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1. 发明授权

US09114897B2 Automatic packing apparatus and automatic packing method using the same 有权
标题翻译：自动包装设备及使用其的自动包装方法
公开(公告)号：US09114897B2
公开(公告)日：2015-08-25
申请号：US13253229
申请日：2011-10-05
申请人： Jin Ho Kim , Byoung Oh Park , Yong Ki Cho , Jong Soo Jeong , Bong Sup Lim , Yun Jin Jung
发明人： Jin Ho Kim , Byoung Oh Park , Yong Ki Cho , Jong Soo Jeong , Bong Sup Lim , Yun Jin Jung
IPC分类号： B65B3/12 , B65B5/02 , B65B43/26 , B65B43/28
CPC分类号： B65B43/265 , B65B5/024 , B65B43/285
摘要： According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
摘要翻译：根据示例性实施例，自动包装设备包括至少一个盒供应单元，其被配置为向上移动盒堆，使得产品插入到盒堆叠的包装箱中，该包装盒是盒堆叠的最上面的盒，入口形成单元，其构造成提升包装箱的上表面以在包装箱的至少一个未粘合侧表面上形成入口;产品供应单元，其被配置为将产品转移到入口; 以及侧表面接合单元，被配置为结合所述包装箱的所述至少一个未结合的侧表面。至少一个未结合的侧表面包括入口，并且包装盒包括插入其中的产品。

2. 发明授权

US08215484B2 Package member for flat panel display apparatus 有权
标题翻译：平板显示设备的封装构件
公开(公告)号：US08215484B2
公开(公告)日：2012-07-10
申请号：US13026322
申请日：2011-02-14
申请人： Bong Sup Lim
发明人： Bong Sup Lim
IPC分类号： B65D85/00
CPC分类号： B65D81/058 , B65D2585/6837
摘要： A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member.
摘要翻译：封装构件包括联接到平板显示装置的一端的第一缓冲构件和联接到平板显示装置的另一端的第二缓冲构件。封装构件还包括由板状构件形成并具有由第一缓冲构件和第二缓冲构件支撑的两端的加强垫。加强构件增加了第一和第二缓冲构件的强度，使得能够更安全地保护包装在包装构件中的平板显示装置。

3. 发明申请

US20120079796A1 AUTOMATIC PACKING APPARATUS AND AUTOMATIC PACKING METHOD USING THE SAME 有权
标题翻译：自动包装装置及其自动包装方法
公开(公告)号：US20120079796A1
公开(公告)日：2012-04-05
申请号：US13253229
申请日：2011-10-05
申请人： Jin Ho Kim , Byoung Oh Park , Yong Ki Cho , Jong Soo Jeong , Bong Sup Lim , Yun Jin Jung
发明人： Jin Ho Kim , Byoung Oh Park , Yong Ki Cho , Jong Soo Jeong , Bong Sup Lim , Yun Jin Jung
IPC分类号： B65B1/04
CPC分类号： B65B43/265 , B65B5/024 , B65B43/285
摘要： According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
摘要翻译：根据示例性实施例，自动包装设备包括至少一个盒供应单元，其被配置为向上移动盒堆，使得产品插入到盒堆叠的包装箱中，该包装盒是盒堆叠的最上面的盒，入口形成单元，其构造成提升包装箱的上表面以在包装箱的至少一个未粘合侧表面上形成入口;产品供应单元，其被配置为将产品转移到入口; 以及侧表面接合单元，被配置为结合所述包装箱的所述至少一个未结合的侧表面。至少一个未结合的侧表面包括入口，并且包装盒包括插入其中的产品。

