会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • CVD METHOD AND CVD REACTOR
    • CVD方法和CVD反应器
    • US20120149212A1
    • 2012-06-14
    • US13391609
    • 2010-08-04
    • Gerhard Karl Strauch
    • Gerhard Karl Strauch
    • H01L21/31C23C16/458
    • C23C16/4412
    • The invention relates to a device and a method for depositing semiconductor layers, in particular made of a plurality of components on one or more substrates (21) contacting a susceptor (2), wherein process gases can be introduced into the process chamber (1) through flow channels (15, 16; 18) of a gas inlet organ (8), together with a carrier gas, said carrier gas permeating the process chamber (1) substantially parallel to the susceptor and exits through a gas outlet organ (7), wherein the products of decomposition build up the process gases as a coating at least in regions on the substrate surface and on the surface of the gas outlet organ (7) disposed downstream of the susceptor (2) at a distance (D) from the downstream edge (21) thereof. In order to deposit contamination-free layers in sequential process steps without intermediate replacement or intermediate cleaning of the gas outlet organ, according to the invention the distance (D) is great enough to prevent products of decomposition outgassing from the coating of the gas outlet organ (7) at the second process temperature from reaching the substrate (21) by counterflow diffusion.
    • 本发明涉及一种用于沉积半导体层的器件和方法,特别是由一个或多个接触基座(2)的衬底(21)上的多个部件制成,其中工艺气体可被引入处理室(1) 通过气体入口器官(8)的流动通道(15,16; 18)与载气一起,所述载气渗透到处理室(1),基本上平行于基座并通过气体出口器(7)离开, 其中分解产物至少在衬底表面上的区域和位于基座(2)下游的气体出口器具(7)的表面上至少形成处理气体,距离(D)距离 下游边缘(21)。 为了在连续的工艺步骤中沉积无污染层,而没有中间更换或中间清洁气体出口器官,根据本发明,距离(D)足够大以防止从气体出口器官的涂层分解出气的产物 (7)在第二工艺温度下通过逆流扩散到达衬底(21)。
    • 2. 发明申请
    • METHOD FOR ACCESS TO A TRANSMISSION MEDIUM
    • 用于接收传输介质的方法
    • US20110161985A1
    • 2011-06-30
    • US13060568
    • 2009-10-28
    • Gerhard Karl Willi WitteWolfgang Martin Kallweit
    • Gerhard Karl Willi WitteWolfgang Martin Kallweit
    • G06F9/46
    • G06F9/541
    • The invention relates to a method for preparing or effecting access, in data transmission, from a first application which is run on a client data processing device to a transmission medium which is coupled to the client data processing device. The steps performed are: providing a second application which includes at least one interface for converting the format of information, transmitted by the first application, to a standard format which is predetermined by the second application; and registering the second application with the client data processing device or installing the second application on the client data processing device in order to transmit the information of the first application in the standard format between the second application and the transmission medium or to enable the information of the first application to be transmitted in the standard format between the second application and the transmission medium.
    • 本发明涉及一种用于在数据传输中从在客户数据处理设备上运行到耦合到客户端数据处理设备的传输介质的第一应用程序进行访问的方法。 执行的步骤是:提供第二应用,其包括用于将由第一应用发送的信息的格式转换成由第二应用预定的标准格式的至少一个接口; 以及将所述第二应用与所述客户端数据处理设备注册或将所述第二应用安装在所述客户端数据处理设备上,以便在所述第二应用和所述传输介质之间以标准格式发送所述第一应用的信息,或者使得能够 在第二应用和传输介质之间以标准格式发送的第一应用。
    • 3. 发明授权
    • Process and apparatus for depositing semiconductor layers using two process gases, one of which is preconditioned
    • 使用两种处理气体沉积半导体层的方法和装置,其中一种是预处理的
    • US07709398B2
    • 2010-05-04
    • US11262874
    • 2005-10-31
    • Gerhard Karl StrauchJohannes KaeppelerMarkus ReinholdBernd Schulte
    • Gerhard Karl StrauchJohannes KaeppelerMarkus ReinholdBernd Schulte
    • H01L21/31
    • C23C16/45514C23C16/303C23C16/452C23C16/45574Y10S438/905
    • The invention relates to a method and device for depositing at least one layer, particularly a semiconductor layer, onto at least one substrate, which is situated inside a process chamber of a reactor while being supported by a substrate holder. The layer is comprised of at least two material components provided in a fixed stoichiometric ratio, which are each introduced into the reactor in the form of a first and a second reaction gas, and a portion of the decomposition products form the layer, whereby the supply of the first reaction gas, which has a low thermal activation energy, determines the growth rate of the layer, and the second reaction gas, which has a high thermal activation energy, is supplied in excess and is preconditioned, in particular, by an independent supply of energy. The first reaction gas flows in a direction toward the substrate holder through a multitude of openings, which are distributed over a surface of a gas inlet element, said surface being located opposite the substrate holder. According to the invention, the second process gas is preconditioned with a plasma before entering the process chamber, and it enters the process chamber at the edge of the substrate holder directly thereabove and flows parallel to the substrate holder surface.
    • 本发明涉及一种用于将至少一层,特别是半导体层沉积在至少一个衬底上的方法和装置,所述至少一个衬底位于反应器的处理室内,同时由衬底保持器支撑。 该层由以固定的化学计量比提供的至少两种材料组分组成,其以第一和第二反应气体的形式引入反应器,并且一部分分解产物形成层,由此供应 具有低热活化能的第一反应气体决定层的生长速率,并且具有高热活化能的第二反应气体被过量供应并且被预处理,特别是由独立的 供应能源。 第一反应气体通过分布在气体入口元件的表面上的多个开口朝向衬底保持器的方向流动,所述表面位于衬底保持器相对的位置。 根据本发明,第二工艺气体在进入处理室之前用等离子体预处理,并且它直接进入衬底保持器的边缘处的处理室,并平行于衬底保持器表面流动。