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1. 发明申请

US20110183091A1 HOUSING FOR ELECTRONIC DEVICE AND METHOD OF FABRICATING THE SAME 审中-公开
标题翻译：电子设备的外壳及其制造方法
公开(公告)号：US20110183091A1
公开(公告)日：2011-07-28
申请号：US12908969
申请日：2010-10-21
申请人： YONG-GANG ZHU , DA-WEI DING , GUI-YUN YANG , XIN-WU GUAN , CHAO-HSUN LIN , WU-ZHENG OU
发明人： YONG-GANG ZHU , DA-WEI DING , GUI-YUN YANG , XIN-WU GUAN , CHAO-HSUN LIN , WU-ZHENG OU
IPC分类号： C23C4/12 , B05D3/12 , C23C4/10 , B32B15/02
CPC分类号： C23C30/00 , C23C4/01 , C23C4/02 , C23C4/18 , Y10T428/1317
摘要： A housing for an electronic device includes a metal substrate and a ceramic coating directly formed on at least portions of the substrate, the coated portions of the substrate having a rough surface. A method for fabricating the housing comprises roughening predetermined portions of the substrate; thermally spraying a ceramic coating on the roughened portions of the substrate, fixing the substrate on a tool having cold water circularly running there within during the thermal spraying; and grinding and polishing the ceramic coating.
摘要翻译：用于电子设备的外壳包括金属基底和直接形成在基底的至少部分上的陶瓷涂层，所述基底的涂覆部分具有粗糙表面。一种用于制造壳体的方法包括使基底的预定部分粗糙化; 将陶瓷涂层热喷涂在基材的粗糙部分上，在热喷涂期间将基材固定在其上循环冷却的工具上; 并研磨和抛光陶瓷涂层。

2. 发明授权

US07947900B2 Metal housing 有权
标题翻译：金属外壳
公开(公告)号：US07947900B2
公开(公告)日：2011-05-24
申请号：US12141229
申请日：2008-06-18
申请人： Chien-Chih Cheng , Chia-Hsing Chang , Chao-Hsun Lin
发明人： Chien-Chih Cheng , Chia-Hsing Chang , Chao-Hsun Lin
IPC分类号： H05K5/00
CPC分类号： B32B15/01 , H05K5/04 , Y10T428/31678
摘要： A metal housing (10) includes a base (110) and an outer layer (120). The base is made of a thin metal plate. The outer layer includes a plurality of first sections (121) and second sections (122). The material of the first sections is different from that of the second sections. The first sections and the second sections are arranged on the base in an interleaving manner.
摘要翻译：金属外壳（10）包括基座（110）和外层（120）。基座由薄金属板制成。外层包括多个第一部分（121）和第二部分（122）。第一部分的材料与第二部分的材料不同。第一部分和第二部分以交错方式布置在基部上。

3. 发明申请

US20100028709A1 HOUSING OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE USING THE SAME 有权
标题翻译：电子设备的壳体和使用该电子设备的电子设备
公开(公告)号：US20100028709A1
公开(公告)日：2010-02-04
申请号：US12275315
申请日：2008-11-21
申请人： BIN LI , CHAO-HSUN LIN , JEN-LUNG HUANG , XIAN-LIANG LIU , GUI-YUN YANG
发明人： BIN LI , CHAO-HSUN LIN , JEN-LUNG HUANG , XIAN-LIANG LIU , GUI-YUN YANG
IPC分类号： B32B7/06
CPC分类号： H04M1/0283 , Y10T428/12444 , Y10T428/12486 , Y10T428/12639 , Y10T428/12993
摘要： An exemplary housing of electronic device includes a metallic main body and a metallic three-dimensional weaving member formed on at least a part of a surface of the metallic main body. An electronic device using the housing is also provided. The housing of the electronic device has a textured touching feeling.
摘要翻译：电子设备的示例性壳体包括形成在金属主体的表面的至少一部分上的金属主体和金属三维编织构件。还提供了使用该外壳的电子设备。电子设备的外壳具有纹理触感。

4. 发明申请

US20060290254A1 Spacer for field emission display device 审中-公开
标题翻译：场发射显示装置的间隔器
公开(公告)号：US20060290254A1
公开(公告)日：2006-12-28
申请号：US11455838
申请日：2006-06-20
申请人： Chi-Tsung Lo , Tzung-Han Yang , Jeng-Maw Chiou , Shy-Wen Lai , Cheng-Feng Lin , Chao-Hsun Lin
发明人： Chi-Tsung Lo , Tzung-Han Yang , Jeng-Maw Chiou , Shy-Wen Lai , Cheng-Feng Lin , Chao-Hsun Lin
IPC分类号： H01J19/42 , H01J1/88 , H01K1/18
CPC分类号： H01J29/864 , H01J29/028 , H01J31/127 , H01J2329/8625
摘要： The present invention provides a spacer placed between a top substrate and a bottom substrate for a field emission display device. The spacer comprises at least two insulating layers for electrical insulation; and at least one metal layer sandwiched between the insulating layers, wherein the metal layer has plural apertures for electrons passing therethrough and disturbing pathway of electrons as the electrons impact the apertures.
摘要翻译：本发明提供一种放置在用于场发射显示装置的顶部基板和底部基板之间的间隔物。所述间隔件包括用于电绝缘的至少两个绝缘层; 以及夹在所述绝缘层之间的至少一个金属层，其中所述金属层具有用于电子穿过的多个孔，并且随着电子撞击所述孔，电子的扰动路径。

