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1. 发明授权

US09412908B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US09412908B2
公开(公告)日：2016-08-09
申请号：US13548822
申请日：2012-07-13
申请人： Hwan Hee Jeong
发明人： Hwan Hee Jeong
IPC分类号： H01L33/00 , H01L33/40 , H01L33/62 , H01L33/38
CPC分类号： H01L33/405 , H01L33/0079 , H01L33/38 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： Disclosed are a semiconductor light emitting device. The semiconductor light emitting device includes a plurality of compound semiconductor layers including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer; a pad on the plurality of compound semiconductor layers; an electrode layer under the plurality of compound semiconductor layers; and a supporting member disposed under the plurality of compound semiconductor layers and corresponding to the pad.
摘要翻译：公开了一种半导体发光器件。半导体发光器件包括多个化合物半导体层，包括第一导电半导体层，有源层和第二导电半导体层; 多个化合物半导体层上的焊盘; 多个化合物半导体层下方的电极层; 以及配置在所述多个化合物半导体层下方并对应于所述垫的支撑构件。

2. 发明授权

US09281341B2 Light emitting device and fabricating method thereof 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US09281341B2
公开(公告)日：2016-03-08
申请号：US13358266
申请日：2012-01-25
申请人： Hwan Hee Jeong
发明人： Hwan Hee Jeong
IPC分类号： H01L33/02 , H01L27/15 , H01L27/12
CPC分类号： H01L27/15 , H01L27/1266 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Disclosed is a light emitting device including a support substrate, a transistor unit disposed at one side of the upper surface of the support substrate, a light emitting device unit disposed at the other side of the upper surface of the support substrate, and an insulating layer disposed between the transistor unit and the light emitting device unit and between the support substrate and the transistor unit and isolating the transistor unit from the light emitting device unit.
摘要翻译：公开了一种发光器件，包括支撑衬底，设置在支撑衬底的上表面的一侧的晶体管单元，设置在支撑衬底的上表面另一侧的发光器件单元，以及绝缘层设置在晶体管单元和发光器件单元之间以及支撑衬底和晶体管单元之间，并将晶体管单元与发光器件单元隔离。

3. 发明授权

US08916883B2 Light emitting device and method for fabricating the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08916883B2
公开(公告)日：2014-12-23
申请号：US13215693
申请日：2011-08-23
申请人： Hwan Hee Jeong , Sang Youl Lee
发明人： Hwan Hee Jeong , Sang Youl Lee
IPC分类号： H01L33/60 , H01L33/38 , F21K99/00 , F21Y101/02 , H01L33/00 , H01L33/22 , H01L33/40
CPC分类号： H01L33/38 , F21K9/00 , F21K9/68 , F21Y2115/10 , H01L33/0079 , H01L33/22 , H01L33/405 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer; a reflective layer formed under the light emitting structure; and a transparent supporting layer formed between the light emitting structure and the reflective layer, to emit a light generated from the active layer; and a conductive layer formed under the reflective layer, to surround the reflective layer.
摘要翻译：发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层; 形成在发光结构下面的反射层; 以及形成在所述发光结构和所述反射层之间的透明支撑层，以发射从所述有源层产生的光; 以及形成在所述反射层下方的导电层，以围绕所述反射层。

4. 发明授权

US08901597B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08901597B2
公开(公告)日：2014-12-02
申请号：US13567446
申请日：2012-08-06
申请人： Hwan Hee Jeong
发明人： Hwan Hee Jeong
IPC分类号： H01L33/00 , H01L33/44 , H01L33/46 , H01L33/40
CPC分类号： H01L33/54 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/12 , H01L33/405 , H01L33/44 , H01L33/46 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer, an electrode electrically connected to the first conductive semiconductor layer, a reflective layer under the second conductive semiconductor layer, a protective layer disposed around a lower surface of the second conductive semiconductor layer, and a buffer layer disposed on at least one of top and lower surfaces of the protective layer.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和介于第一导电半导体层和第二导电半导体层之间的有源层，电连接到第一导电半导体层，在第二导电半导体层下面的反射层，设置在第二导电半导体层的下表面周围的保护层和设置在保护层的顶表面和下表面中的至少一个上的缓冲层。

