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1. 发明申请

US20070139657A1 Three-dimensional geometric measurement and analysis system 审中-公开
标题翻译：三维几何测量与分析系统
公开(公告)号：US20070139657A1
公开(公告)日：2007-06-21
申请号：US10589750
申请日：2005-02-25
申请人： Ichirou Ishimaru , Ryoji Hyodo
发明人： Ichirou Ishimaru , Ryoji Hyodo
IPC分类号： G01B11/02
CPC分类号： G01B11/2441
摘要： The present invention intends to provide a measurement system capable of measuring a three-dimensional geometry of a target object over a relatively large area, in a small length of time and by a contact-free method. When a ray of light is cast from a light source onto the target object s and reflected at a certain point on the surface of the target object s, the light produces direct reflection light (zero-order light) and higher-order diffraction light. The zero-order light is guided by a separating optics to a movable reflector of a variable-phase filter 20 while the higher-order diffraction light is guided to a fixed reflector. The two rays of light are reflected by the corresponding reflectors and led to substantially the same point by an interference optics system. At this point, the two rays of light interfere with each other. Under such a condition, when the movable reflector of the variable-phase filter 20 is moved, the strength of the interference light at the imaging point of the interference optics system gradually changes. The position of the movable reflector at the peak point of the interference light depends on the distance between the starting point on the target object s and the movable reflector. Therefore, the position of the starting point can be calculated from the position of the movable reflector at the peak point. By performing such a measurement and calculation process on each point of the image of the target object, one can determine the three-dimensional geometry of the object. Moreover, each point can be analyzed by Fourier-transforming the interferogram of that point into a spectrum.
摘要翻译：本发明旨在提供一种测量系统，该测量系统能够在较短时间内通过相对较大的区域和无接触的方法来测量目标物体的三维几何形状。当光线从光源投射到目标物体上并在目标物体的表面上的某一点反射时，光产生直接反射光（零级光）和高阶衍射光。零级光被分离光学器件引导到可变相位滤波器20的可移动反射器，而高阶衍射光被引导到固定反射器。两束光被相应的反射器反射并通过干涉光学系统导致基本上相同的点。在这一点上，两束光线相互干扰。在这种情况下，当可变相位滤波器20的可移动反射器移动时，干涉光学系统的成像点处的干涉光的强度逐渐变化。可移动反射器在干涉光的峰值处的位置取决于目标物体s上的起点与可移动反射器之间的距离。因此，可以根据可移动反射器在峰值点的位置来计算起点的位置。通过对目标对象的图像的每个点进行这样的测量和计算处理，可以确定对象的三维几何。此外，可以通过将该点的干涉图傅里叶变换成光谱来分析每个点。

2. 发明授权

US07062081B2 Method and system for analyzing circuit pattern defects 失效
标题翻译：分析电路图形缺陷的方法和系统
公开(公告)号：US07062081B2
公开(公告)日：2006-06-13
申请号：US09783604
申请日：2001-02-15
申请人： Atsushi Shimoda , Ichirou Ishimaru , Yuji Takagi , Takuo Tamura , Yuichi Hamamura , Kenji Watanabe , Yasuhiko Ozawa , Seiji Isogai
发明人： Atsushi Shimoda , Ichirou Ishimaru , Yuji Takagi , Takuo Tamura , Yuichi Hamamura , Kenji Watanabe , Yasuhiko Ozawa , Seiji Isogai
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30148 , H01L22/20
摘要： In order to allow critical flaws in an inspected item to be determined early during a production process, the present invention includes the following steps: a step of detecting defects in a production process for the inspected item and storing defect positions; a step of collecting detailed defect information and storing the detailed information in association with defect positions; a step of storing positions at which flaws were generated based on a final inspection of the inspected item; a step of comparing defect positions with positions at which flaws were generated; and a step of classifying and displaying detailed information based on the comparison results.
摘要翻译：为了在生产过程中早期确定检查项目中的关键缺陷，本发明包括以下步骤：检测检查项目的生产过程中的缺陷并存储缺陷位置的步骤; 收集详细缺陷信息并存储与缺陷位置相关联的详细信息的步骤; 基于检查项目的最终检查来存储产生缺陷的位置的步骤; 将缺陷位置与产生缺陷的位置进行比较的步骤; 并根据比较结果对详细信息进行分类和显示。

