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    • 1. 发明申请
    • Method for making hindered phenolic antioxidant
    • 阻碍酚类抗氧化剂的制备方法
    • US20100210872A1
    • 2010-08-19
    • US12461153
    • 2009-08-03
    • Dein-Run FungJung-Jen ChuangZhang-Jian HuangChung-Yu Chen
    • Dein-Run FungJung-Jen ChuangZhang-Jian HuangChung-Yu Chen
    • C07C51/347
    • C07C67/03C07C67/52C07C69/732
    • A method for making a hindered phenolic antioxidant based on Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate uses a methanol solution containing alkali metal methoxide as a catalyst solution, wherein the catalyst solution is filtered with a filter device with a filter pore diameter of less than 50 μm to remove insoluble matters therefrom before used in a transesterification process where methyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate and 1-Octadecanol are taken as reactants to obtain a crude product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high conversion rate and low color, and the crude product further undergoes a purification process for crystallization, filtering and drying to obtain a product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high purity and low color.
    • 制备基于3-(3,5-二 - 叔丁基-4-羟基苯基)丙酸十八烷基酯的受阻酚类抗氧化剂的方法使用含有碱金属甲醇盐的甲醇溶液作为催化剂溶液,其中催化剂溶液用 过滤装置的过滤器孔径小于50μm,以除去不溶性物质,然后使用3-(3,5-二叔丁基-4-羟基苯基)丙酸甲酯和1-十八烷醇作为酯交换反应 反应物,得到具有高转化率和低颜色的3-十八烷基3-(3,5-二叔丁基-4-羟基苯基)丙酸十八烷基酯的粗产物,粗产物进一步进行结晶,过滤和干燥的纯化过程 得到纯度高,颜色低的3-十八烷基3-(3,5-二叔丁基-4-羟基苯基)丙酸十八烷基酯的产物。
    • 4. 发明授权
    • Method for making hindered phenolic antioxidant
    • 阻碍酚类抗氧化剂的制备方法
    • US08653300B2
    • 2014-02-18
    • US12461153
    • 2009-08-03
    • Dein-Run FungJung-Jen ChuangZhang-Jian HuangChung-Yu Chen
    • Dein-Run FungJung-Jen ChuangZhang-Jian HuangChung-Yu Chen
    • C07C59/00C07C65/03
    • C07C67/03C07C67/52C07C69/732
    • A method for making a hindered phenolic antioxidant based on Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate uses a methanol solution containing alkali metal methoxide as a catalyst solution, wherein the catalyst solution is filtered with a filter device with a filter pore diameter of less than 50 μm to remove insoluble matters therefrom before used in a transesterification process where methyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate and 1-Octadecanol are taken as reactants to obtain a crude product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high conversion rate and low color, and the crude product further undergoes a purification process for crystallization, filtering and drying to obtain a product of Octadecyl 3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate having high purity and low color.
