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1. 发明申请

US20110149541A1 HEAT CURABLE ADHESIVE AND RESIN LAMINATED-TYPE IC CARD 有权
标题翻译：热固性粘合剂和树脂层压型IC卡
公开(公告)号：US20110149541A1
公开(公告)日：2011-06-23
申请号：US12997436
申请日：2009-06-10
申请人： Chihiro Funakoshi , Yoshitomo Aoyama
发明人： Chihiro Funakoshi , Yoshitomo Aoyama
IPC分类号： H05K7/00 , C09J167/04
CPC分类号： B42D25/47 , B42D25/00 , B42D2033/46 , C08K3/36 , C08L25/08 , C08L2666/04 , C09J167/00 , G06K19/07
摘要： Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin.
摘要翻译：提供一种能够牢固地结合由结晶性聚酯树脂形成的基材的热固性粘合剂，可以自由调节粘合剂层的厚度，具有优异的耐化学性，并且同时具有优异的储存稳定性。此外，提供了一种树脂层压型IC卡，其中过去难以使用的液体热固化型粘合剂可以被使用，并且液体热固化性粘合剂可以通过没有需要对热熔片进行成型以将由结晶性聚酯树脂形成的基材粘合。因此，树脂层叠型IC卡可以在IC卡的厚度设计上具有高自由度。可热固化的粘合剂包括（a）含羟基的非结晶聚酯树脂，（b）含有羧酸酐的树脂和（c）用于溶解（a）含羟基的非结晶聚酯树脂。

2. 发明授权

US09012559B2 Heat curable adhesive and resin laminated-type IC card 有权
标题翻译：热固性粘合剂和树脂层压型IC卡
公开(公告)号：US09012559B2
公开(公告)日：2015-04-21
申请号：US12997436
申请日：2009-06-10
申请人： Chihiro Funakoshi , Yoshitomo Aoyama
发明人： Chihiro Funakoshi , Yoshitomo Aoyama
IPC分类号： H05K7/00 , C09J167/04 , C08L67/00 , H05K3/00 , G06K19/07 , C09J167/00 , B42D25/00 , C08K3/36 , C08L25/08 , B42D25/47
CPC分类号： B42D25/47 , B42D25/00 , B42D2033/46 , C08K3/36 , C08L25/08 , C08L2666/04 , C09J167/00 , G06K19/07
摘要： Provided is a heat curable adhesive that can strongly bond a base material formed of a crystalline polyester resin, can freely regulate the thickness of an adhesive layer, has excellent chemical resistance, and, at the same time, has excellent storage stability. Furthermore, provided is a resin laminated-type IC card, in which a liquid heat curable adhesive of which use has been difficult in the past can be used, and the liquid heat curable adhesive can be coated with a good accuracy by a printing method without the need to perform molding into a hot-melt sheet to bond a base material formed of a crystalline polyester resin. Accordingly, the resin laminated-type IC card can have a high degree of freedom in design of the thickness of an IC card. The heat curable adhesive comprises (a) a hydroxyl group-containing non-crystalline polyester resin, (b) a resin containing a carboxylic acid anhydride, and (c) a solvent for dissolving (a) the hydroxyl group-containing non-crystalline polyester resin.
摘要翻译：提供一种能够牢固地结合由结晶性聚酯树脂形成的基材的热固性粘合剂，可以自由调节粘合剂层的厚度，具有优异的耐化学性，并且同时具有优异的储存稳定性。此外，提供了一种树脂层压型IC卡，其中过去难以使用的液体热固化型粘合剂可以被使用，并且液体热固化性粘合剂可以通过没有需要对热熔片进行成型以将由结晶性聚酯树脂形成的基材粘合。因此，树脂层叠型IC卡可以在IC卡的厚度设计上具有高自由度。可热固化的粘合剂包括（a）含羟基的非结晶聚酯树脂，（b）含有羧酸酐的树脂和（c）用于溶解（a）含羟基的非结晶聚酯树脂。

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