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1. 发明授权

US09737657B2 Implantable medical pump with pressure sensor 有权
公开(公告)号：US09737657B2
公开(公告)日：2017-08-22
申请号：US12793457
申请日：2010-06-03
申请人： Keith A. Miesel , James M. Haase , Chris J. Paidosh , Darren A. Janzig , Timothy J. Denison
发明人： Keith A. Miesel , James M. Haase , Chris J. Paidosh , Darren A. Janzig , Timothy J. Denison
IPC分类号： A61M5/14 , G01L9/12 , A61M5/142 , A61M39/02 , G01L9/00 , G01L15/00 , G01L19/00 , G01L19/08 , G01L19/14
CPC分类号： A61M5/14276 , A61M39/0208 , A61M2205/3317 , A61M2205/3331 , G01L9/0072 , G01L15/00 , G01L19/0023 , G01L19/0069 , G01L19/086 , G01L19/143 , G01L19/148 , G01L19/149
摘要： The disclosure is directed to a pressure sensor of an implantable medical device. The pressure sensor may utilize detect fluid pressure based on a changing capacitance between two capacitive elements. The pressure sensor may define at least a portion of a fluid enclosure of the IMD. In one example, the pressure sensor has a self-aligning housing shape that occludes an opening in the pump bulkhead of the IMD. An operative surface of the pressure and the portion of the fluid enclosure may be formed of a corrosion resistant and/or biocompatible material. A first capacitive element of the pressure sensor may be a metal alloy diaphragm that deflects in response to external fluid pressure. A second capacitive element of the pressure sensor may be a metal coating on a rigid insulator sealed from the fluid by the diaphragm and a housing of the sensor.

2. 发明申请

US20110165785A1 MODULAR LEAD INTERCONNECTOR 有权
标题翻译：模块化引线互连
公开(公告)号：US20110165785A1
公开(公告)日：2011-07-07
申请号：US12937644
申请日：2009-01-23
申请人： Gerald G. Lindner , Paulette C. Olson , Darren A. Janzig , Chris J. Paidosh
发明人： Gerald G. Lindner , Paulette C. Olson , Darren A. Janzig , Chris J. Paidosh
IPC分类号： H01R13/52 , H01R43/00
CPC分类号： H01R31/06 , A61N1/05 , A61N1/0551 , H01R2201/12
摘要： An end interconnector for one or both ends of a lead body of an electrical lead for an implantable medical device. The interconnector has an insulative body having a receptacle at its first end for each of a plurality of wire filars from the lead body, and a receiver at its second end for each of a plurality of connection wires extending from the medical device, such as an electrode tip. The interconnector provides electrical connection between the plurality of wire filars and the plurality of connection wires.
摘要翻译：用于可植入医疗装置的电引线的引线体的一端或两端的端部互连器。互连器具有绝缘体，在其第一端具有用于来自引线主体的多个线丝中的每一个的插座，并且在其第二端具有用于从医疗装置延伸的多个连接线中的每一个的接收器，例如电极尖端互连器提供多个线丝与多个连接线之间的电连接。

3. 发明申请

US20080103556A1 Housing for implantable medical device 有权
标题翻译：可植入医疗器械的外壳
公开(公告)号：US20080103556A1
公开(公告)日：2008-05-01
申请号：US11590250
申请日：2006-10-31
申请人： Bernard Q. Li , John J. Grevious , Timothy J. Davis , Leroy Perz , Chris J. Paidosh
发明人： Bernard Q. Li , John J. Grevious , Timothy J. Davis , Leroy Perz , Chris J. Paidosh
IPC分类号： A61N1/00
CPC分类号： A61L31/022 , A61N1/375
摘要： A housing for an implantable medical device includes a first portion formed from a first material and a second portion formed from a second material. The first material and the second material comprise titanium and the first material has a higher resistivity than the second material.
摘要翻译：用于可植入医疗装置的壳体包括由第一材料形成的第一部分和由第二材料形成的第二部分。第一材料和第二材料包括钛，并且第一材料具有比第二材料更高的电阻率。

4. 发明授权

US10363424B2 Methods of manufacturing a hermetic lead connector 有权
公开(公告)号：US10363424B2
公开(公告)日：2019-07-30
申请号：US13361319
申请日：2012-01-30
申请人： Darren A. Janzig , Gerald G. Lindner , Chris J. Paidosh
发明人： Darren A. Janzig , Gerald G. Lindner , Chris J. Paidosh
IPC分类号： A61N1/375 , H01R43/20
摘要： A method of manufacturing a hermetic lead connector includes fixing an electrically insulating ring between an electrically conducting contact ring and an electrically conducting spacer ring to form a hermetic ring subassembly, and fixing a plurality of the hermetic ring subassemblies in axial alignment to form a hermetic lead connector. The hermetic lead connector includes an open end, an outer surface, and an inner surface defining a lead aperture. The hermetic lead connector provides a hermetic seal between the outer surface and the inner surface.