5. 发明申请

US20110050055A1 METHOD FOR MAKING DEVICE HOUSING AND DEVICE HOUSING THEREOF 审中-公开
标题翻译：用于制造设备外壳的方法及其设备外壳
公开(公告)号：US20110050055A1
公开(公告)日：2011-03-03
申请号：US12755495
申请日：2010-04-07
申请人： YONG-GANG ZHU , DA-WEI DING , XIN-WU GUAN , CHAO-HSUN LIN
发明人： YONG-GANG ZHU , DA-WEI DING , XIN-WU GUAN , CHAO-HSUN LIN
IPC分类号： H05K5/02 , C23F1/00
CPC分类号： H05K5/0243
摘要： A method for making a device housing comprises: providing a metal substrate; etching grooves on a portion of the surface of the metal substrate; forming a metallic coating on the surface of the metal substrate and in the grooves; and removing the metallic coating formed on the surface of the metal substrate not comprising the grooves. A device housing made by the method is also described there.
摘要翻译：一种用于制造装置壳体的方法包括：提供金属基板; 在所述金属基板的表面的一部分上蚀刻凹槽; 在金属基板的表面和沟槽中形成金属涂层; 并且除去形成在不包括槽的金属基板的表面上的金属涂层。还描述了通过该方法制造的装置壳体。

6. 发明申请

US20100020295A1 METHOD TO FABRICATE PATTERN IN HOUSING 审中-公开
标题翻译：在房屋中制作图案的方法
公开(公告)号：US20100020295A1
公开(公告)日：2010-01-28
申请号：US12503922
申请日：2009-07-16
申请人： GUI-YUN YANG , JEN-LUNG HUANG , CHAO-HSUN LIN , BIN LI , RUI LIU
发明人： GUI-YUN YANG , JEN-LUNG HUANG , CHAO-HSUN LIN , BIN LI , RUI LIU
IPC分类号： G03B29/00
CPC分类号： H04M1/0283 , B44C3/025 , G03F7/2014
摘要： A method to fabricate a pattern on a housing, includes following steps: placing a film having a first lightproof area and a first light-transmissible area on a housing having light-sensitive inks formed in surface; radiating light on the film and light passing through the light-transmissible area and solidifying the light-sensitive inks; removing the film from the housing and cleaning the un-solidified light-sensitive inks; wiredrawing first wires in the housing and forming first wires in exposed area correspondingly; covering part of the first wires and wiredrawing second wires, the second wires crosses with part of the first wires.
摘要翻译：一种在壳体上制造图案的方法，包括以下步骤：将具有第一防光区域和第一透光区域的膜放置在具有形成在表面上的感光油墨的壳体上; 在薄膜上照射光，通过光透射区域并固化感光墨; 从外壳中取出薄膜并清洁未固化的感光油墨; 在外壳中拉丝第一线，并相应地在暴露区域形成第一线; 覆盖部分第一线和拉丝第二线，第二线与第一线的一部分交叉。

7. 发明授权

US07495374B2 Electron amplification plate for field emission display device 失效
标题翻译：用于场发射显示装置的电子放大板
公开(公告)号：US07495374B2
公开(公告)日：2009-02-24
申请号：US11455761
申请日：2006-06-20
申请人： Chi-Tsung Lo , Tzung-Han Yang , Jeng-Maw Chiou , Shy-Wen Lai , Cheng-Feng Lin , Chao-Hsun Lin
发明人： Chi-Tsung Lo , Tzung-Han Yang , Jeng-Maw Chiou , Shy-Wen Lai , Cheng-Feng Lin , Chao-Hsun Lin
IPC分类号： H01J29/70
CPC分类号： H01J29/023 , H01J29/085 , H01J29/467 , H01J29/482 , H01J2329/00
摘要： The present invention provides an electron amplification plate placed between a first substrate and a second substrate of a field emission display device. The electron amplification plate comprises at least two insulating layers for electrical insulation; and at least one conductive electrode layer having plural apertures, wherein the conductive electrode layer is sandwiched between the insulating layers. The surface of the inner wall of the apertures is coated with an electron-amplifying material for multiplying the quantity of electrons as the surface is impacted. The inner wall of each aperture comprises an upper concave wall and a lower concave wall, and the lower concave wall is used for collecting electrons, and the upper concave wall is used for focusing electrons. Thereby, the electron beam emitted from the emitters can be effectively amplified, and color purity of the field emission display device is high.
摘要翻译：本发明提供了放置在场发射显示装置的第一基板和第二基板之间的电子放大板。电子放大板包括用于电绝缘的至少两个绝缘层; 以及具有多个孔的至少一个导电电极层，其中，所述导电电极层夹在所述绝缘层之间。孔的内壁的表面涂覆有电子放大材料，用于在表面受到冲击时乘以电子量。每个孔的内壁包括上凹壁和下凹壁，并且下凹壁用于收集电子，并且上凹壁用于聚焦电子。从而能够有效地放大从发射体发射的电子束，场致发射显示装置的色纯度高。