3. 发明授权

US07352890B2 Method for analyzing circuit pattern defects and a system thereof 失效
标题翻译：电路图形缺陷分析方法及其系统
公开(公告)号：US07352890B2
公开(公告)日：2008-04-01
申请号：US11356210
申请日：2006-02-17
申请人： Atsushi Shimoda , Ichirou Ishimaru , Yuji Takagi , Takuo Tamura , Yuichi Hamamura , Kenji Watanabe , Yasuhiko Ozawa , Seiji Isogai
发明人： Atsushi Shimoda , Ichirou Ishimaru , Yuji Takagi , Takuo Tamura , Yuichi Hamamura , Kenji Watanabe , Yasuhiko Ozawa , Seiji Isogai
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30148 , H01L22/20
摘要： A system for analyzing defects in electronic circuit patterns, including: comparing position information of structural defects with position information of electrical faults and extracting corroborated defects having common position information between the structural defects and electrical faults; classifying images of extracted corroborated defects into critical defect images and non-critical defect images based on a pre-stored classification rule which defines critical and non-critical defects by referring to images of defects, position information of defects, and results of performing an electronic test; modifying the pre-stored classification rule by correcting classification of classified defect images displayed on the screen; and repeating the operations for each subsequent object, wherein for each present object under inspection, using a modified pre-stored classification rule with respect to a previous object, as the pre-stored classification rule for the operations with respect to the present object.
摘要翻译：一种用于分析电子电路图案缺陷的系统，包括：将结构缺陷的位置信息与电气故障的位置信息进行比较，并提取在结构缺陷和电气故障之间具有共同位置信息的证实缺陷; 基于预先存储的分类规则将提取的确证缺陷的图像分类为关键缺陷图像和非关键缺陷图像，该分类规则通过参考缺陷图像，缺陷位置信息和执行电子化的结果来定义关键和非关键缺陷测试; 通过校正显示在屏幕上的分类缺陷图像的分类来修改预先存储的分类规则; 并对每个后续对象重复操作，其中对于被检查的每个当前对象，使用关于先前对象的经修改的预先存储的分类规则作为关于本对象的操作的预先存储的分类规则。

4. 发明申请

US20060140472A1 Method for analyzing circuit pattern defects and a system thereof 失效
标题翻译：电路图形缺陷分析方法及其系统
公开(公告)号：US20060140472A1
公开(公告)日：2006-06-29
申请号：US11356210
申请日：2006-02-17
申请人： Atsushi Shimoda , Ichirou Ishimaru , Yuji Takagi , Takuo Tamura , Yuichi Hamamura , Kenji Watanabe , Yasuhiko Ozawa , Seiji Isogai
发明人： Atsushi Shimoda , Ichirou Ishimaru , Yuji Takagi , Takuo Tamura , Yuichi Hamamura , Kenji Watanabe , Yasuhiko Ozawa , Seiji Isogai
IPC分类号： G06K9/00
CPC分类号： G06T7/0004 , G06T2207/30148 , H01L22/20
摘要： A system for analyzing defects in electronic circuit patterns, including: comparing position information of structural defects with position information of electrical faults and extracting corroborated defects having common position information between the structural defects and electrical faults; classifying images of extracted corroborated defects into critical defect images and non-critical defect images based on a pre-stored classification rule which defines critical and non-critical defects by referring to images of defects, position information of defects, and results of performing an electronic test; modifying the pre-stored classification rule by correcting classification of classified defect images displayed on the screen; and repeating the operations for each subsequent object, wherein for each present object under inspection, using a modified pre-stored classification rule with respect to a previous object, as the pre-stored classification rule for the operations with respect to the present object.
摘要翻译：一种用于分析电子电路图案缺陷的系统，包括：将结构缺陷的位置信息与电气故障的位置信息进行比较，并提取在结构缺陷和电气故障之间具有共同位置信息的证实缺陷; 基于预先存储的分类规则将提取的确证缺陷的图像分类为关键缺陷图像和非关键缺陷图像，该分类规则通过参考缺陷图像，缺陷位置信息和执行电子化的结果来定义关键和非关键缺陷测试; 通过校正显示在屏幕上的分类缺陷图像的分类来修改预先存储的分类规则; 并对每个后续对象重复操作，其中对于被检查的每个当前对象，使用关于先前对象的经修改的预先存储的分类规则作为关于本对象的操作的预先存储的分类规则。

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