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    • 2. 发明授权
    • Watermarking method and apparatus for tracking hacked content and method and apparatus for blocking hacking of content using the same
    • 用于跟踪被黑内容的水印方法和装置,以及用于阻止使用该内容的内容的黑客攻击的方法和装置
    • US09384332B2
    • 2016-07-05
    • US13421181
    • 2012-03-15
    • Jun-bum ShinByung-ho Cha
    • Jun-bum ShinByung-ho Cha
    • G06F11/00G06F21/10G06F21/16
    • G06F21/10G06F21/16
    • Watermarking method and apparatus for tracking hacking and method and apparatus for blocking hacking of content are provided. The watermarking method includes: obtaining device information from a reception device, with which content is shared, through a determined network channel; generating watermark data based on the obtained device information; and generating watermarked multimedia content by inserting the generated watermark data into content. The method of blocking hacking of content includes: if hacked content is found, detecting watermark data from the hacked content; detecting transmission and reception device information from the detected watermark data; and extracting a progress route of the content based on the detected transmission and reception device information and performing revocation on a hacked device.
    • 提供了用于跟踪黑客的水印方法和装置,以及用于阻止黑客入侵的方法和装置。 水印方法包括:通过确定的网络信道从接收设备获取与哪个内容共享的设备信息; 基于获得的设备信息生成水印数据; 以及通过将生成的水印数据插入到内容中来产生水印多媒体内容。 拦截内容黑客的方法包括:如果发现被黑内容,则从被黑内容中检测水印数据; 从检测到的水印数据中检测发送和接收设备信息; 以及基于检测到的发送和接收设备信息提取内容的进行路由,并在被黑客设备上执行撤销。
    • 5. 发明授权
    • Method of manufacturing a printed circuit board
    • 印刷电路板的制造方法
    • US08220149B2
    • 2012-07-17
    • US12230101
    • 2008-08-22
    • Hee-Bum ShinJeong-Ho MoonJae-Hyun EomJee-Soo Mok
    • Hee-Bum ShinJeong-Ho MoonJae-Hyun EomJee-Soo Mok
    • H01K3/10
    • H05K3/107H05K3/0023H05K3/045H05K3/423H05K3/426H05K2201/0376H05K2201/09563H05K2203/0353Y10T29/49126Y10T29/49165
    • A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include a first insulation layer, a second insulation layer stacked over the first insulation layer, a circuit pattern and a via land buried in the second insulation layer, and a via made of a conductive material penetrating the first insulation layer and integrated with the via land. The circuit pattern and via land can be buried in the insulation material, and the circuit pattern, via land, and via can be formed simultaneously as an integrated structure. Thus, the electrical reliability between the wiring pattern and the via can be increased, the heat-releasing effect of the via can be improved, and the procedure for forming the circuit patterns, via lands, and vias can be simplified, allowing greater productivity in manufacturing the substrate.
    • 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括第一绝缘层,堆叠在第一绝缘层上的第二绝缘层,埋在第二绝缘层中的电路图案和通孔焊盘,以及由穿透第一绝缘层的导电材料制成的通孔,以及 与通路地相结合。 电路图案和通孔焊盘可以埋在绝缘材料中,并且电路图案,通过焊盘和通孔可以作为一体结构同时形成。 因此,可以提高布线图案和通孔之间的电可靠性,可以提高通孔的散热效果,并且可以简化通过焊盘和通孔形成电路图案的步骤,从而提高生产率 制造基板。