8. 发明申请

US20060290252A1 Electron amplification plate for field emission display device 失效
公开(公告)号：US20060290252A1
公开(公告)日：2006-12-28
申请号：US11455761
申请日：2006-06-20
申请人： Chi-Tsung Lo , Tzung-Han Yang , Jeng-Maw Chiou , Shy-Wen Lai , Cheng-Feng Lin , Chao-Hsun Lin
发明人： Chi-Tsung Lo , Tzung-Han Yang , Jeng-Maw Chiou , Shy-Wen Lai , Cheng-Feng Lin , Chao-Hsun Lin
IPC分类号： H01J43/00 , H01J31/48
CPC分类号： H01J29/023 , H01J29/085 , H01J29/467 , H01J29/482 , H01J2329/00
摘要： The present invention provides an electron amplification plate placed between a first substrate and a second substrate of a field emission display device. The electron amplification plate comprises at least two insulating layers for electrical insulation; and at least one conductive electrode layer having plural apertures, wherein the conductive electrode layer is sandwiched between the insulating layers. The surface of the inner wall of the apertures is coated with an electron-amplifying material for multiplying the quantity of electrons as the surface is impacted. The inner wall of each aperture comprises an upper concave wall and a lower concave wall, and the lower concave wall is used for collecting electrons, and the upper concave wall is used for focusing electrons. Thereby, the electron beam emitted from the emitters can be effectively amplified, and color purity of the field emission display device is high.

9. 发明申请

US20120324976A1 METHOD OF FORGING ALUMINUM/ALUMINUM ALLOYS 审中-公开
标题翻译：锻造铝/铝合金的方法
公开(公告)号：US20120324976A1
公开(公告)日：2012-12-27
申请号：US13308660
申请日：2011-12-01
申请人： LI LONG , CHAO-HSUN LIN
发明人： LI LONG , CHAO-HSUN LIN
IPC分类号： B21J13/02 , B23P17/00 , B21J1/06
CPC分类号： B21K23/00 , B21J1/06 , B21K29/00
摘要： A method of forging aluminum/aluminum alloys includes: providing an aluminum/aluminum alloy billet; providing a forging die, the forging die including an upper die and a lower die, the upper die and the lower die being all mounted with heating element and temperature controller; locating the aluminum/aluminum alloy billet in the forging die; heating the upper die and the lower die and making the temperature difference between the upper die and the lower die be about 100° C.-350° C.; forging the aluminum/aluminum alloy billet to get an aluminum/aluminum alloy forged piece, the temperature difference between the upper die and the lower die being kept at about 100° C.-350° C. during the forging process; and opening the upper die and the lower die to remove out the aluminum/aluminum alloy forged piece.
摘要翻译：铝/铝合金锻造方法包括：提供铝/铝合金坯料; 提供锻模，所述锻模包括上模和下模，所述上模和下模全部安装有加热元件和温度控制器; 将铝/铝合金坯料定位在锻造模具中; 加热上模和下模，使上模与下模之间的温度差约为100℃-350℃。锻造铝/铝合金坯料得到铝/铝合金锻件，锻模过程中上模和下模之间的温差保持在约100℃-350℃; 并打开上模和下模以除去铝/铝合金锻件。

10. 发明申请

US20110234063A1 HOUSING OF ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME 审中-公开
标题翻译：电子设备的壳体及其制造方法
公开(公告)号：US20110234063A1
公开(公告)日：2011-09-29
申请号：US12909949
申请日：2010-10-22
申请人： BIN LI , KAI SHI , CHAO-HSUN LIN
发明人： BIN LI , KAI SHI , CHAO-HSUN LIN
IPC分类号： H05K5/00 , B32B37/16 , B23P11/00 , B23P19/00 , B23K26/00
CPC分类号： B23K26/244 , B23K2103/05 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B23K2103/18 , B23K2103/20 , B23K2103/24 , B23K2103/42 , Y10T29/49826 , Y10T29/49833
摘要： A housing of electronic device includes a main plate and a metal peripheral wall, the peripheral wall is fabricated by cold drawn and secured to the periphery of the main plate.
摘要翻译：电子装置的壳体包括主板和金属周壁，周壁通过冷拉制成并固定到主板的周边。

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