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1. 发明申请

US20070001296A1 BUMP FOR OVERHANG DEVICE 审中-公开
标题翻译：超霸设备BUMP
公开(公告)号：US20070001296A1
公开(公告)日：2007-01-04
申请号：US11469307
申请日：2006-08-31
申请人： Hun Teak Lee , Jong Kook Kim , ChulSik Kim , Ki Youn Jang , Keon Teak Kang , Hyung Jun Jeon
发明人： Hun Teak Lee , Jong Kook Kim , ChulSik Kim , Ki Youn Jang , Keon Teak Kang , Hyung Jun Jeon
IPC分类号： H01L23/34
CPC分类号： H01L25/0657 , H01L23/562 , H01L24/10 , H01L24/13 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/81 , H01L24/83 , H01L24/85 , H01L2224/05554 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/78301 , H01L2224/81801 , H01L2224/83856 , H01L2224/85 , H01L2224/92247 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/00013 , H01L2924/00014 , H01L2924/07802 , H01L2924/10161 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/3512 , H01L2924/00 , H01L2924/014 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package system is provided including forming a support platform, mounting a first device over the support platform, forming a bump on the support platform, and mounting a second device on the first device and the bump.
摘要翻译：提供了一种半导体封装系统，包括形成支撑平台，将第一装置安装在支撑平台上，在支撑平台上形成凸块，以及将第二装置安装在第一装置和凸块上。

2. 发明申请

US20180076103A1 FAN OUT WAFER LEVEL PACKAGE TYPE SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE TYPE SEMICONDUCTOR PACKAGE INCLUDING THE SAME 审中-公开
公开(公告)号：US20180076103A1
公开(公告)日：2018-03-15
申请号：US15629072
申请日：2017-06-21
申请人： Hyung-jun JEON , Nae-in LEE , Byung-lyul PARK
发明人： Hyung-jun JEON , Nae-in LEE , Byung-lyul PARK
IPC分类号： H01L23/045 , H01L23/047 , H01L25/10
CPC分类号： H01L23/045 , H01L23/047 , H01L23/3128 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L25/105 , H01L2224/04105 , H01L2224/12105 , H01L2225/1029 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/15311 , H01L2924/3511
摘要： A semiconductor package of a package on package type includes a lower package including a printed circuit board (PCB) substrate including a plurality of base layers and a cavity penetrating the plurality of base layers, a first semiconductor chip in the cavity. a redistribution structure on a first surface of the PCB substrate and on an active surface of the first semiconductor chip, a first cover layer covering the redistribution structure, and the second cover layer covering a second surface of the PCB substrate and an inactive surface of the first semiconductor chip, and an upper package on the second cover layer of the lower package and including a second semiconductor chip.

3. 发明授权

US08742930B2 Gate system 失效
标题翻译：门系统
公开(公告)号：US08742930B2
公开(公告)日：2014-06-03
申请号：US13046604
申请日：2011-03-11
申请人： Jin Kuk Hong , Jeong Ki Ryoo , Jae Yul Choo , Hyung Jun Jeon
发明人： Jin Kuk Hong , Jeong Ki Ryoo , Jae Yul Choo , Hyung Jun Jeon
IPC分类号： G08B13/14 , G05B19/00
CPC分类号： G08B13/2417 , G08B13/2474 , G08B13/248
摘要： Disclosed is a gate system arranged on two gate frames and detects a tag passing between the two gate frames, the gate system including at least two gate frames that are vertically arranged facing with each other; at least two antenna units that are arranged on the at least two gate frames, respectively; and a reader that is arranged on each of the at least two gate frames and enables the at least two antenna units to emit electromagnetic wave to an article passing between the at least two gate frames using a predetermined frequency signal, and obtains information stored in a tag using a signal that the at least two antenna units receives from the at least two antenna units.
摘要翻译：公开了一种设置在两个门框上的门系统，用于检测在两个门框之间通过的标签，该门系统包括彼此垂直排列的至少两个门框; 分别布置在所述至少两个门框上的至少两个天线单元; 以及读取器，其布置在所述至少两个门帧中的每一个上，并且使得所述至少两个天线单元能够使用预定频率信号向通过所述至少两个门帧之间的物品发射电磁波，并获得存储在所述至少两个门帧中的信息标签，使用至少两个天线单元从至少两个天线单元接收的信号。

