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    • 4. 发明授权
    • Method and system for electron density measurement
    • 电子密度测量方法和系统
    • US07177781B2
    • 2007-02-13
    • US10521118
    • 2003-07-23
    • Eric J. StrangRichard ParsonsJody Goldfield
    • Eric J. StrangRichard ParsonsJody Goldfield
    • G06F11/30
    • H01J37/32192H01J37/32935H01J37/3299
    • The present invention provides a diagnostic system for plasma processing, wherein the diagnostic system comprises a multi-modal resonator, a power source, a detector, and a controller. The controller is coupled to the power source and the detector and it is configured to provide a man-machine interface for performing several monitoring and controlling functions associated with the diagnostic system including: a Gunn diode voltage monitor, a Gunn diode current monitor, a varactor diode voltage monitor, a detector voltage monitor, a varactor voltage control, a varactor voltage sweep control, a resonance lock-on control, a graphical user control, and an electron density monitor. The diagnostic system can further provide a remote controller coupled to the controller and configured to provide a remote man-machine interface. The remote man-machine interface. The remote man-machine interface can provide a graphical user interface in order to permit remote control of the diagnostic system by an operator. In addition, the present invention provides several methods of controlling the diagnostic system in order to perform both monitor and control functions.
    • 本发明提供了一种用于等离子体处理的诊断系统,其中诊断系统包括多模谐振器,电源,检测器和控制器。 控制器耦合到电源和检测器,并且其被配置为提供用于执行与诊断系统相关联的多个监视和控制功能的人机接口,包括:耿氏二极管电压监视器,耿氏二极管电流监视器,变容二极管 二极管电压监视器,检测器电压监视器,变容二极管电压控制,变容二极管电压扫描控制,共振锁定控制,图形用户控制和电子密度监视器。 诊断系统还可以提供耦合到控制器并被配置为提供远程人机界面的遥控器。 远程人机界面。 远程人机界面可以提供图形用户界面,以便允许操作者对诊断系统进行远程控制。 此外,本发明提供了几种控制诊断系统以便执行监视和控制功能的方法。
    • 5. 发明授权
    • Method and apparatus for improved plasma processing uniformity
    • 改善等离子体处理均匀性的方法和装置
    • US07164236B2
    • 2007-01-16
    • US10793253
    • 2004-03-05
    • Andrej S. MitrovicEric J. StrangMurray D. SirkisBill H. QuonRichard ParsonsYuji Tsukamoto
    • Andrej S. MitrovicEric J. StrangMurray D. SirkisBill H. QuonRichard ParsonsYuji Tsukamoto
    • H05B31/26C23F1/00
    • H01J37/32082H01J37/32009H01J37/32091H01J37/32532H01J37/32935
    • A method and apparatus for generating and controlling a plasma (130) formed in a capacitively coupled plasma system (100) having a plasma electrode (140) and a bias electrode in the form of a workpiece support member (170), wherein the plasma electrode is unitary and has multiple regions (Ri) defined by a plurality of RF power feed lines (156) and the RF power delivered thereto. The electrode regions may also be defined as electrode segments (420) separated by insulators (426). A set of process parameters A={n, τi, Φi, Pi, S; Li} is defined; wherein n is the number of RF feed lines connected to the electrode upper surface at locations Li, τi is the on-time of the RF power for the ith RF feed line, Φi is the phase of the ith RF feed line relative to a select one of the other RF feed lines, Pi is the RF power delivered to the electrode through the ith RF feed line at location Li, and S is the sequencing of RF power to the electrode through the RF feed lines. One or more of these parameters are adjusted so that operation of the plasma system results in a workpiece (176) being processed with a desired amount or degree of process uniformity.
