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1. 发明申请

US20170097228A1 Measurement Apparatus to Locate an Orientation With Respect to a Surface 审中-公开
公开(公告)号：US20170097228A1
公开(公告)日：2017-04-06
申请号：US14882465
申请日：2015-10-14
申请人： Daniel Roman Prochoda
发明人： Daniel Roman Prochoda
IPC分类号： G01B11/26 , G01C3/08
CPC分类号： G01B11/26 , G01B11/002 , G01S7/4808 , G01S7/51 , G01S17/48 , G01S17/87 , G01S17/88
摘要： A non-contacting measurement apparatus to measure a two or three dimensional out of plane orientation with respect to a surface. Various embodiments are possible with some being capable of measuring perpendicularity to the surface, closest distance to the surface, angles of incidence of a vector from the measurement apparatus to the point on the surface, and/or generating three dimensional coordinate representations of the measurement apparatus and/or its components with respect to the surface and/or a point on the surface. Some embodiments of the measurement apparatus allow it to obtain orientation data dynamically, allowing the measurement apparatus and/or the surface to be moving while obtaining the orientation measurements. Additionally some embodiments of the measurement apparatus are capable of guiding a user to a particular orientation through an output device.

2. 发明申请

US20140199359A1 ANTIMICROBIAL POLYMER SYSTEMS USING MULTIFUNCTIONAL ORGANOMETALLIC ADDITIVES FOR WAX HOSTS 有权
标题翻译：使用多功能有机添加剂进行WAX HOSTS的抗微生物聚合物体系
公开(公告)号：US20140199359A1
公开(公告)日：2014-07-17
申请号：US13833689
申请日：2013-03-15
申请人： MARC CHASON , DANIEL ROMAN GAMOTA , RICK LATELLA
发明人： MARC CHASON , DANIEL ROMAN GAMOTA , RICK LATELLA
IPC分类号： A01N55/02
CPC分类号： A01N55/02 , A01N37/02 , A01N59/16 , A01N59/20 , A01N25/10
摘要： Described are antimicrobial polymer products made from mixtures of antimicrobial organometallic additives dispersed throughout a polymer host matrix.
摘要翻译：描述的是由分散在聚合物主体基质中的抗微生物有机金属添加剂的混合物制成的抗微生物聚合物产品。

3. 发明授权

US08018181B2 Method and apparatus for achieving inherent ignition voltage in operation of a high intensity discharge lamp 失效
标题翻译：用于在高强度放电灯的操作中实现固有点火电压的方法和装置
公开(公告)号：US08018181B2
公开(公告)日：2011-09-13
申请号：US12370538
申请日：2009-02-12
申请人： Daniel Roman
发明人： Daniel Roman
IPC分类号： G05F1/00
CPC分类号： H05B41/2882 , Y02B20/204
摘要： A high intensity discharge lamp, such as a high power sodium or metal halide lamp, having an electronic ballast. The electronic ballast may incorporate resonance-based circuitry for achieving an ignition state via a frequency sweeping step, the particular ignition voltage being inherent to the operational state of the high intensity discharge lamp. The operating state of the lamp may be sensed in order to apply power and voltage levels appropriate for steady state operation.
摘要翻译：具有电子镇流器的高强度放电灯，例如高功率钠或金属卤化物灯。电子镇流器可以包括基于谐振的电路，用于通过频率扫描步骤实现点火状态，特定点火电压是高强度放电灯的操作状态固有的。可以感测灯的工作状态，以便施加适于稳态操作的功率和电压电平。

4. 发明授权

US5930598A Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same 失效
标题翻译：包括可分解密封剂的微电子组件及其形成和重新加工的方法
公开(公告)号：US5930598A
公开(公告)日：1999-07-27
申请号：US120164
申请日：1998-07-21
申请人： Steven Lewis Wille , Daniel Roman Gamota , Colleen Mary Walsh
发明人： Steven Lewis Wille , Daniel Roman Gamota , Colleen Mary Walsh
IPC分类号： H01L21/56 , H05K3/28 , H01L23/28
CPC分类号： H01L21/563 , H01L24/28 , H05K3/284 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14
摘要： A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).
摘要翻译：微电子组件（10）包括通过填充有聚合物密封剂（18）的间隙与基底（12）间隔开的集成电路部件（14）。聚合物密封剂（18）含有可热分解的叠氮化物基团。在需要去除部件（14）的情况下，例如如果发现部件（14）有缺陷，则将微电子组件（10）加热到高于叠氮化物组分解温度的温度。叠氮化物基团的分解使密封剂（18）分解，并且优选将组分从基材（12）分离，从而允许组分（14）的更换。

