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    • 1. 发明授权
    • One-pack moisture-curing epoxy resin composition
    • 单组份湿固化环氧树脂组合物
    • US07022779B2
    • 2006-04-04
    • US10381741
    • 2001-12-17
    • Takeshi EndoFumio SandaHisakazu HoriiKentaro SuzukiNobuki Matsuura
    • Takeshi EndoFumio SandaHisakazu HoriiKentaro SuzukiNobuki Matsuura
    • C08L63/00C08L63/02
    • C08G59/4042C07F9/3813C08G59/4007
    • A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin. (1) [In the general formula (1), R1, R2, R3, and R4 are each independently hydrogen or an organic group; and n is an integer of 1 or above] (2) [In the general formula (2), R5 and R6 are each independently alkyl; R7 is an epoxy-containing organic group; and n is an integer of 1 to 3]
    • 可以在常温下固化并提高储存稳定性而不损害固化速度的单组分湿固化环氧树脂组合物,即彼此不兼容的两种性质是优异的。 该组合物包括选自通式(1)的羧酸乙烯酯和通式(2)的含环氧基的甲硅烷基化合物的一种或多种成员,一种或多种选自酮亚胺和恶唑烷的成员, 和环氧树脂。 (1)[通式(1)中,R 1,R 2,R 3,R 4, 各自独立地为氢或有机基团; n为1以上的整数](2)[通式(2)中,R 5和R 6各自独立地为烷基, R 7是含环氧基的有机基团; n为1〜3的整数]