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1. 发明授权

US5113274A Matrix-type color liquid crystal display device 失效
标题翻译：矩阵型彩色液晶显示装置
公开(公告)号：US5113274A
公开(公告)日：1992-05-12
申请号：US362942
申请日：1989-06-08
申请人： Seiki Takahashi , Hayato Takasago
发明人： Seiki Takahashi , Hayato Takasago
IPC分类号： H04N5/66 , G09G3/36 , H04N9/12 , H04N9/30
CPC分类号： G09G3/3607
摘要： A matrix-type color liquid crystal display device comprises display units each comprising each one of red (R), green (G) and blue (B) color pixels arranged in such a manner that R and B pixels on opposite sides of each G pixel belong also to adjacent display units. The R and B signals for that display unit to which the G pixel between R and B pixels of interest belongs are appropriately modified before they are applied to the R and B pixels, whereby the number of required pixels can be reduced.
摘要翻译：矩阵型彩色液晶显示装置包括显示单元，每个显示单元包括红色（R），绿色（G）和蓝色（B））彩色像素中的每一个，排列方式使得每个G像素的相对侧上的R和B像素也属于相邻的显示单元。在将R和B像素应用于R和B像素之前，适当地修改感兴趣的R和B像素之间的G像素所属的显示单元的R和B信号，从而可以减少所需像素的数量。

2. 发明授权

US4993148A Method of manufacturing a circuit board 失效
标题翻译：制造电路板的方法
公开(公告)号：US4993148A
公开(公告)日：1991-02-19
申请号：US406401
申请日：1989-09-12
申请人： Kohei Adachi , Mitsuyuki Takada , Atsushi Endo , Eishi Gofuku , Hayato Takasago
发明人： Kohei Adachi , Mitsuyuki Takada , Atsushi Endo , Eishi Gofuku , Hayato Takasago
IPC分类号： H01L21/58 , H01L21/60 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/10 , H05K3/46
CPC分类号： H01L24/32 , H01L23/142 , H01L23/3736 , H01L24/29 , H01L24/48 , H01L24/83 , H05K1/021 , H01L2224/05644 , H01L2224/2919 , H01L2224/32013 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48644 , H01L2224/73265 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/20752 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K2201/0154 , H05K2201/09745 , H05K2203/049 , H05K3/108 , H05K3/4644 , Y10T29/4913
摘要： A method is provided for forming a circuit board which comprises a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.
摘要翻译：提供一种用于形成电路板的方法，该电路板包括铜板和形成在铜板上的感光聚酰亚胺树脂的绝缘层，绝缘层留下铜板的要安装LSI的表面的暴露部分。在对铜板的露出面施加Au电镀之后，LSI被固定地安装。具有接合焊盘的连接图案通过在绝缘层上的铜电镀形成。接合焊盘和LSI通过Au引线接合在施加在接合焊盘上的Au电镀上连接。

3. 发明授权

US4898805A Method for fabricating hybrid integrated circuit 失效
标题翻译：制造混合集成电路的方法
公开(公告)号：US4898805A
公开(公告)日：1990-02-06
申请号：US224175
申请日：1988-07-25
申请人： Mitsuyuki Takada , Hayato Takasago , Yoichiro Onishi
发明人： Mitsuyuki Takada , Hayato Takasago , Yoichiro Onishi
IPC分类号： H01B1/16 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/18 , H05K3/24 , H05K3/46
CPC分类号： H05K3/246 , H01L21/4846 , H01L21/4867 , H05K1/0306 , H05K1/092 , H05K2201/0347 , H05K3/184 , H05K3/4644
摘要： A method for fabricating a hybrid IC substrate comprises the steps of baking a conductor of a first group on an insulating ceramic substrate, forming an insulating porous active layer including a glass component and a small amount of a metal component having a catalytic action for electroless plating, forming a resist pattern on the active layer by using a photomask, and forming a conductor of a second group by electroless plating on a portion of the active layer not covered with the resist, whereby a portion of the active layer sandwiched between the conductors of the first and second groups is rendered conductive and a portion of the active layer in direct contact with the insulating substrate is maintained as an insulator.
摘要翻译：一种制造混合IC基板的方法包括以下步骤：在绝缘陶瓷基板上烘烤第一组的导体，形成包括玻璃成分和少量金属组分的绝缘多孔活性层，所述金属组分具有用于化学镀的催化作用通过使用光掩模在有源层上形成抗蚀剂图案，并且通过在未被抗蚀剂覆盖的有源层的一部分上通过化学镀形成第二组的导体，由此将有源层的一部分夹在导体之间使第一和第二组导电，并且将与绝缘基板直接接触的有源层的一部分保持为绝缘体。