4. 发明授权

US08451125B2 Reader based on RFID 失效
标题翻译：基于RFID的读卡器
公开(公告)号：US08451125B2
公开(公告)日：2013-05-28
申请号：US12907784
申请日：2010-10-19
申请人： Jin Kuk Hong , Jeong Ki Ryoo , Jae Yul Choo , Hyung Jun Jeon
发明人： Jin Kuk Hong , Jeong Ki Ryoo , Jae Yul Choo , Hyung Jun Jeon
IPC分类号： G08B13/14
CPC分类号： G06K7/0008 , A47F9/04 , G06K7/10346 , G06K7/10356 , G06K19/067 , G06K19/0672 , H01Q1/2216 , H01Q21/061 , H01Q21/065 , H01Q21/225
摘要： Disclosed is an RFID-based reader configured to allow a UHF band RFID reader unit to recognize an RFID tag in a short distance, and to minimize an erroneous recognition, the reader including a gate frame discretely installed at both sides of an entrance and exit, a parabolic surface type reflective plate perpendicularly installed inside of the gate frame, an array antenna arranged on the reflective plate for receiving a tag information transmitted from an RFID tag, and an RFID reader unit for controlling an operation of the array antenna and converting the tag information received from the array antenna to a tag data.
摘要翻译：公开了一种基于RFID的读取器，其被配置为允许UHF频带RFID读取器单元在短距离内识别RFID标签，并且为了最小化错误识别，读取器包括离散地安装在入口和出口两侧的门框，垂直安装在门框内部的抛物面型反射板，布置在反射板上的阵列天线，用于接收从RFID标签发送的标签信息;以及RFID读取单元，用于控制阵列天线的操作和转换标签从阵列天线接收的信息到标签数据。

5. 发明申请

US20110298107A1 SHIELDED STACKED INTEGRATED CIRCUIT PACKAGING SYSTEM AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：屏蔽堆叠式集成电路包装系统及其制造方法
公开(公告)号：US20110298107A1
公开(公告)日：2011-12-08
申请号：US13211698
申请日：2011-08-17
申请人： Ki Youn Jang , YoungMin Kim , Hyung Jun Jeon
发明人： Ki Youn Jang , YoungMin Kim , Hyung Jun Jeon
IPC分类号： H01L25/065 , H01L21/98
CPC分类号： H01L23/3128 , H01L23/552 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06575 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/1627 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A method of manufacture of a shielded stacked integrated circuit packaging system includes: forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.
摘要翻译：一种屏蔽层叠集成电路封装系统的制造方法，包括：形成具有第一基板和第一集成电路管芯的第一集成电路结构; 将屏蔽件安装在所述第一基板和所述第一集成电路管芯上; 在所述屏蔽上安装具有第二基板和第二集成电路管芯的第二集成电路结构; 以及形成用于覆盖所述第一集成电路管芯，所述屏蔽件和所述第二集成电路结构的封装封装。

6. 发明申请

US20110227701A1 GATE SYSTEM 失效
标题翻译：门系统
公开(公告)号：US20110227701A1
公开(公告)日：2011-09-22
申请号：US13046604
申请日：2011-03-11
申请人： Jin Kuk HONG , Jeong Ki Ryoo , Jae Yul Choo , Hyung Jun Jeon
发明人： Jin Kuk HONG , Jeong Ki Ryoo , Jae Yul Choo , Hyung Jun Jeon
IPC分类号： H04Q5/22
CPC分类号： G08B13/2417 , G08B13/2474 , G08B13/248
摘要： Disclosed is a gate system arranged on two gate frames and detects a tag passing between the two gate frames, the gate system including at least two gate frames that are vertically arranged facing with each other; at least two antenna units that are arranged on the at least two gate frames, respectively; and a reader that is arranged on each of the at least two gate frames and enables the at least two antenna units to emit electromagnetic wave to an article passing between the at least two gate frames using a predetermined frequency signal, and obtains information stored in a tag using a signal that the at least two antenna units receives from the at least two antenna units.
摘要翻译：公开了一种设置在两个门框上的门系统，用于检测在两个门框之间通过的标签，该门系统包括彼此垂直排列的至少两个门框; 分别布置在所述至少两个门框上的至少两个天线单元; 以及读取器，其布置在所述至少两个门帧中的每一个上，并且使得所述至少两个天线单元能够使用预定频率信号向通过所述至少两个门帧之间的物品发射电磁波，并获得存储在所述至少两个门帧中的信息标签，使用至少两个天线单元从至少两个天线单元接收的信号。