5. 发明授权

US5804881A Method and assembly for providing improved underchip encapsulation 失效
公开(公告)号：US5804881A
公开(公告)日：1998-09-08
申请号：US562861
申请日：1995-11-27
申请人： Steven Lewis Wille , Daniel Roman Gamota
发明人： Steven Lewis Wille , Daniel Roman Gamota
IPC分类号： H01L21/56 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14
摘要： A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18). Channel 26 enhances the flow of the precursor (19) in the gap (30) prior to curing the precursor (19) to form the encapsulant (20).

6. 发明授权

US5720100A Assembly having a frame embedded in a polymeric encapsulant and method for forming same 失效
标题翻译：具有嵌入聚合物密封剂中的框架的组件及其形成方法
公开(公告)号：US5720100A
公开(公告)日：1998-02-24
申请号：US581695
申请日：1995-12-29
申请人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
发明人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
IPC分类号： H01L21/56 , H01L23/00 , H05K3/34
CPC分类号： H01L23/562 , H01L21/563 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2224/73203 , H01L2924/01322 , Y10T29/49144
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要翻译：微电子组件（10）包括安装到印刷电路板（14）的集成电路管芯（12）。集成电路管芯（12）覆盖印刷电路板（14），并且包括面向印刷电路板（14）的有效面（26），并通过间隙（30）与其间隔开。多个焊料凸点互连（32）跨过间隙（30）延伸并且将多个板接合焊盘（22）与多个管芯接合焊盘（28）连接。聚合物前体（13）围绕集成电路管芯（12）分配到印刷电路板（14）上并且可固化以形成聚合密封剂（16）。聚合物前体（13）被拉入间隙（30）并形成覆盖印刷电路板（14）的圆角（34）。将框架（18）嵌入在圆角（34）中，并且加热聚合物前体（13）以固化聚合物前体（13）以形成聚合物密封剂（16）。框架（18）固定在聚合物密封剂（16）内的印刷电路板（14）上，以为微电子组件（10）提供增加的机械强度。

7. 发明授权

US6034333A Frame embedded in a polymeric encapsulant 失效
标题翻译：框架嵌入聚合物密封剂
公开(公告)号：US6034333A
公开(公告)日：2000-03-07
申请号：US975720
申请日：1997-11-21
申请人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
发明人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
IPC分类号： H01L21/56 , H01L23/00 , H05K1/16
CPC分类号： H01L23/562 , H01L21/563 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2224/73203 , H01L2924/01322 , Y10T29/49144
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要翻译：微电子组件（10）包括安装到印刷电路板（14）的集成电路管芯（12）。集成电路管芯（12）覆盖印刷电路板（14），并且包括面向印刷电路板（14）的有效面（26），并通过间隙（30）与其间隔开。多个焊料凸点互连（32）跨过间隙（30）延伸并且将多个板接合焊盘（22）与多个管芯接合焊盘（28）连接。聚合物前体（13）围绕集成电路管芯（12）分配到印刷电路板（14）上并且可固化以形成聚合密封剂（16）。聚合物前体（13）被拉入间隙（30）并形成覆盖印刷电路板（14）的圆角（34）。框架（18）嵌入在圆角（34）中，不与板（14）直接接触，并且聚合物前体（13）被加热以固化聚合物前体（13）以形成聚合物密封剂（16）。框架（18）固定在聚合物密封剂（16）内的印刷电路板（14）上，以为微电子组件（10）提供增加的机械强度。