4. 发明授权

US4854230A Screen printing apparatus 失效
标题翻译：丝网印刷设备
公开(公告)号：US4854230A
公开(公告)日：1989-08-08
申请号：US193222
申请日：1988-05-11
申请人： Kenichi Niki , Tetsuro Makita , Hayato Takasago
发明人： Kenichi Niki , Tetsuro Makita , Hayato Takasago
IPC分类号： B41F15/08 , B41F15/40 , B41F15/44 , H05K3/12
CPC分类号： H05K3/1233 , B41F15/44 , H05K2203/0126
摘要： A screen printing apparatus comprising a screen having an opening or openings of a desired print pattern and having a lower surface being positioned adjacent to a substrate to be printed, and a nonflexible squeegee comprising a cavity for containing a material to be printed on the substrate. The cavity is defined by the interior surfaces of surrounding walls extending generally vertically from the lower extremities at which the squeegee directly contacts the upper surface of the screen. While the squeegee travels with respect to the screen the material to be printed flows from the cavity into the openings of the screen, and thereby onto the substrate. The squeegee may be formed of stainless steel, a ceramic material or a synthetic resin.
摘要翻译：一种丝网印刷设备，包括具有所需打印图案的开口或开口的屏幕，并且具有邻近待印刷的基板定位的下表面;以及非柔性刮板，包括用于容纳待印刷材料的空腔。空腔由围绕壁的内表面限定，该内壁从刮板直接接触屏幕上表面的下端大致垂直地延伸。当刮板相对于筛网移动时，待印刷的材料从空腔流入屏幕的开口，从而流到基板上。刮板可以由不锈钢，陶瓷材料或合成树脂形成。

5. 发明授权

US4783642A Hybrid integrated circuit substrate and method of manufacturing the same 失效
标题翻译：混合集成电路基板及其制造方法
公开(公告)号：US4783642A
公开(公告)日：1988-11-08
申请号：US49261
申请日：1987-05-13
申请人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
发明人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
IPC分类号： H01C17/065 , H01L21/70 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/18 , H05K3/24 , H01C1/012
CPC分类号： H05K3/246 , H01C17/065 , H01L21/705 , H05K1/167 , H05K1/0306 , H05K1/092 , H05K2203/0709 , H05K2203/072 , H05K2203/1453 , H05K2203/1461 , H05K3/182 , Y10T29/49099
摘要： A hybrid integrated circuit substrate contains an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surfaces of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors.
摘要翻译：混合集成电路基板包含绝缘基板。在基板的上表面的预定位置上，形成有与电阻器端部接触的电阻和激活层。在激活层的上表面的预定位置处，形成与电阻器的端部电连接的导体层。

6. 发明授权

US5293262A Liquid crystal display device having heat-insulating members and driving circuit boards attached to rear edges of light box 失效
标题翻译：具有安装在灯箱后缘的隔热构件和驱动电路板的液晶显示装置
公开(公告)号：US5293262A
公开(公告)日：1994-03-08
申请号：US928663
申请日：1992-08-17
申请人： Kohei Adachi , Hideaki Otsuki , Kenichi Niki , Hayato Takasago , Tetsuro Makita
发明人： Kohei Adachi , Hideaki Otsuki , Kenichi Niki , Hayato Takasago , Tetsuro Makita
IPC分类号： G02F1/13 , H01L25/065 , H01R12/70 , G02F1/133 , G09F9/00
CPC分类号： G02F1/13452 , H01L25/0652 , H01R12/7076 , H01L2224/48091 , H01L2224/49175 , H01L2924/09701
摘要： In a liquid crystal display device with a drive circuit board connected to the peripheral portion of a liquid crystal display panel, the circuit board is disposed behind the liquid crystal display panel and also the circuit board is connected with the liquid crystal display panel by means of a connecting member in film form, whereby the liquid crystal display device is miniaturized and efficiency of the assembly work is improved. Further, the circuit board is made up of plural drive circuit modules of the same type whereby the efficiency in the assembly and inspection process is still improved.
摘要翻译：在具有连接到液晶显示面板的周边部分的驱动电路板的液晶显示装置中，电路板设置在液晶显示面板后面，并且电路板通过以下方式与液晶显示面板连接：膜形式的连接构件，由此使液晶显示装置小型化，并且提高了组装工作的效率。此外，电路板由相同类型的多个驱动电路模块组成，从而组装和检查过程的效率仍然得到改善。

7. 发明授权

US5173844A Integrated circuit device having a metal substrate 失效
标题翻译：具有金属基底的集成电路装置
公开(公告)号：US5173844A
公开(公告)日：1992-12-22
申请号：US794281
申请日：1991-11-19
申请人： Kohei Adachi , Mitsuyuki Takada , Atsushi Endo , Eishi Gofuku , Hayato Takasago
发明人： Kohei Adachi , Mitsuyuki Takada , Atsushi Endo , Eishi Gofuku , Hayato Takasago
IPC分类号： H01L21/58 , H01L21/60 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/10 , H05K3/46
CPC分类号： H01L24/32 , H01L23/142 , H01L23/3736 , H01L24/29 , H01L24/48 , H01L24/83 , H05K1/021 , H01L2224/05644 , H01L2224/2919 , H01L2224/32013 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48644 , H01L2224/73265 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/20752 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K2201/0154 , H05K2201/09745 , H05K2203/049 , H05K3/108 , H05K3/4644 , Y10T29/4913
摘要： A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