7. 发明申请

US20110216815A1 METHOD AND APPARATUS FOR DETECTING OFFSET SIGNAL OF TRANSMISSION LEAKAGE SIGNAL IN RF TRANSCEIVER 失效
标题翻译：用于检测射频收发器中传输泄漏信号偏移信号的方法和装置
公开(公告)号：US20110216815A1
公开(公告)日：2011-09-08
申请号：US13039229
申请日：2011-03-02
申请人： Heon Soo CHOI , Chang Su Choi , Hyung Jun Jeon , Yeong Chan Kim
发明人： Heon Soo CHOI , Chang Su Choi , Hyung Jun Jeon , Yeong Chan Kim
IPC分类号： H04B1/38
CPC分类号： H04B1/525
摘要： Disclosed is an RF transceiver in which transmission and reception are simultaneously performed, wherein a magnitude of a transmission leakage signal mixed into a receiving signal is measured, the maximum and minimum scopes on I/Q vector phase-plane in which an offset vector exists is set using the measured magnitude of the transmission leakage signal, the offset vector offsetting the transmission leakage signal as much as possible, a detection area in which the offset vector exists is determined in the set scope, and the offset vector is detected.
摘要翻译：公开了一种RF收发器，其中同时执行发送和接收，其中测量混合到接收信号中的发送泄漏信号的幅度，存在偏移矢量的I / Q向量相位面上的最大和最小范围是使用测量的传输泄漏信号的大小设置偏移矢量尽可能多地偏移传输泄漏信号，在设定的范围内确定存在偏移矢量的检测区域，并检测偏移矢量。

8. 发明授权

US07741726B2 Integrated circuit underfill package system 有权
标题翻译：集成电路底层封装系统
公开(公告)号：US07741726B2
公开(公告)日：2010-06-22
申请号：US12336141
申请日：2008-12-16
申请人： Hyung Jun Jeon , Ki Youn Jang , Dae-Wook Yang
发明人： Hyung Jun Jeon , Ki Youn Jang , Dae-Wook Yang
IPC分类号： H01L23/29 , H01L23/02
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
摘要翻译：一种集成电路底部填充封装系统，包括提供具有分配端口的衬底，将第一集成电路管芯安装在衬底上，以及当衬底和第一集成电路管芯反相时，向分注端口提供底部填充物。

9. 发明授权

US07537962B2 Method of fabricating a shielded stacked integrated circuit package system 有权
标题翻译：制造屏蔽层叠集成电路封装系统的方法
公开(公告)号：US07537962B2
公开(公告)日：2009-05-26
申请号：US11615922
申请日：2006-12-22
申请人： Ki Youn Jang , YoungMin Kim , Hyung Jun Jeon
发明人： Ki Youn Jang , YoungMin Kim , Hyung Jun Jeon
IPC分类号： H01L21/00 , H01L23/02 , H05K1/14
CPC分类号： H01L23/3128 , H01L23/552 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/32225 , H01L2224/45014 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06527 , H01L2225/06575 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/1627 , H01L2924/181 , H01L2924/19107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A shielded stacked integrated circuit package system is provided including forming a first integrated circuit structure having a first substrate and a first integrated circuit die; mounting a shield over the first substrate and the first integrated circuit die; mounting a second integrated circuit structure having a second substrate and a second integrated circuit die over the shield; and forming a package encapsulation for covering the first integrated circuit die, the shield, and the second integrated circuit structure.
摘要翻译：提供一种屏蔽堆叠集成电路封装系统，包括形成具有第一基板和第一集成电路管芯的第一集成电路结构; 将屏蔽件安装在所述第一基板和所述第一集成电路管芯上; 在所述屏蔽上安装具有第二基板和第二集成电路管芯的第二集成电路结构; 以及形成用于覆盖所述第一集成电路管芯，所述屏蔽件和所述第二集成电路结构的封装封装。

10. 发明授权

US07485502B2 Integrated circuit underfill package system 有权
标题翻译：集成电路底层封装系统
公开(公告)号：US07485502B2
公开(公告)日：2009-02-03
申请号：US11307315
申请日：2006-01-31
申请人： Hyung Jun Jeon , Ki Youn Jang , Dae-Wook Yang
发明人： Hyung Jun Jeon , Ki Youn Jang , Dae-Wook Yang
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L21/563 , H01L23/13 , H01L23/3128 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73203 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2924/00014 , H01L2924/14 , H01L2924/15151 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19105 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit underfill package system including providing a substrate having a dispense port, attaching a first integrated circuit die on the substrate, and supplying an underfill to the dispense port when the substrate and the first integrated circuit die are inverted.
摘要翻译：一种集成电路底部填充封装系统，包括提供具有分配端口的衬底，将第一集成电路管芯安装在衬底上，以及当衬底和第一集成电路管芯反相时，向分注端口提供底部填充物。

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