8. 发明授权

US5682066A Microelectronic assembly including a transparent encapsulant 失效
标题翻译：微电子组件包括透明密封剂
公开(公告)号：US5682066A
公开(公告)日：1997-10-28
申请号：US689585
申请日：1996-08-12
申请人： Daniel Roman Gamota , Alan G. Chen , Michael Hertsberg
发明人： Daniel Roman Gamota , Alan G. Chen , Michael Hertsberg
IPC分类号： H01L21/56 , H01L21/60 , H01L33/54 , H01L33/62 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L33/54 , H01L21/563 , H01L24/81 , H01L2224/16 , H01L2224/73203 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L33/62
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) mounted onto a substrate (14) and spaced apart by a gap (30). Solder bump interconnections (32) extend across the gap (30) and physically attach and electrically connect an electrical circuit on the substrate (14) to an electrical circuit on the integrated circuit die (12). The gap (30) is filled with a transparent encapsulant (16) to protect the solder bump interconnections (32). The transparent encapsulant (16) is composed of a polymeric matrix and filler particles dispersed in the matrix. The polymeric matrix and the filler particles have substantially similar indices of refraction, thereby making the encapsulant (16) transparent. The integrated circuit die (12) includes light emitting diodes (18) that transmit light toward the transparent substrate (14) to form a display. The substrate (12) is preferably formed of transparent glass, and the filler particles are preferably formed of a composition similar to the transparent glass substrate (14) to allow light generated by the light emitting diodes (18) to pass through the encapsulant (16) and the substrate (14).
摘要翻译：微电子组件（10）包括安装在衬底（14）上并由间隙（30）隔开的集成电路管芯（12）。焊接凸块互连（32）跨越间隙（30）延伸并物理地将基板（14）上的电路电连接到集成电路管芯（12）上的电路。间隙（30）填充有透明密封剂（16）以保护焊料凸点互连（32）。透明密封剂（16）由聚合物基质和分散在基质中的填料颗粒组成。聚合物基质和填料颗粒具有基本相似的折射率，从而使密封剂（16）透明。集成电路管芯（12）包括向所述透明衬底（14）透射光以形成显示器的发光二极管（18）。基板（12）优选由透明玻璃形成，并且填料颗粒优选由类似于透明玻璃基板（14）的组合物形成，以允许由发光二极管（18）产生的光通过密封剂（16））和基板（14）。

9. 发明申请

US20170122730A1 Methods and Apparatus to Project Distance Measurements and Images onto a Flat or Curved Surface 审中-公开
公开(公告)号：US20170122730A1
公开(公告)日：2017-05-04
申请号：US14931874
申请日：2015-11-04
申请人： Daniel Roman Prochoda
发明人： Daniel Roman Prochoda
IPC分类号： G01C3/08 , G01B11/25
CPC分类号： G01B11/25 , G01C15/02
摘要： A non-contacting method and device to project scale or near to scale distance measurement markings onto a flat and/or curved surface. Additionally, the same method is used to adjust an image and/or the projection of an image onto a flat and/or curved surface, and additionally a device to project the image on a flat and/or curved surface is disclosed.

10. 发明申请

US20140099252A1 System and method for supplying hydrogen and deuterium to lenr and e-cat based energy generating systems 审中-公开
标题翻译：用于向lenr和e-cat为基础的能量产生系统供应氢和氘的系统和方法
公开(公告)号：US20140099252A1
公开(公告)日：2014-04-10
申请号：US13573857
申请日：2012-10-09
申请人： Marc Kenneth Chason , Daniel Roman Gamota , Rick Latella
发明人： Marc Kenneth Chason , Daniel Roman Gamota , Rick Latella
IPC分类号： C01B4/00 , C01B3/32 , C01B3/26
CPC分类号： C01B4/00 , C01B3/042 , C01B3/24 , C01B3/26 , C01B3/32 , C01B2203/0266 , C01B2203/0805 , C25B1/04 , Y02E60/364 , Y02E60/366
摘要： An approach for supplying hydrogen and/or deuterium to LENR and E-Cat based energy generating systems includes receiving a source material that is rich in hydrogen and/or deuterium. A gaseous form of at least one of those elements is extracted from the source material via electrochemical dissociation, hydrocarbon recovery, or a suitable mechanical process. The gaseous form of the element is preferably filtered to remove water vapor and other impurities before being pressurized and supplied to the energy generating system. Advantages of the approach include enhanced safety and system portability due to elimination of a need for pressurized gas storage tanks.
摘要翻译：向LENR和基于E-Cat的能量产生系统供应氢和/或氘的方法包括接收富含氢和/或氘的源材料。通过电化学解离，烃回收或合适的机械方法，从源材料中提取至少一种元素的气态形式。元件的气体形式优选地被过滤以在加压之前除去水蒸汽和其它杂质，并将其供应到能量产生系统。该方法的优点包括增强安全性和系统可移植性，因为不需要加压气体储存罐。

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