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1. 发明申请

US20120074597A1 FLEXIBLE UNDERFILL COMPOSITIONS FOR ENHANCED RELIABILITY 有权
标题翻译：灵活的底层组合物，以提高可靠性
公开(公告)号：US20120074597A1
公开(公告)日：2012-03-29
申请号：US12890545
申请日：2010-09-24
申请人： Dingying Xu , Nisha Ananthakrishnan , Hong Dong , Rahul N. Manepalli , Nachiket Raravikar , Gregory S. Constable
发明人： Dingying Xu , Nisha Ananthakrishnan , Hong Dong , Rahul N. Manepalli , Nachiket Raravikar , Gregory S. Constable
IPC分类号： H01L23/48 , C09D7/12
CPC分类号： C08G59/02 , C07F7/0838 , C08G59/3254 , C08G59/38 , C08L23/0884 , H01L21/563 , H01L23/293 , H01L24/16 , H01L24/73 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/92125 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/3512 , Y10T428/31515 , H01L2924/00 , H01L2224/05599
摘要： Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
摘要翻译：描述了用于制造电子设备的底部填充材料。一个实施方案包括含有环氧混合物，胺硬化剂组分和填料的底部填充组合物。环氧混合物可包括包含双酚环氧树脂的第一环氧树脂，包含多官能环氧树脂的第二环氧树脂和包含脂族环氧树脂的第三环氧树脂，所述脂族环氧树脂包含硅氧烷环氧树脂。第一，第二和第三环氧树脂各自具有不同的化学结构。描述和要求保护其他实施例。

2. 发明授权

US07926697B2 Underfill formulation and method of increasing an adhesion property of same 有权
标题翻译：底部填充剂配方和增加其粘附性的方法
公开(公告)号：US07926697B2
公开(公告)日：2011-04-19
申请号：US11857441
申请日：2007-09-19
申请人： Linda Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Ananthakrishan
发明人： Linda Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Ananthakrishan
IPC分类号： B23K31/02 , B23K35/22
CPC分类号： C08L53/00 , C08L63/00 , C08L2666/02 , C08L2666/14 , C08L2666/24 , C09J153/00 , Y10S524/919
摘要： An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
摘要翻译：底层填充剂包括溶剂（110），溶剂中的多个两亲嵌段共聚物（120）和溶剂中的粘合促进剂（130）。多个两亲性嵌段共聚物的组在溶剂中形成多个胶束（140），其中胶束包括围绕芯的芯（141）和壳（142），并且粘附促进剂至少在核心一些胶束中的一些。

3. 发明授权

US07759780B2 Microelectronic package with wear resistant coating 失效
标题翻译：微电子封装具有耐磨涂层
公开(公告)号：US07759780B2
公开(公告)日：2010-07-20
申请号：US12242398
申请日：2008-09-30
申请人： Nirupama Chakrapani , Vijay S Wakharkar , Janet Feng , Nisha Ananthakrishnan , Shankar Ganapathysubramanian , Gregory S Constable
发明人： Nirupama Chakrapani , Vijay S Wakharkar , Janet Feng , Nisha Ananthakrishnan , Shankar Ganapathysubramanian , Gregory S Constable
IPC分类号： H01L23/29
CPC分类号： H01L23/373 , H01L23/3731 , H01L23/3732 , H01L23/3736 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
摘要翻译：提供微电子封装。微电子封装包括半导体衬底和具有顶表面和底表面的管芯，其中管芯的底表面耦合到半导体衬底。微电子封装还包括设置在管芯的顶表面上的纳米材料层。

4. 发明授权

US09254532B2 Methods of fabricating low melting point solder reinforced sealant and structures formed thereby 有权
标题翻译：制造低熔点焊料增强密封剂和由此形成的结构的方法
公开(公告)号：US09254532B2
公开(公告)日：2016-02-09
申请号：US12655407
申请日：2009-12-30
申请人： Deepak V. Kulkarni , Carl L. Deppisch , Leonel R. Arana , Gregory S. Constable , Sriram Srinivasan
发明人： Deepak V. Kulkarni , Carl L. Deppisch , Leonel R. Arana , Gregory S. Constable , Sriram Srinivasan
IPC分类号： H01L23/02 , H01L23/12 , H01L23/10 , H01L23/34 , B23K1/00 , B23K3/08
CPC分类号： B23K1/0016 , B23K1/20 , B23K1/203 , B23K3/085 , H01L23/3675 , H01L2224/16225 , H01L2224/73253 , H01L2924/16251 , Y10T428/12222
摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
摘要翻译：形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。