8. 发明授权

US5081562A Circuit board with high heat dissipations characteristic 失效
标题翻译：具有高热耗特性的电路板
公开(公告)号：US5081562A
公开(公告)日：1992-01-14
申请号：US540389
申请日：1990-06-19
申请人： Kohei Adachi , Mitsuyuki Takada , Eishi Gofuku , Hayato Takasago , Atsushi Endo
发明人： Kohei Adachi , Mitsuyuki Takada , Eishi Gofuku , Hayato Takasago , Atsushi Endo
IPC分类号： H01L21/58 , H01L21/60 , H01L23/14 , H01L23/373 , H05K1/02 , H05K1/05 , H05K1/18 , H05K3/10 , H05K3/46
CPC分类号： H01L24/32 , H01L23/142 , H01L23/3736 , H01L24/29 , H01L24/48 , H01L24/83 , H05K1/021 , H01L2224/05644 , H01L2224/2919 , H01L2224/32013 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/48644 , H01L2224/73265 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L24/45 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12041 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/1517 , H01L2924/20752 , H01L2924/351 , H05K1/0206 , H05K1/056 , H05K1/182 , H05K2201/0154 , H05K2201/09745 , H05K2203/049 , H05K3/108 , H05K3/4644 , Y10T29/4913
摘要： A circuit board includes a copper plate and an insulating layer of photosensitive polyimide resin formed on the copper plate, the insulating layer leaving an exposed portion of a surface of the copper plate where an LSI is to be mounted. After Au plating is applied to the exposed surface of the copper plate, the LSI is mounted fixedly. A connection pattern having bonding pads is formed by copper plating on the insulating layer. The bonding pads and the LSI are connected by Au wire bonding on the Au plating applied on the bonding pads.

9. 发明授权

US5069745A Process for preparing a combined wiring substrate 失效
标题翻译：制备组合布线基板的方法
公开(公告)号：US5069745A
公开(公告)日：1991-12-03
申请号：US571876
申请日：1990-08-24
申请人： Hirofumi Ohuchida , Eishi Gofuku , Hayato Takasago , Akira Ishizu , Toshio Tobita , Mitsuyuki Takada
发明人： Hirofumi Ohuchida , Eishi Gofuku , Hayato Takasago , Akira Ishizu , Toshio Tobita , Mitsuyuki Takada
IPC分类号： G02F1/1347 , G02F1/1333 , G02F1/1343 , G09F9/30 , G09F9/40 , H01R4/04 , H05K1/14 , H05K1/16 , H05K3/32
CPC分类号： H01R4/04 , G02F1/13336 , H05K1/142 , G02F1/1343 , H05K2203/107 , H05K3/321
摘要： A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.
摘要翻译：用于制备组合布线基板的方法是通过使粘合剂与多个基板的相互相对的侧面的各自具有在其主表面上具有布线图案的端面粘接，并且通过将通过插入接合部分彼此相对的布线。

10. 发明授权

US4685203A Hybrid integrated circuit substrate and method of manufacturing the same 失效
标题翻译：混合集成电路基板及其制造方法
公开(公告)号：US4685203A
公开(公告)日：1987-08-11
申请号：US636675
申请日：1984-08-01
申请人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
发明人： Mitsuyuki Takada , Yoshiyuki Morihiro , Hayato Takasago
IPC分类号： H01C17/065 , H01L21/70 , H05K1/03 , H05K1/09 , H05K1/16 , H05K3/18 , H05K3/24 , H01C17/06
CPC分类号： H05K3/246 , H01C17/065 , H01L21/705 , H05K1/167 , H05K1/0306 , H05K1/092 , H05K2203/0709 , H05K2203/072 , H05K2203/1453 , H05K2203/1461 , H05K3/182 , Y10T29/49099
摘要： A hybrid integrated circuit substrate comprising an insulating substrate. On predetermined positions of the upper surface of the substrate, there are formed cermet resistors and activation layers to be in contact with ends of the resistors. On predetermined positions of the upper surface of the activation layers, there are formed conductor layers electrically connected with the ends of the resistors through the activation layers. The activation layers are formed from an activation paste containing a catalytic metal for enabling deposition in electroless plating in glass ingredients for attaining adhesion with the insulating substrate upon firing. Electrical connection between the conductor layers and the cermet resistors occurs through the activation layers by ohmic contact effected between the cermet resistors and the conductor layers through diffusion layers formed upon firing the activation paste.
摘要翻译：一种混合集成电路基板，包括绝缘基板。在基板的上表面的预定位置上，形成金属陶瓷电阻和激活层与电阻器的端部接触。在激活层的上表面的预定位置处，形成了通过激活层与电阻器的端部电连接的导体层。活化层由含有催化金属的活化糊剂形成，用于在玻璃成分中的无电解电镀中沉积，以在烧制时获得与绝缘基材的粘附。导体层和金属陶瓷电阻之间的电连接通过在金属陶瓷电阻器和导体层之间的欧姆接触通过激活激活膏时形成的扩散层而发生。

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