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1. 发明申请

US20230001723A1 DEVICE AND METHOD FOR EMBOSSING MICRO- AND/OR NANOSTRUCTURES 有权
公开(公告)号：US20230001723A1
公开(公告)日：2023-01-05
申请号：US17942513
申请日：2022-09-12
申请人： EV Group E. Thallner GmbH
发明人： Friedrich Paul Lindner , Harald Zaglmayr , Christian Schon , Thomas Glinsner , Evelyn Reisinger , Peter Fischer , Othmar Luksch
IPC分类号： B41K1/22 , G03F7/00 , B41K3/14 , B41F19/02
摘要： An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.

2. 发明申请

US20220390356A1 DEVICE AND METHOD FOR MEASURING A SUBSTRATE 有权
公开(公告)号：US20220390356A1
公开(公告)日：2022-12-08
申请号：US17774612
申请日：2019-11-28
申请人： EV Group E. Thallner GmbH
发明人： Jacek GASIOROWSKI , Markus WIMPLINGER
IPC分类号： G01N21/21 , G01N21/95 , G06F30/20
摘要： The invention relates to a method for measuring a multilayered substrate (1, 1′, 1″), particularly with at least one structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, particularly with a surface structure (7, 7′, 7″, 7′″, 7IV, 7V) with critical dimensions, characterized in that the method has at least the following steps, particularly the following procedure:
producing (110) the substrate (1, 1′, 1″) with a plurality of layers (2, 3, 4, 5, 6, 6′, 6″), particularly with a structure (7, 7′, 7″, 7′″, 7IV, 7V), particularly with a structure (7, 7′, 7″, 7″′, 7IV, 7V) on a surface (6o, 6′o, 6″o) of an uppermost layer (6, 6′, 6″), wherein the dimensions of the layers and in particular the structures are known,
measuring (120) the substrate (1, 1′, 1″), and in particular the structure (7, 7′, 7″, 7′″, 71IV, 7V)) using at least one measuring technology,
creating (130) a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″),
comparing (140) the measurement results with simulation results from the simulation of the substrate (1, 1′, 1″),
optimizing the simulation (130) and renewed creation (130) of a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1′, 1″), in the event that there is a deviation of the measurement results from the simulation results, or calculating (150) parameters of further substrates, in the event that the measurement results correspond to the simulation results.

3. 发明授权

US11488851B2 Method and device for alignment of substrates 有权
公开(公告)号：US11488851B2
公开(公告)日：2022-11-01
申请号：US17162180
申请日：2021-01-29
申请人： EV Group E. Thallner GmbH
发明人： Thomas Wagenleitner , Dominik Zinner , Jurgen Markus Suss , Christian Sinn , Jurgen Mallinger
IPC分类号： H01L21/00 , H01L21/68 , H01L21/67 , H01L23/544 , H01L21/683
摘要： A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.

4. 发明申请

US20220230849A1 METHOD FOR PREFIXING OF SUBSTRATES 有权
公开(公告)号：US20220230849A1
公开(公告)日：2022-07-21
申请号：US17714290
申请日：2022-04-06
申请人： EV GROUP E. THALLNER GMBH
发明人： Friedrich Paul Lindner
IPC分类号： H01J37/32 , C23C16/44 , C23C16/455
摘要： A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.

5. 发明申请

US20220216098A1 METHOD AND DEVICE FOR SURFACE TREATMENT OF SUBSTRATES 有权
公开(公告)号：US20220216098A1
公开(公告)日：2022-07-07
申请号：US17693812
申请日：2022-03-14
申请人： EV Group E. Thallner GmbH
发明人： Markus Wimplinger
IPC分类号： H01L21/762 , H01L21/20 , C23C14/48
摘要： A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.

6. 发明授权

US11348825B2 Method and device for surface treatment of substrates 有权
公开(公告)号：US11348825B2
公开(公告)日：2022-05-31
申请号：US17007082
申请日：2020-08-31
申请人： EV Group E. Thallner GmbH
发明人： Markus Wimplinger
IPC分类号： C23C14/48 , H01L21/762 , H01L21/20
摘要： A method for surface treatment of an at least primarily crystalline substrate surface of a substrate such that by amorphization of the substrate surface, an amorphous layer is formed at the substrate surface with a thickness d>0 nm of the amorphous layer. This invention also relates to a corresponding device for surface treatment of substrates.

7. 发明授权

US11328939B2 Method for prefixing of substrates 有权
公开(公告)号：US11328939B2
公开(公告)日：2022-05-10
申请号：US16556511
申请日：2019-08-30
申请人： EV GROUP E. THALLNER GMBH
发明人： Friedrich Paul Lindner
IPC分类号： H01L21/67 , H01L21/02 , H01L21/20 , H01L21/3205 , H01L21/68 , H01L21/60
摘要： A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.

8. 发明授权

US11315901B2 Method for bonding substrates 有权
公开(公告)号：US11315901B2
公开(公告)日：2022-04-26
申请号：US16632643
申请日：2017-09-21
申请人： EV Group E. Thallner GmbH
发明人： Dominik Zinner , Thomas Wagenleitner , Jurgen Markus Suss , Thomas Plach , Jurgen Mallinger
IPC分类号： H01L21/67 , H01L23/00 , H01L21/683
摘要： A method for bonding a first substrate to a second substrate on mutually facing contact surfaces of the substrates, wherein the first substrate is mounted on a first chuck and the second substrate is mounted on a second chuck, and wherein a plate is arranged between the second substrate and the second chuck, wherein the second substrate with the plate is deformed with respect to the second chuck before and/or during the bonding. Furthermore, the present invention relates to a corresponding device and a corresponding plate.

9. 发明授权

US11315813B2 Substrate holder and method for bonding two substrates 有权
公开(公告)号：US11315813B2
公开(公告)日：2022-04-26
申请号：US15551733
申请日：2015-04-10
申请人： EV Group E. Thallner GmbH
发明人： Thomas Wagenleitner , Thomas Plach , Jurgen Michael Suss , Jurgen Mallinger
IPC分类号： H01L21/68 , H01L21/673 , H01L21/67 , H01L23/00
摘要： A substrate holder having a fixing surface for holding a substrate, a system having such a substrate holder, a use of such a substrate holder, a method for bonding two substrates and a product, particularly a substrate stack, produced using such a method and also a use of such a substrate holder for such a method.

10. 发明授权

US11040525B2 Method for embossing micro-structures and/or nano-structures 有权
公开(公告)号：US11040525B2
公开(公告)日：2021-06-22
申请号：US16463092
申请日：2017-10-23
申请人： EV Group E. Thallner GmbH
发明人： Jozsef Krol , Boris Povazay
IPC分类号： B41F19/02 , G03F7/00 , B82Y40/00
摘要： A method and apparatus for embossing micro-structures and/or nano-structures. The method includes the steps of providing a structured embossing roll having end faces; coupling a crosslinking radiation into the structured embossing roll which is transparent for the crosslinking radiation, wherein the embossing roll functions as a light guide for the coupled in crosslinking radiation; providing a carrier having an embossing compound applied thereto; contacting the embossing roll with the embossing compound; coupling the crosslinking radiation out of the embossing roll; and curing the embossing compound which has been acted upon by the coupled out crosslinking radiation via the embossing roll.

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