5. 发明授权

US08884506B2 Light emitting device capable of preventing breakage during high drive voltage and light emitting device package including the same 有权
标题翻译：能够防止高驱动电压下的断线的发光装置和包含该发光装置的发光装置封装
公开(公告)号：US08884506B2
公开(公告)日：2014-11-11
申请号：US13402619
申请日：2012-02-22
申请人： Hwan Hee Jeong
发明人： Hwan Hee Jeong
IPC分类号： F21V21/00 , H01L33/60 , H01L27/15 , H01L33/62
CPC分类号： H01L27/156 , H01L33/62 , H01L2224/48091 , H01L2924/12032 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： A light emitting device includes a light emitting structure divided into a plurality of light emitting cells and a boundary region, the light emitting cells including a first conductive type semiconductor layer, an active layer and a second conductive type semiconductor layer, respectively; a first electrode disposed on each of the light emitting cells; first conductive layers disposed under the light emitting cells; at least one second conductive layer disposed under the first conductive layers; a first insulation layer disposed between each of the first conductive layers, and between the first conductive layers and the at least one second conductive layer; and a connecting electrode connecting the first electrode on one light emitting cell with the at least one second conductive layer under another light emitting cell. The at least one second conductive layer is connected with one of the first conductive layers through the first insulation layer.
摘要翻译：发光器件包括分为多个发光单元和边界区域的发光结构，所述发光单元分别包括第一导电型半导体层，有源层和第二导电型半导体层; 设置在每个所述发光单元上的第一电极; 设置在发光单元下方的第一导电层; 设置在所述第一导电层下方的至少一个第二导电层; 设置在每个第一导电层之间以及在第一导电层和至少一个第二导电层之间的第一绝缘层; 以及将一个发光单元上的第一电极与另一个发光单元下的至少一个第二导电层连接的连接电极。所述至少一个第二导电层通过所述第一绝缘层与所述第一导电层之一连接。

6. 发明授权

US08847268B2 Light emitting device and light emitting device package 有权
标题翻译：发光器件和发光器件封装
公开(公告)号：US08847268B2
公开(公告)日：2014-09-30
申请号：US13014390
申请日：2011-01-26
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/00 , H01L33/36 , H01L33/40 , H01L33/44 , H01L33/42 , H01L33/22 , H01L33/10
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.
摘要翻译：公开了一种发光器件和发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层上的有源层和有源层上的第二导电半导体层，与第一导电半导体层的顶表面接触的粘合层与第一导电半导体的顶表面和粘合剂层的顶表面接触的第一电极和与第二导电半导体层接触的第二电极，其中与第一电极接触的粘合剂层与第二电极间隔开。

7. 发明授权

US08835972B2 Light emitting device, method for fabricating the light emitting device, light emitting device package and lighting system 有权
标题翻译：发光器件，制造发光器件的方法，发光器件封装和照明系统
公开(公告)号：US08835972B2
公开(公告)日：2014-09-16
申请号：US14070740
申请日：2013-11-04
申请人： Hwan Hee Jeong
发明人： Hwan Hee Jeong
IPC分类号： H01L33/00 , H01L33/38 , H01L33/40 , H01L33/44 , H01L33/22
CPC分类号： H01L33/38 , H01L33/0079 , H01L33/22 , H01L33/40 , H01L33/405 , H01L33/44 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2933/0016 , H01L2924/00014 , H01L2924/00
摘要： Provided is a light emitting device. The light emitting device includes a light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode electrically connected to the first conductive type semiconductor layer, an insulating support member under the light emitting structure layer, and a plurality of conductive layers between the light emitting structure layer and the insulating support member. At least one of the plurality of conductive layers has a width greater than that of the light emitting structure layer and includes a contact part disposed further outward from a sidewall of the light emitting structure layer.
摘要翻译：提供了一种发光装置。发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构层，第一电极电连接到第一导电类型半导体层，发光结构层下面的绝缘支撑构件，以及在发光结构层和绝缘支撑构件之间的多个导电层。多个导电层中的至少一个具有比发光结构层的宽度大的宽度，并且包括从发光结构层的侧壁进一步向外设置的接触部。