5. 发明授权

US09943695B2 Lead connector with glass insulators 有权
公开(公告)号：US09943695B2
公开(公告)日：2018-04-17
申请号：US13012957
申请日：2011-01-25
申请人： John E. Kast , Darren A. Janzig , Chris J. Paidosh , Andrew J. Thom , Brad C. Tischendorf , Gerald G. Lindner
发明人： John E. Kast , Darren A. Janzig , Chris J. Paidosh , Andrew J. Thom , Brad C. Tischendorf , Gerald G. Lindner
IPC分类号： A61N1/375 , H01R13/187 , H01R24/58 , H01R107/00
CPC分类号： A61N1/3752 , H01R13/187 , H01R24/58 , H01R2107/00
摘要： A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating glass material. The electrically insulating glass material fixes the two or more electrically conducting contact rings in axial alignment.

6. 发明申请

US20110270330A1 DIFFUSION BONDED LEAD CONNECTOR 审中-公开
标题翻译：扩散连接引线连接器
公开(公告)号：US20110270330A1
公开(公告)日：2011-11-03
申请号：US13088913
申请日：2011-04-18
申请人： Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
发明人： Darren A. Janzig , Andrew J. Thom , Chris J. Paidosh , Brad C. Tischendorf , Gerald G. Lindner
IPC分类号： A61N1/36 , B32B38/00 , B32B37/06 , B32B37/14 , A61N1/04 , B32B37/02
CPC分类号： A61N1/05 , A61B2562/227 , A61N1/3752 , B23K20/026 , B23K26/21 , B23K2101/38 , B23K2103/172 , B23K2103/52 , B23K2103/54 , C23C14/10 , C23C14/18 , C23C14/34 , H01R13/187 , H01R24/58 , H01R43/0221 , H01R2107/00 , H01R2201/12 , Y10T156/10
摘要： A medical device lead connector includes electrically conducting contact rings spaced apart by an electrically insulating ring and in axial alignment. The electrically conducting contact ring and the insulating ring having an interface bond on an atomic level.
摘要翻译：医疗器件引线连接器包括由电绝缘环间隔开并且轴向对准的导电接触环。导电接触环和绝缘环在原子水平上具有接合键。

7. 发明申请

US20110184480A1 LEAD CONNECTOR WITH GLASS BRAZE 有权
标题翻译：铅玻璃连接器
公开(公告)号：US20110184480A1
公开(公告)日：2011-07-28
申请号：US13012979
申请日：2011-01-25
申请人： John E. Kast , Darren A. Janzig , Chris J. Paidosh , Andrew J. Thom , Brad C. Tischendorf , Gerald G. Lindner
发明人： John E. Kast , Darren A. Janzig , Chris J. Paidosh , Andrew J. Thom , Brad C. Tischendorf , Gerald G. Lindner
IPC分类号： A61N1/36 , A61N1/05 , H01R43/02
CPC分类号： A61N1/3752 , H01R13/187 , H01R24/58 , H01R2107/00 , Y10T29/49211
摘要： A medical device lead connector includes two or more electrically conducting contact rings spaced apart by electrically insulating ceramic ring. An electrically insulating glass material fixes the two or more electrically conducting contact rings to the insulating ceramic ring in axial alignment.
摘要翻译：医疗器件引线连接器包括由电绝缘陶瓷环间隔开的两个或更多个导电接触环。电绝缘玻璃材料将两个或多个导电接触环以轴向对准固定到绝缘陶瓷环上。