    • 一种用于产生和控制形成在电容耦合等离子体系统(100)中的等离子体(130)的方法和装置,其具有工件支撑构件(170)形式的等离子体电极(140)和偏置电极,其中等离子体电极 是单一的并且具有由多个RF馈电线(156)限定的多个区域(RF)和传递给其的RF功率。 电极区域也可以被定义为由绝缘体(426)分离的电极段(420)。 一组过程参数A = {n,τi,i,P i, 被定义; 其中n是在位置L i1处连接到电极上表面的RF馈送线的数量,τi是针对i 是相对于其他RF馈线中选择的一个RF馈线的第i个RF馈线的相位,P < SUB> i 是通过位置L i i处的第i个RF馈线传送到电极的RF功率,S是RF功率到 电极通过RF馈线。 调整这些参数中的一个或多个,使得等离子体系统的操作导致以期望的量或程度的均匀度处理工件(176)。
    • 6. 发明授权
    • Method and apparatus for determining consumable lifetime
    • 用于确定消耗寿命的方法和装置
    • US07108751B2
    • 2006-09-19
    • US10739126
    • 2003-12-19
    • Eric J. Strang
    • Eric J. Strang
    • C23C16/455C23F1/00H01L21/306
    • H01J37/3244H01J37/32935
    • A plasma processing device comprising a gas injection system is described, wherein the gas injection system comprises a gas injection assembly body, a consumable gas inject plate coupled to the gas injection assembly body, and a pressure sensor coupled to a gas injection plenum formed by the gas injection system body and the consumable gas inject plate. The gas injection system is configured to receive a process gas from at least one mass flow controller and distribute the process gas to the processing region within the plasma processing device, and the pressure sensor is configured to measure a gas injection pressure within the gas injection plenum. A controller, coupled to the pressure sensor, is configured to receive a signal from the pressure sensor and to determine a state of the consumable gas inject plate based upon the signal. A method of determining the state of the consumable gas inject plate comprises: measuring a change in the gas injection pressure associated with either a change in the process gas mass flow rate or the processing pressure; determining a response time for the change in pressure; and comparing the response time during erosion to a response time during no erosion.
    • 描述了包括气体注入系统的等离子体处理装置,其中气体注入系统包括气体注入组件主体,联接到气体注入组件主体的可消耗气体注入板,以及耦合到气体注入系统 气体注入系统体和消耗气体注入板。 气体注入系统被配置为从至少一个质量流量控制器接收处理气体并将处理气体分配到等离子体处理装置内的处理区域,并且压力传感器被配置成测量气体注入气室内的气体注入压力 。 耦合到压力传感器的控制器被配置为从压力传感器接收信号并且基于该信号来确定可消耗气体注入板的状态。 确定可消耗气体注入板的状态的方法包括:测量与处理气体质量流量或处理压力的变化相关联的气体注入压力的变化; 确定压力变化的响应时间; 并将侵蚀期间的响应时间与不侵蚀期间的响应时间进行比较。
    • 8. 发明授权
    • Multi-zone resistance heater
    • 多区电阻加热器
    • US06740853B1
    • 2004-05-25
    • US10088504
    • 2002-09-17
    • Wayne L. JohnsonEric J. Strang
    • Wayne L. JohnsonEric J. Strang
    • H05B368
    • H01L21/67109C23C16/4586C23C16/46H01L21/67103H01L21/6831
    • A substrate holder for holding a substrate (e.g., a wafer or an LCD panel) during plasma processing. The substrate holder is a stack of processing elements which each perform at least one function. The elements include an electrostatic chuck (102), an He gas distribution system (122), multi-zone heating plates (132), and multi-zone cooling system (152). Each element is designed to match the characteristic of the processing system, e.g., by applying heat based on a heat loss characteristic of the substrate during normal processing. The integrated design allows for precise control of the operating conditions, including, but not limited to, fast heating and fast cooling of a substrate.
    • 用于在等离子体处理期间保持衬底(例如,晶片或LCD面板)的衬底保持器。 衬底保持器是一堆处理元件,每个处理元件执行至少一个功能。 这些元件包括静电卡盘(102),He气体分配系统(122),多区域加热板(132)和多区域冷却系统(152)。 每个元件被设计成与处理系统的特性匹配,例如通过在正常处理期间基于衬底的热损失特性施加热量。 集成设计允许对操作条件的精确控制,包括但不限于快速加热和快速冷却基板。