4. 发明申请

US20120092090A1 COUPLING STRUCTURE FOR MULTI-LAYERED CHIP FILTER, AND MULTI-LAYERED CHIP FILTER WITH THE STRUCTURE 有权
标题翻译：多层芯片滤波器的耦合结构和结构的多层芯片滤波器
公开(公告)号：US20120092090A1
公开(公告)日：2012-04-19
申请号：US13109647
申请日：2011-05-17
申请人： Young Ghyu AHN , Dong Seok PARK , Sang Soo PARK , Sung Jin PARK , Young Sun PARK , Bong Sup LIM
发明人： Young Ghyu AHN , Dong Seok PARK , Sang Soo PARK , Sung Jin PARK , Young Sun PARK , Bong Sup LIM
IPC分类号： H01P1/203
CPC分类号： H01P1/20345 , H01P5/02
摘要： Disclosed herein are a coupling structure for a multi-layered chip filter capable of overcoming a limitation of an existing coupling by improving a coupling structure and a multi-layered chip filter with the structure.The coupling structure according to an exemplary embodiment of the present invention includes: at least two overlap portion patterns each overlapped with a pattern formed on a resonator layer stacked therewith to form at least two overlap areas spaced from each other; and a connecting portion pattern formed by connecting at least three linear lines having a predetermined length to each other to connect the at least two overlap portion patterns to each other.
摘要翻译：这里公开了一种用于通过改进耦合结构来克服现有耦合的限制的多层芯片滤波器的耦合结构和具有该结构的多层芯片滤波器。根据本发明的示例性实施例的耦合结构包括：至少两个重叠部分图案，每个重叠部分图案与形成在其上堆叠的谐振器层上的图案重叠以形成彼此间隔开的至少两个重叠区域; 以及通过将具有预定长度的至少三条线性线彼此连接而形成的连接部分图案，以将至少两个重叠部分图案彼此连接。

5. 发明申请

US20110086216A1 FOAMED RESIN PRODUCT AND FOAMED RESIN MOLDING MACHINE TO MANUFACTURE THE SAME 审中-公开
标题翻译：泡沫树脂产品和泡沫树脂成型机制造相同
公开(公告)号：US20110086216A1
公开(公告)日：2011-04-14
申请号：US12897052
申请日：2010-10-04
申请人： Bong Sup LIM , Nam Chun SONG
发明人： Bong Sup LIM , Nam Chun SONG
IPC分类号： B32B3/26 , B29C44/58 , B29C44/10
CPC分类号： B29C44/585 , B29C44/0446 , Y10T428/249953
摘要： Disclosed is a foamed resin molding machine including a first mold having a first molding surface, a second mold having a second molding surface, and a third mold. A cavity is formed between the first molding surface and the second molding surface, and the third mold is movably mounted with respect to the first molding surface, such that the third mold can protrude into the cavity. The cavity is fillable with resin particles.
摘要翻译：公开了一种发泡树脂成型机，其包括具有第一成型面的第一模具，具有第二成型面的第二模具和第三模具。在第一模制表面和第二模制表面之间形成空腔，并且第三模具相对于第一模制表面可移动地安装，使得第三模具可以突出到模腔中。空腔可以填充树脂颗粒。

6. 发明申请

US20130093556A1 MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20130093556A1
公开(公告)日：2013-04-18
申请号：US13342708
申请日：2012-01-03
申请人： Bong Sup LIM
发明人： Bong Sup LIM
IPC分类号： H01F5/00 , H01B13/22 , H01G4/12
CPC分类号： H01F17/0013 , H01F27/29 , H01G4/002 , H01G4/12 , H01G4/232 , H01G4/30
摘要： There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.
摘要翻译：提供了具有极好的拐角覆盖率和粘合强度的外电极的多层陶瓷电子部件及其制造方法。连接到外部电极的虚拟电极形成在覆盖区域和陶瓷主体的有效区域上。可以获得具有优异角覆盖度和粘合强度的外电极的多层陶瓷电子部件。

