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1. 发明授权

US07766724B2 Method for simultaneously slicing at least two cylindrical workpieces into a multiplicity of wafers 有权
标题翻译：用于将至少两个圆柱形工件同时切割成多个晶片的方法
公开(公告)号：US07766724B2
公开(公告)日：2010-08-03
申请号：US11923722
申请日：2007-10-25
申请人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
发明人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
IPC分类号： B24B49/00 , B24D1/06
CPC分类号： B28D5/042
摘要： Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: a) selecting a number n≧2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality L G ≥ ( n - 1 ) · A min + ∑ i = 1 n ⁢ ⁢ L 1 ( 1 ) and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A≧Amin therebetween such that the relationship L G ≥ ( n - 1 ) · A + ∑ i = 1 n ⁢ ⁢ L i ( 2 ) is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw. Preferably, the wafer stacks are separated from one another by separating pieces after slicing, and at the same time are laterally supported.
摘要翻译：通过以下方式执行多个圆柱形工件进入晶圆：通过以下步骤进行：a）从不同长度的工件库存中选择n≥2个工件，满足不等式LG≥（n-1） ·A min +Σi = 1 n⁢L 1（1），使不等式的右边尽可能大，其中i i = 1。。。 n为工件的长度，Amin为预定的最小间距，b）将n个工件在长度方向上连续固定在安装板上，同时保持间距A≥Am，使得LG≥（n-1） ·A +Σi = 1 n≠L i（2），c）将多个线锯中的工件夹紧，d）通过多线锯将n个工件垂直于其纵向轴线切割。优选地，通过在切片之后分离片而将晶片堆叠彼此分离，并且同时被横向支撑。

2. 发明申请

US20080099006A1 METHOD FOR SIMULTANEOUSLY SLICING AT LEAST TWO CYLINDRICAL WORKPIECES INTO A MULTIPLICITY OF WAFERS 有权
公开(公告)号：US20080099006A1
公开(公告)日：2008-05-01
申请号：US11923722
申请日：2007-10-25
申请人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
发明人： Anton Huber , Alexander Heilmaier , Clemens Radspieler , Helmut Seehofer
IPC分类号： B23D57/00
CPC分类号： B28D5/042
摘要： Slicing multiple cylindrical workpieces into wafers by a multi wire saw with a gang length LG, is performed by: a) selecting a number n≧2 of workpieces from a stock of workpieces with different lengths, satisfying the inequality L G ≥ ( n - 1 ) · A min + ∑ i = 1 n   L 1 ( 1 ) and making right-hand side of the inequality as large as possible, where Li with i=1 . . . n are for the lengths of the workpieces and Amin is a predefined minimum spacing, b) fixing the n workpieces successively in the longitudinal direction on a mounting plate while maintaining a spacing A≧Amin therebetween such that the relationship L G ≥ ( n - 1 ) · A + ∑ i = 1 n   L i ( 2 ) is satisfied, c) clamping mounting plates workpieces in a multi wire saw, and d) slicing the n workpieces perpendicularly to their longitudinal axis by means of the multi wire saw. Preferably, the wafer stacks are separated from one another by separating pieces after slicing, and at the same time are laterally supported.

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