5. 发明申请

US20110136941A1 UNDERFILL FORMULATION AND METHOD OF INCREASING AN ADHESION PROPERTY OF SAME 有权
标题翻译：提高配方和增加其粘合性能的方法
公开(公告)号：US20110136941A1
公开(公告)日：2011-06-09
申请号：US13025625
申请日：2011-02-11
申请人： Linda A. Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Ananthakrishan
发明人： Linda A. Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Ananthakrishan
IPC分类号： C08L63/00
CPC分类号： C08L53/00 , C08L63/00 , C08L2666/02 , C08L2666/14 , C08L2666/24 , C09J153/00 , Y10S524/919
摘要： An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
摘要翻译：底层填充剂包括溶剂（110），溶剂中的多个两亲嵌段共聚物（120）和溶剂中的粘合促进剂（130）。多个两亲性嵌段共聚物的组在溶剂中形成多个胶束（140），其中胶束包括围绕芯的芯（141）和壳（142），并且粘附促进剂至少在核心一些胶束中的一些。

6. 发明申请

US20100078806A1 MICROELECTRONIC PACKAGE WITH WEAR RESISTANT COATING 失效
标题翻译：具有耐磨涂层的微电子包装
公开(公告)号：US20100078806A1
公开(公告)日：2010-04-01
申请号：US12242398
申请日：2008-09-30
申请人： Nirupama Chakrapani , Vijay S. Wakharkar , Janet Feng , Nisha Ananthakrishnan , Shankar Ganapathysubranian , Gregory S. Constable
发明人： Nirupama Chakrapani , Vijay S. Wakharkar , Janet Feng , Nisha Ananthakrishnan , Shankar Ganapathysubranian , Gregory S. Constable
IPC分类号： H01L23/34 , H01L21/00
CPC分类号： H01L23/373 , H01L23/3731 , H01L23/3732 , H01L23/3736 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2224/0401
摘要： A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.
摘要翻译：提供微电子封装。微电子封装包括半导体衬底和具有顶表面和底表面的管芯，其中管芯的底表面耦合到半导体衬底。微电子封装还包括设置在管芯的顶表面上的纳米材料层。

7. 发明申请

US20090170247A1 MAGNETIC PARTICLES FOR LOW TEMPERATURE CURE OF UNDERFILL 审中-公开
标题翻译：用于低温低温的磁性颗粒
公开(公告)号：US20090170247A1
公开(公告)日：2009-07-02
申请号：US11966933
申请日：2007-12-28
申请人： Linda A. SHEKHAWAT , Gregory S. CONSTABLE , Youzhi E. XU , Nisha ANANTHAKRISHNAN
发明人： Linda A. SHEKHAWAT , Gregory S. CONSTABLE , Youzhi E. XU , Nisha ANANTHAKRISHNAN
IPC分类号： H01L21/50
CPC分类号： H01L21/563 , H01L2224/73203 , H01L2224/83222
摘要： Electronic devices and methods for fabricating electronic devices are described. One embodiment includes a method comprising providing a first body and a second body, and electrically coupling the first body to the second body using a plurality of solder bumps, wherein a gap remains between the first body and the second body. The method also includes placing an underfill material into the gap between the first body and the second body, the underfill material comprising magnetic particles in a polymer composition. The method also includes curing the underfill material in the gap by applying a magnetic field powered by alternating current, to induce heat in the magnetic particles, wherein the heat in the magnetic particles heats the polymer composition, and the magnetic field is applied for a sufficient time to cure the polymer composition. Other embodiments are described and claimed.
摘要翻译：描述了用于制造电子设备的电子设备和方法。一个实施例包括一种方法，包括提供第一主体和第二主体，并且使用多个焊料凸块将第一主体电连接到第二主体，其中间隙保持在第一主体和第二主体之间。该方法还包括将底部填充材料放置在第一主体和第二主体之间的间隙中，底部填充材料包含聚合物组合物中的磁性颗粒。该方法还包括通过施加由交流电驱动的磁场来固化间隙中的底部填充材料，以在磁性颗粒中引起热量，其中磁性颗粒中的热量加热聚合物组合物，并且将磁场施加足够的固化聚合物组成的时间。描述和要求保护其他实施例。

