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1. 发明授权

US07976317B2 Low profile modular electrical connectors and systems 有权
标题翻译：薄型模块化电气连接器和系统
公开(公告)号：US07976317B2
公开(公告)日：2011-07-12
申请号：US11999069
申请日：2007-12-04
申请人： Arvind Patel , Bratislav Kostic , Daniel McGowan , Kenneth Stead , Mark M. Data
发明人： Arvind Patel , Bratislav Kostic , Daniel McGowan , Kenneth Stead , Mark M. Data
IPC分类号： H01R12/00
CPC分类号： H01R12/7088
摘要： Power connector modules are provided that can be plug connectors, receptacle connectors, or a system of plug and receptacle connector modules and optionally other modules, that mate together. Each connector has an uncoupled contact feature. The uncoupled contacts have exposed surfaces to dissipate heat resulting from Joule effects. The uncoupled contacts for the plug connector converge to form a blade structure at one side. The uncoupled contacts for the receptacle connector form a receiving section that engages the blade structure of the plug connector when the plug connector and receptacle connector are used together.
摘要翻译：提供的电源连接器模块可以是插头连接器，插座连接器，或插头和插座连接器模块以及可选的其他模块的系统。每个连接器都具有非耦合接触特征。非耦合触点具有暴露的表面以散发由焦耳效应引起的热量。用于插头连接器的非耦合触头在一侧汇合成一个叶片结构。当插头连接器和插座连接器一起使用时，用于插座连接器的非耦合触点形成接合部分，其接合插头连接器的叶片结构。

2. 发明申请

US20070153485A1 Electronic control enclosure 有权
公开(公告)号：US20070153485A1
公开(公告)日：2007-07-05
申请号：US11716964
申请日：2007-03-12
申请人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
发明人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K5/0039 , H05K5/061 , H05K7/20854
摘要： The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

3. 发明申请

US20070147004A1 Electronic control enclosure 审中-公开
公开(公告)号：US20070147004A1
公开(公告)日：2007-06-28
申请号：US11706908
申请日：2007-02-13
申请人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
发明人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K5/0039 , H05K5/061 , H05K7/20854
摘要： The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

4. 发明申请

US20090142953A1 Low profile modular electrical connectors and systems 有权
标题翻译：薄型模块化电气连接器和系统
公开(公告)号：US20090142953A1
公开(公告)日：2009-06-04
申请号：US11999069
申请日：2007-12-04
申请人： Arvind Patel , Bratislav Kostic , Daniel McGowan , Kenneth Stead , Mark M. Data
发明人： Arvind Patel , Bratislav Kostic , Daniel McGowan , Kenneth Stead , Mark M. Data
IPC分类号： H01R13/631
CPC分类号： H01R12/7088
摘要： Power connector modules are provided that can be plug connectors, receptacle connectors, or a system of plug and receptacle connector modules and optionally other modules, that mate together. Each connector has an uncoupled contact feature. The uncoupled contacts have exposed surfaces to dissipate heat resulting from Joule effects. The uncoupled contacts for the plug connector converge to form a blade structure at one side. The uncoupled contacts for the receptacle connector form a receiving section that engages the blade structure of the plug connector when the plug connector and receptacle connector are used together.
摘要翻译：提供的电源连接器模块可以是插头连接器，插座连接器，或插头和插座连接器模块以及可选的其他模块的系统。每个连接器都具有非耦合接触特征。非耦合触点具有暴露的表面以散发由焦耳效应引起的热量。用于插头连接器的非耦合触头在一侧汇合成一个叶片结构。当插头连接器和插座连接器一起使用时，用于插座连接器的非耦合触点形成接合部分，其接合插头连接器的叶片结构。

5. 发明申请

US20070153484A1 Electronic control enclosure 有权
公开(公告)号：US20070153484A1
公开(公告)日：2007-07-05
申请号：US11716915
申请日：2007-03-12
申请人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
发明人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K5/0039 , H05K5/061 , H05K7/20854
摘要： The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.

6. 发明授权

US07190589B2 Electronic control enclosure 有权
标题翻译：电子控制外壳
公开(公告)号：US07190589B2
公开(公告)日：2007-03-13
申请号：US10968438
申请日：2004-10-19
申请人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
发明人： Arturo Caines , Bratislav Kostic , Thaddeus Rachwalski
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K5/0039 , H05K5/061 , H05K7/20854
摘要： The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.
摘要翻译：电子控制箱包括用于从电子控制单元的电子部件移除热能的装置和方法。部件被安装到基板上，并被保护地容纳在环境密封的外壳壳体的内部室中。通过包括插头插座的插头组件与组件建立电气通信。为了从壳体外壳移除部件产生的热量，一个或多个散热器通过外壳壳体设置，使得散热器具有暴露于内部室的内表面和暴露于外壳壳体外部的外表面。在其他实施例中，外壳壳体可以由导热材料制成，并且散热器与外壳壳体是一体的。在一个方面，弹簧将部件推向内表面。在另一方面，组件安装到内表面并直接接触内表面。