8. 发明申请

US20140231833A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20140231833A1
公开(公告)日：2014-08-21
申请号：US14171191
申请日：2014-02-03
申请人： Hwan Hee JEONG
发明人： Hwan Hee JEONG
IPC分类号： H01L33/36 , H01L33/08
CPC分类号： H01L33/36 , H01L27/156 , H01L33/08 , H01L33/382 , H01L2224/48091 , H01L2924/00014
摘要： A first light emitting structure includes a first semiconductor layer, an active layer, and a second semiconductor layer. A second light emitting structure includes a third semiconductor layer, an active layer, and a fourth semiconductor layer. A first electrode and a second electrode connect to the first semiconductor layer, and the second semiconductor layer, respectively. A third electrode and a fourth electrode connect to the third semiconductor layer, and the fourth semiconductor layer, respectively. A first contact portion includes a first region connected to the first electrode and a second region making contact with a top surface of the first semiconductor layer, and a second contact portion connects to the second and third electrodes. A third contact portion includes a first region connected to the third electrode and a second region making contact with a top surface of the third semiconductor layer.
摘要翻译：第一发光结构包括第一半导体层，有源层和第二半导体层。第二发光结构包括第三半导体层，有源层和第四半导体层。第一电极和第二电极分别连接到第一半导体层和第二半导体层。第三电极和第四电极分别连接到第三半导体层和第四半导体层。第一接触部分包括连接到第一电极的第一区域和与第一半导体层的顶表面接触的第二区域，以及连接到第二和第三电极的第二接触部分。第三接触部分包括连接到第三电极的第一区域和与第三半导体层的顶表面接触的第二区域。

9. 发明授权

US08809895B2 Light emitting device and method of fabricating the same 有权
标题翻译：发光元件及其制造方法
公开(公告)号：US08809895B2
公开(公告)日：2014-08-19
申请号：US13175549
申请日：2011-07-01
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji hyung Moon , Se Yeon Jung , Tae-Yeon Seong
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji hyung Moon , Se Yeon Jung , Tae-Yeon Seong
IPC分类号： H01L33/14 , H01L33/46 , H01L33/64
CPC分类号： H01L33/14 , H01L33/16 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Provided are a light emitting device and a method of fabricating the same. The light emitting device includes a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, the active layer being formed of a semiconductor material. Also, the light emitting device further includes a current spreading layer comprising a plurality of carbon nanotube bundles physically connected to each other on one of the first and second conductive type semiconductor layers.
摘要翻译：提供一种发光器件及其制造方法。发光器件包括第一导电类型半导体层，第二导电类型半导体层和在第一导电类型半导体层和第二导电类型半导体层之间的有源层，有源层由半导体材料形成。此外，发光器件还包括电流扩展层，其包括在第一和第二导电类型半导体层中的一个上彼此物理连接的多个碳纳米管束。

10. 发明授权

US08723203B2 Light emitting device, electrode structure, light emitting device package, and lighting system 有权
标题翻译：发光器件，电极结构，发光器件封装和照明系统
公开(公告)号：US08723203B2
公开(公告)日：2014-05-13
申请号：US13032304
申请日：2011-02-22
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L33/58
CPC分类号： H01L33/38 , G02B6/0073 , H01L33/40 , H01L33/42 , H01L33/44 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, an electrode structure, a light emitting device package, and a lighting system. The light emitting device includes a conductive layer, an electrode, a light emitting structure layer disposed between the electrode and the conductive layer and comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, and a light guide layer between the first semiconductor layer and the electrode.
摘要翻译：提供发光器件，电极结构，发光器件封装和照明系统。发光器件包括导电层，电极，设置在电极和导电层之间的发光结构层，并且包括在第一半导体层和第二半导体之间的第一半导体层，第二半导体层和有源层层和在第一半导体层和电极之间的导光层。

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