8. 发明授权

US08354467B2 Underfill formulation and method of increasing an adhesion property of same 有权
标题翻译：底部填充剂配方和增加其粘附性的方法
公开(公告)号：US08354467B2
公开(公告)日：2013-01-15
申请号：US13025625
申请日：2011-02-11
申请人： Linda A. Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Anathakrishan
发明人： Linda A. Shekhawat , Gregory S. Constable , Youzhi E. Xu , Nisha Anathakrishan
IPC分类号： C08G65/32 , C08L63/00
CPC分类号： C08L53/00 , C08L63/00 , C08L2666/02 , C08L2666/14 , C08L2666/24 , C09J153/00 , Y10S524/919
摘要： An underfill formulation includes a solvent (110), a plurality of amphiphilic block copolymers (120) in the solvent, and an adhesion promoter (130) in the solvent. Groups of the plurality of amphiphilic block copolymers form a plurality of micelles (140) in the solvent, with the micelles including a core (141) and a shell (142) surrounding the core, and the adhesion promoter is in the core of at least some of the plurality of micelles.
摘要翻译：底层填充剂包括溶剂（110），溶剂中的多个两亲嵌段共聚物（120）和溶剂中的粘合促进剂（130）。多个两亲性嵌段共聚物的组在溶剂中形成多个胶束（140），其中胶束包括围绕芯的芯（141）和壳（142），并且粘附促进剂至少在核心一些胶束中的一些。

9. 发明授权

US09068067B2 Flexible underfill compositions for enhanced reliability 有权
标题翻译：灵活的底部填充组合物，增强可靠性
公开(公告)号：US09068067B2
公开(公告)日：2015-06-30
申请号：US12890545
申请日：2010-09-24
申请人： Dingying Xu , Nisha Ananthakrishnan , Hong Dong , Rahul N. Manepalli , Nachiket Raravikar , Gregory S. Constable
发明人： Dingying Xu , Nisha Ananthakrishnan , Hong Dong , Rahul N. Manepalli , Nachiket Raravikar , Gregory S. Constable
IPC分类号： C04B41/49 , C08L83/00 , C08G77/00 , C08L63/00 , C08G65/48 , C08L23/08 , H01L21/56 , H01L23/29 , C08G59/32 , C08G59/38 , H01L23/00
CPC分类号： C08G59/02 , C07F7/0838 , C08G59/3254 , C08G59/38 , C08L23/0884 , H01L21/563 , H01L23/293 , H01L24/16 , H01L24/73 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2224/92125 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/3512 , Y10T428/31515 , H01L2924/00 , H01L2224/05599
摘要： Underfill materials for fabricating electronic devices are described. One embodiment includes an underfill composition including an epoxy mixture, an amine hardener component, and a filler. The epoxy mixture may include a first epoxy comprising a bisphenol epoxy, a second epoxy comprising a multifunctional epoxy, and a third epoxy comprising an aliphatic epoxy, the aliphatic epoxy comprising a silicone epoxy. The first, second, and third epoxies each have a different chemical structure. Other embodiments are described and claimed.
摘要翻译：描述了用于制造电子设备的底部填充材料。一个实施方案包括含有环氧混合物，胺硬化剂组分和填料的底部填充组合物。环氧混合物可包括包含双酚环氧树脂的第一环氧树脂，包含多官能环氧树脂的第二环氧树脂和包含脂族环氧树脂的第三环氧树脂，所述脂族环氧树脂包含硅氧烷环氧树脂。第一，第二和第三环氧树脂各自具有不同的化学结构。描述和要求保护其他实施例。

10. 发明申请

US20110159310A1 Methods of fabricating low melting point solder reinforced sealant and structures formed thereby 有权
标题翻译：制造低熔点焊料增强密封剂和由此形成的结构的方法
公开(公告)号：US20110159310A1
公开(公告)日：2011-06-30
申请号：US12655407
申请日：2009-12-30
申请人： Deepak V. Kulkarni , Carl L. Deppisch , Leonel R. Arana , Gregory S. Constable , Sriram Srinivasan
发明人： Deepak V. Kulkarni , Carl L. Deppisch , Leonel R. Arana , Gregory S. Constable , Sriram Srinivasan
IPC分类号： B32B15/04 , B23K31/02 , B32B38/00
CPC分类号： B23K1/0016 , B23K1/20 , B23K1/203 , B23K3/085 , H01L23/3675 , H01L2224/16225 , H01L2224/73253 , H01L2924/16251 , Y10T428/12222
摘要： Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
摘要翻译：形成封装结构的方法和相关结构包括在IHS的阻焊剂开口位置上形成低熔点焊料材料，从而在非SRO保护区域内形成密封剂; 将IHS连接到密封剂上，并固化密封剂，其中在IHS和低熔点焊料材料之间形成焊接接头。

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