管之一的栅电极。 类似地,第二串选择插头被配置为将第二增强型晶体管的栅电极电连接到第一多个耗尽型晶体管之一的栅电极。
    • 9. 发明申请
    • Methods of Forming Charge-Trap Type Non-Volatile Memory Devices
    • 形成电荷陷阱型非易失性存储器件的方法
    • US20100221886A1
    • 2010-09-02
    • US12766272
    • 2010-04-23
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • H01L21/8246
    • H01L27/11568H01L27/105H01L27/11573
    • Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate.
    • 形成非易失性存储器件的方法可以包括在半导体衬底上形成隧道绝缘层,并在隧道绝缘层上形成电荷捕获层。 然后可以形成延伸穿过隧道绝缘层和电荷陷阱层并进入半导体衬底的沟槽,使得电荷陷阱层和隧道绝缘层的部分保留在沟槽的相对侧上。 可以在沟槽中形成器件隔离层,并且可以在器件隔离层上和电荷陷阱层的剩余部分上形成阻挡绝缘层。 可以在阻挡绝缘层上形成栅电极,并且可以对阻挡绝缘层和电荷陷阱层的剩余部分进行图案化以在栅电极和半导体衬底之间提供阻挡绝缘图案和电荷陷阱图案。
    • 10. 发明授权
    • Charge-trap type non-volatile memory devices and related methods
    • 充电陷阱型非易失性存储器件及相关方法
    • US07732856B2
    • 2010-06-08
    • US11724870
    • 2007-03-16
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • Jae-Sung SimJung-Dal ChoiChang-Seok Kang
    • H01L29/792
    • H01L27/11568H01L27/105H01L27/11573
    • Methods of forming a non-volatile memory device may include forming a tunnel insulating layer on a semiconductor substrate and forming a charge-trap layer on the tunnel insulating layer. A trench may then be formed extending through the tunnel insulating layer and the charge-trap layer and into the semiconductor substrate so that portions of the charge-trap layer and the tunnel insulating layers remain on opposite sides of the trench. A device isolation layer may be formed in the trench, and a blocking insulating layer may be formed on the device isolation layer and on remaining portions of the charge-trap layer. A gate electrode may be formed on the blocking insulating layer, and the blocking insulating layer and remaining portions of the charge-trap layer may be patterned to provide a blocking insulating pattern and a charge-trap pattern between the gate electrode and the semiconductor substrate. Related structures are also discussed.
    • 形成非易失性存储器件的方法可以包括在半导体衬底上形成隧道绝缘层,并在隧道绝缘层上形成电荷捕获层。 然后可以形成延伸穿过隧道绝缘层和电荷陷阱层并进入半导体衬底的沟槽,使得电荷陷阱层和隧道绝缘层的部分保留在沟槽的相对侧上。 可以在沟槽中形成器件隔离层,并且可以在器件隔离层上和电荷陷阱层的剩余部分上形成阻挡绝缘层。 可以在阻挡绝缘层上形成栅电极,并且可以对阻挡绝缘层和电荷陷阱层的剩余部分进行图案化以在栅电极和半导体衬底之间提供阻挡绝缘图案和电荷陷阱图案。 还讨论了相关结构。