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    • 8. 发明申请
    • Methods of manufacturing a thin film including hafnium titanium oxide and methods of manufacturing a semiconductor device including the same
    • 制造包括铪钛氧化物的薄膜的方法及其制造方法
    • US20060035405A1
    • 2006-02-16
    • US11191423
    • 2005-07-28
    • Hong-Bae ParkYu-Gyun ShinSang-Bom Kang
    • Hong-Bae ParkYu-Gyun ShinSang-Bom Kang
    • H01L21/16
    • H01L21/02194C23C16/405C23C16/45529C23C16/45531H01L21/0228H01L21/28194H01L21/3141H01L21/31604H01L21/31645H01L29/513H01L29/517
    • The present invention can provide methods of manufacturing a thin film including hafnium titanium oxide. The methods can include introducing a first reactant including a hafnium precursor onto a substrate; chemisorbing a first portion of the first reactant to the substrate, and physisorbing a second portion of the first reactant to the substrate and the chemisorbed first portion of the first reactant; providing a first oxidant onto the substrate; forming a first thin film including hafnium oxide on the substrate; introducing a second reactant including a titanium precursor onto the first thin film; chemisorbing a first portion of the second reactant to the first thin film, and physisorbing a second portion of the second reactant to the first thin film and the chemisorbed first portion of the second reactant; providing a second oxidant onto the first thin film; and forming a second thin film including titanium oxide on the first thin film. The present invention can further provide methods of manufacturing a gate structure and a capacitor.
    • 本发明可以提供制造包括铪钛氧化物的薄膜的方法。 所述方法可以包括将包含铪前体的第一反应物引入到基底上; 将所述第一反应物的第一部分化学吸附至所述基底,以及将所述第一反应物的第二部分物理吸附至所述基底和所述第一反应物的化学吸附的第一部分; 在衬底上提供第一氧化剂; 在基板上形成包括氧化铪的第一薄膜; 将包含钛前体的第二反应物引入到所述第一薄膜上; 将所述第二反应物的第一部分化学吸附到所述第一薄膜,以及将所述第二反应物的第二部分物理吸附到所述第一薄膜和所述第二反应物的化学吸附的第一部分; 在第一薄膜上提供第二氧化剂; 以及在所述第一薄膜上形成包括氧化钛的第二薄膜。 本发明还可以提供制造栅极结构和电容器的方法。
    • 9. 发明申请
    • Methods of forming a thin film structure, and a gate structure and a capacitor including the thin film structure
    • 形成薄膜结构的方法以及包括薄膜结构的栅极结构和电容器
    • US20060013946A1
    • 2006-01-19
    • US11182893
    • 2005-07-15
    • Hong-Bae ParkSang-Bom KangBeom-Jun JinYu-Gyun Shin
    • Hong-Bae ParkSang-Bom KangBeom-Jun JinYu-Gyun Shin
    • C23C16/00B05D5/12
    • H01L21/02148C23C16/401C23C16/45531C23C16/45553H01L21/0228H01L21/28194H01L21/3141H01L21/31616H01L21/31645H01L29/517
    • A thin film structure is formed that includes hafnium silicon oxide using an atomic layer deposition process. A first reactant including tetrakis ethyl methyl amino hafnium (TEMAH) is introduced onto a substrate. A first portion of the first reactant is chemisorbed to the substrate, whereas a second portion of the first reactant is physorbed to the first portion of the first reactant. A first oxidant is provided onto the substrate. A first thin film including hafnium oxide is formed on the substrate by chemically reacting the first oxidant with the first portion of the first reactant. A second reactant including amino propyl tri ethoxy silane (APTES) is introduced onto the first thin film. A first portion of the second reactant is chemisorbed to the first thin film, whereas a second portion of the second reactant is physorbed to the first portion of the second reactant. A second oxidant is provided onto the first thin film. A second thin film including silicon oxide is formed on the first thin film by chemically reacting the second oxidant with the first portion of the second reactant.
    • 使用原子层沉积工艺形成包括氧化铪的薄膜结构。 将包含四乙基甲基氨基铪(TEMAH)的第一反应物引入到基材上。 第一反应物的第一部分被化学吸附到基底上,而第一反应物的第二部分被物理吸附到第一反应物的第一部分。 第一氧化剂被提供到基底上。 通过使第一氧化剂与第一反应物的第一部分发生化学反应,在衬底上形成包括氧化铪的第一薄膜。 将包含氨基丙基三乙氧基硅烷(APTES)的第二反应物引入到第一薄膜上。 第二反应物的第一部分被化学吸附到第一薄膜,而第二反应物的第二部分被物理吸附到第二反应物的第一部分。 在第一薄膜上提供第二氧化剂。 通过使第二氧化剂与第二反应物的第一部分化学反应,在第一薄膜上形成包括氧化硅的第二薄膜。