    • 制备基于3-(3,5-二 - 叔丁基-4-羟基苯基)丙酸十八烷基酯的受阻酚类抗氧化剂的方法使用含有碱金属甲醇盐的甲醇溶液作为催化剂溶液,其中催化剂溶液用 过滤装置,过滤器孔径小于50um,以除去不溶性物质,然后使用3-(3,5-二叔丁基-4-羟基苯基)丙酸甲酯和1-十八烷醇作为酯交换反应 反应物,得到具有高转化率和低颜色的3-十八烷基3-(3,5-二叔丁基-4-羟基苯基)丙酸十八烷基酯的粗产物,粗产物进一步进行结晶,过滤和干燥的纯化过程 得到纯度高,颜色低的3-十八烷基3-(3,5-二叔丁基-4-羟基苯基)丙酸十八烷基酯的产物。
    • 7. 发明申请
    • RESIN COMPOSITION FOR OPTICAL LENS AND OPTICAL PACKAGING
    • 光学透镜和光学包装的树脂组合物
    • US20110196068A1
    • 2011-08-11
    • US12939452
    • 2010-11-04
    • DEIN-RUN FUNGTE-CHAO LIAOCHENG-YU YANG
    • DEIN-RUN FUNGTE-CHAO LIAOCHENG-YU YANG
    • C08L63/00C08K3/34C08K3/22B82Y20/00
    • C08G59/24C08G59/4085C08G59/68C08L63/00
    • A resin composition for optical lenses and optical packaging includes (1) 1 to 99.99 wt % mixture of epoxy, siloxane and epoxy-siloxane copolymers, (2) 0.01 to 5 wt % catalyst and (3) 0 to 40 wt % curing agent. The mixture of epoxy, siloxane and epoxy-siloxane copolymers includes (1) 1 to 85 wt % epoxy and siloxane oligomers, based on total weight of the mixture; (2) 1 to 90 wt % siloxane containing at least one alkoxy group, based on total weight of the mixture; (3) 1 to 80 wt % a epoxy resin having a benzene ring with at least one epoxy group or a hydrogenated benzene ring, or aliphatic epoxy resin, based on total weight of the mixture; (4) 1 to 70 wt % epoxy resin containing at least one hydroxyl group and at least an epoxy group, based on total weight of the mixture.
    • 用于光学透镜和光学包装的树脂组合物包括(1)环氧树脂,硅氧烷和环氧 - 硅氧烷共聚物的1至99.99重量%的混合物,(2)0.01至5重量%的催化剂和(3)0至40重量%的固化剂。 环氧树脂,硅氧烷和环氧 - 硅氧烷共聚物的混合物包括(1)1至85重量%的环氧和硅氧烷低聚物,基于混合物的总重量; (2)1至90重量%的含有至少一个烷氧基的硅氧烷,基于混合物的总重量; (3)1至80重量%的具有至少一个环氧基的苯环或氢化苯环的环氧树脂或脂族环氧树脂,基于混合物的总重量; (4)基于混合物的总重量,含有至少一个羟基和至少一个环氧基的1至70重量%的环氧树脂。
    • 8. 发明申请
    • High thermal-conductive, halogen-free, flame-retardant resin composition, and prepreg and coating thereof
    • 高导热,无卤素,阻燃树脂组合物,以及其预浸料和涂层
    • US20100163783A1
    • 2010-07-01
    • US12588940
    • 2009-11-03
    • Dein-Run FungTe-Chao LiaoHao-Sheng Chen
    • Dein-Run FungTe-Chao LiaoHao-Sheng Chen
    • C09K5/00
    • C09K21/14C08G59/304C08G59/38C08L63/00H05K1/0373H05K2201/012H05K2201/0209C08L2666/22
    • A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.01% to 10% of processing aids, which resin composition has excellent thermal conductivity, heat resistance and flame retardancy as well as being environmentally friendly for free of halogen flame retardant and no toxic or corrosive gases when burning; the resin composition is used to form as a high thermal-conductive prepreg by impregnation or form as a high thermal-conductive coating by coating and then further used as a dielectric layer on a printed circuit board for demonstrating if electronic components formed thereon the printed circuit board has high thermal-conductivity and efficient heat dissipation capable of improving long service life and enhanced stability of electronic components.
    • 用作印刷电路板的电介质层的高导热,无卤阻燃树脂组合物包含5%至70%的含磷环氧树脂,至多50%的多官能或双官能环氧树脂,1 固化剂的百分比至20%,促进剂的0.01%至10%,无机粉末的至多20%,高导热性粉末的5%至85%和加工助剂的0.01%至10%,该树脂组合物具有优异的热 导电性,耐热性和阻燃性,以及环保无卤素阻燃剂,燃烧时无毒性或腐蚀性气体; 树脂组合物用于通过浸渍形成高导热性预浸料,或通过涂布形成高导热涂层,然后进一步用作印刷电路板上的电介质层,以证明其上形成印刷电路的电子部件 板材具有高导热性和高效率的散热能力,可以延长电池寿命,延长电子元器件的稳定性。