7. 发明授权

US07542294B2 Electronic control enclosure 有权
标题翻译：电子控制外壳
公开(公告)号：US07542294B2
公开(公告)日：2009-06-02
申请号：US11716915
申请日：2007-03-12
申请人： Arturo Caines , Bratislav Kostic , Thaddeus Michael John Rachwalski
发明人： Arturo Caines , Bratislav Kostic , Thaddeus Michael John Rachwalski
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K5/0039 , H05K5/061 , H05K7/20854
摘要： The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.
摘要翻译：电子控制箱包括用于从电子控制单元的电子部件移除热能的装置和方法。部件被安装到基板上，并被保护地容纳在环境密封的外壳壳体的内部室中。通过包括插头插座的插头组件与组件建立电气通信。为了从外壳壳体移除由部件产生的热量，一个或多个散热器穿过外壳壳体设置，使得散热器具有暴露于内部室的内表面和暴露于外壳壳体外部的外表面。在其他实施例中，外壳壳体可以由导热材料制成，并且散热器与外壳壳体是一体的。在一个方面，弹簧将部件推向内表面。在另一方面，组件安装到内表面并直接接触内表面。

8. 发明授权

US07369413B2 Electronic control enclosure 有权
标题翻译：电子控制外壳
公开(公告)号：US07369413B2
公开(公告)日：2008-05-06
申请号：US11716964
申请日：2007-03-12
申请人： Arturo Caines , Bratislav Kostic , Thaddeus Michael John Rachwalski
发明人： Arturo Caines , Bratislav Kostic , Thaddeus Michael John Rachwalski
IPC分类号： H05K7/20
CPC分类号： H05K7/2049 , H05K5/0039 , H05K5/061 , H05K7/20854
摘要： The electronic control enclosure includes devices and methods for removing heat energy from the electronic components of an electronic control unit. The components are mounted to a substrate and are protectively housed in an interior chamber of an environmentally sealed enclosure housing. Electrical communication is established with the components via a header assembly that includes plug receptacles. To remove heat generated by the components from the enclosure housing, one or more heat sinks are disposed through the enclosure housing such that the heat sinks have an interior surface exposed to the interior chamber and an exterior surface exposed to the exterior of the enclosure housing. In other embodiments, the enclosure housing may be made of a heat conductive material and the heat sink is integral with the enclosure housing. In one aspect, a spring urges the components against the interior surface. In another aspect, the components are mounted to and directly contact the interior surface.
摘要翻译：电子控制箱包括用于从电子控制单元的电子部件移除热能的装置和方法。部件被安装到基板上，并被保护地容纳在环境密封的外壳壳体的内部室中。通过包括插头插座的插头组件与组件建立电气通信。为了从壳体外壳移除部件产生的热量，一个或多个散热器通过外壳壳体设置，使得散热器具有暴露于内部室的内表面和暴露于外壳壳体外部的外表面。在其他实施例中，外壳壳体可以由导热材料制成，并且散热器与外壳壳体是一体的。在一个方面，弹簧将部件推向内表面。在另一方面，组件安装到内表面并直接接触内表面。

9. 发明授权

US08435047B2 Modular connectors with easy-connect capability 有权
公开(公告)号：US08435047B2
公开(公告)日：2013-05-07
申请号：US11999068
申请日：2007-12-04
申请人： Arvind Patel , Bratislav Kostic , Kenneth M. Stiles , Ron Fox
发明人： Arvind Patel , Bratislav Kostic , Kenneth M. Stiles , Ron Fox
IPC分类号： H01R12/00
CPC分类号： H01R13/743 , H01R12/716 , H01R12/724 , H01R12/732 , H01R13/514 , H01R13/6456
摘要： Modular connectors are provided that have a modular receptacle connector assembly matable with a modular plug connector assembly for connecting AC or DC power connectors and electrical signals including board-to-board and wire-to-board connection. Provided is a “pass through” modular component to facilitate connection and disconnection of only the power supply for service without disconnecting the entire system. The wire connector also may load to the main housing thus obviating the need for a panel mount. Also provided is a one-unit modular connector system with either a coplanar or a right-angle design. Furthermore, multiple AC and/or DC power supplies can be provided that utilize minimum board space.

10. 发明申请

US20090142970A1 Modular connectors with easy-connect capability 有权
标题翻译：具有易于连接功能的模块化连接器
公开(公告)号：US20090142970A1
公开(公告)日：2009-06-04
申请号：US11999068
申请日：2007-12-04
申请人： Arvind Patel , Bratislav Kostic , Kenneth M. Stiles , Ron Fox
发明人： Arvind Patel , Bratislav Kostic , Kenneth M. Stiles , Ron Fox
IPC分类号： H01R9/22
CPC分类号： H01R13/743 , H01R12/716 , H01R12/724 , H01R12/732 , H01R13/514 , H01R13/6456
摘要： Modular connectors are provided that have a modular receptacle connector assembly matable with a modular plug connector assembly for connecting AC or DC power connectors and electrical signals including board-to-board and wire-to-board connection. Provided is a “pass through” modular component to facilitate connection and disconnection of only the power supply for service without disconnecting the entire system. The wire connector also may load to the main housing thus obviating the need for a panel mount. Also provided is a one-unit modular connector system with either a coplanar or a right-angle design. Furthermore, multiple AC and/or DC power supplies can be provided that utilize minimum board space.
摘要翻译：提供了具有模块化插座连接器组件的模块化连接器组件，其具有用于连接AC或DC电源连接器的模块化插头连接器组件以及包括板对板和线对板连接的电信号。提供了“通过”模块化组件，以便于仅连接和断开用于服务的电源，而不断开整个系统。电线连接器也可以加载到主壳体，从而避免了对面板安装的需要。还提供了具有共面或直角设计的单组件模块化连接器系统。此外，可以提供利用最小电路板空间的多个AC和/或DC电源。

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