8. 发明申请

US20090270795A1 METHOD FOR WELDING A BARRIER IN AN IMPLANTABLE DRUG DELIVERY DEVICE 审中-公开
标题翻译：用于在可植入药物递送装置中焊接障碍物的方法
公开(公告)号：US20090270795A1
公开(公告)日：2009-10-29
申请号：US12108242
申请日：2008-04-23
申请人： Ahmed Elmouelhi , Thomas W. Hovind , Chris J. Paidosh
发明人： Ahmed Elmouelhi , Thomas W. Hovind , Chris J. Paidosh
IPC分类号： A61M1/00 , B21D39/03 , B23K9/28
CPC分类号： A61M5/14276 , A61M5/14216 , B23K26/206 , B23K26/22 , B23K26/244 , B23K26/28 , B23K2101/12 , B23K2103/05 , B23K2103/14 , F04B17/042 , F04B17/044 , Y10T29/49826
摘要： A method including laser welding a barrier to a sleeve and at least one of a housing or coil cup to enclose a solenoid in a solenoid-driven piston pump. The solenoid driven piston pump may comprise a portion of an implantable drug delivery device.
摘要翻译：一种方法，包括激光焊接套管的屏障和壳体或线圈杯中的至少一个，以将螺线管封闭在螺线管驱动的活塞泵中。螺线管驱动的活塞泵可以包括可植入药物输送装置的一部分。

9. 发明申请

US20080177167A1 HERMETIC LEAD CONNECTOR ASSEMBLY 有权
标题翻译：传感器连接器总成
公开(公告)号：US20080177167A1
公开(公告)日：2008-07-24
申请号：US11733247
申请日：2007-04-10
申请人： Darren A. Janzig , Gerald G. Lindner , Chris J. Paidosh
发明人： Darren A. Janzig , Gerald G. Lindner , Chris J. Paidosh
IPC分类号： A61N1/02
CPC分类号： A61N1/3752 , Y10S439/909
摘要： A hermetic lead connector assembly includes a hermetic lead connector having an open end, a lead connector outer surface and a lead connector inner surface defining a lead aperture and a rigid sleeve is disposed about the hermetic lead connector outer surface. The hermetic lead connector has one or more electrically conducting contact rings spaced apart by electrically insulating rings. The hermetic lead connector provides a hermetic seal between the lead connector outer surface and the lead connector inner surface. The rigid sleeve has an aperture that exposes a portion of the one or more electrically conducting contact rings.
摘要翻译：密封导线连接器组件包括具有开口端的气密引线连接器，引线连接器外表面和限定引线孔的引线连接器内表面和刚性套管围绕密封引线连接器外表面设置。密封导线连接器具有由电绝缘环间隔开的一个或多个导电接触环。密封导线连接器在引线连接器外表面和引线连接器内表面之间提供气密密封。刚性套筒具有暴露一个或多个导电接触环的一部分的孔。

10. 发明授权

US08397578B2 Capacitive pressure sensor assembly 有权
标题翻译：电容式压力传感器组件
公开(公告)号：US08397578B2
公开(公告)日：2013-03-19
申请号：US12793459
申请日：2010-06-03
申请人： Keith A. Miesel , James M. Haase , Chris J. Paidosh , Darren A. Janzig , Timothy J. Denison
发明人： Keith A. Miesel , James M. Haase , Chris J. Paidosh , Darren A. Janzig , Timothy J. Denison
IPC分类号： G01L9/12 , A61M5/14
CPC分类号： G01L9/0072 , G01L19/142 , G01L19/143 , G01L19/147 , H01L2224/48472 , Y10T29/49002 , Y10T29/53265
摘要： The disclosure is directed to a capacitive pressure sensor, and the assembly of a capacitive pressure sensor, that may be used within an implantable medical pump. In one example, a housing ferrule that encloses one capacitive plate and includes at least one protrusion for attaching a support structure of the capacitive plate. The at least one protrusion defines a smaller inner diameter as a reference point for securing the support structure while the ferrule provides a larger inner diameter to allow the support structure to tilt inside the ferrule to orient the capacitive plate into a desired plane. Despite manufacturing irregularities, the capacitive plate can be mounted in the desired plane parallel to another capacitive plate, a diaphragm, mounted to an edge of the ferrule. In another example, an assembly tool provides a stage to orient the capacitive plate and support structure within the ferrule at a desired depth.
摘要翻译：本公开涉及电容式压力传感器以及可在可植入医疗泵内使用的电容式压力传感器的组件。在一个示例中，壳体套圈包围一个电容板并且包括用于附接电容板的支撑结构的至少一个突起。所述至少一个突出部限定较小的内径作为用于固定支撑结构的参考点，同时套圈提供更大的内径以允许支撑结构在套圈内部倾斜以将电容板定向到期望的平面。尽管制造不规则，但是电容板可以安装在平行于另一个电容板的所需平面中，该电容板安装在套圈的边缘上。在另一示例中，组装工具提供了将电容板和支撑结构定位在套圈内的阶段，以期望的深度。

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