7. 发明申请

US20110309895A1 MULTILAYER FILTER 审中-公开
标题翻译：多层过滤器
公开(公告)号：US20110309895A1
公开(公告)日：2011-12-22
申请号：US13022129
申请日：2011-02-07
申请人： Young Ghyu AHN , Sang Soo Park , Dong Seok Park , Sung Jin Park , Yong Sun Park , Bong Sup Lim
发明人： Young Ghyu AHN , Sang Soo Park , Dong Seok Park , Sung Jin Park , Yong Sun Park , Bong Sup Lim
IPC分类号： H03H7/01
CPC分类号： H03H7/01 , H01P1/20345
摘要： A multilayer filter includes: a ceramic body in which a plurality of dielectric layers are laminated; an external ground electrode provided on an outer surface of the ceramic body and connected to a ground; an inductor pattern electrode provided on at least one of the dielectric layers and having one end connected to the external ground electrode; a capacitor pattern electrode provided on at least one of the dielectric layers; an external terminal electrode electrically connecting the inductor pattern electrode to the capacitor pattern electrode and forming a closed loop for generating inductance through the external ground electrode; and a variable dielectric layer provided between the capacitor pattern electrode and the inductor pattern electrode and adjusting a magnitude of inductance generated by the inductor pattern electrode.
摘要翻译：多层过滤器包括：层叠有多个电介质层的陶瓷体; 外部接地电极，设置在陶瓷体的外表面上，并连接到地面; 电感器图案电极，设置在所述电介质层中的至少一个上，并且一端连接到所述外部接地电极; 设置在至少一个所述电介质层上的电容器图案电极; 外部端子电极，电连接电感器图形电极到电容器图案电极，并形成用于通过外部接地电极产生电感的闭环; 以及设置在电容器图案电极和电感器图案电极之间的可变介电层，并且调节由电感器图案电极产生的电感的大小。

8. 发明授权

US09041493B2 Coupling structure for multi-layered chip filter, and multi-layered chip filter with the structure 有权
标题翻译：多层片式滤波器耦合结构，多层芯片滤波器结构
公开(公告)号：US09041493B2
公开(公告)日：2015-05-26
申请号：US13109647
申请日：2011-05-17
申请人： Young Ghyu Ahn , Dong Seok Park , Sang Soo Park , Sung Jin Park , Young Sun Park , Bong Sup Lim
发明人： Young Ghyu Ahn , Dong Seok Park , Sang Soo Park , Sung Jin Park , Young Sun Park , Bong Sup Lim
IPC分类号： H01P1/203 , H01P5/02
CPC分类号： H01P1/20345 , H01P5/02
摘要： A coupling structure for a multi-layered chip filter includes a resonator layer including a resonator pattern with spaced areas and a coupling layer including at least two separated overlap portion patterns overlapped with the spaced areas of the resonator pattern respectively and a connecting portion pattern having multiple linear portions connecting the separated overlap portion patterns in an area not-overlapped with the resonator pattern.
摘要翻译：用于多层芯片滤波器的耦合结构包括谐振器层，包括具有间隔区域的谐振器图案和耦合层，耦合层包括分别与谐振器图案的间隔区域重叠的至少两个分离的重叠部分图案，以及具有多个在与谐振器图案不重叠的区域中连接分离的重叠部分图案的线性部分。

9. 发明申请

US20130063238A1 CHIP INDUCTOR 审中-公开
标题翻译：芯片电感器
公开(公告)号：US20130063238A1
公开(公告)日：2013-03-14
申请号：US13589659
申请日：2012-08-20
申请人： Bong Sup LIM , Yong Sun Park , Yong Un Choi , Sung Jin Park
发明人： Bong Sup LIM , Yong Sun Park , Yong Un Choi , Sung Jin Park
IPC分类号： H01F5/00
CPC分类号： H01F17/0013 , H01F41/041
摘要： Disclosed herein is a laminated chip inductor including: a laminate including a plurality of first sheets having conductive patterns printed thereon and laminated in order; and a sheet having a discrimination via hole and provided on and/or under the laminate.
摘要翻译：本文公开了一种层叠芯片电感器，包括：层压体，其包括多个第一片，其上印有导电图案并依次层叠; 以及具有鉴别通孔并设置在层叠体上和/或下的片材。

10. 发明申请

US20110220543A1 PACKAGE MEMBER FOR FLAT PANEL DISPLAY APPARATUS 有权
标题翻译：平板显示设备的包装会员
公开(公告)号：US20110220543A1
公开(公告)日：2011-09-15
申请号：US13026322
申请日：2011-02-14
申请人： Bong Sup Lim
发明人： Bong Sup Lim
IPC分类号： B65D81/02
CPC分类号： B65D81/058 , B65D2585/6837
摘要： A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member
摘要翻译：封装构件包括联接到平板显示装置的一端的第一缓冲构件和联接到平板显示装置的另一端的第二缓冲构件。封装构件还包括由板状构件形成并具有由第一缓冲构件和第二缓冲构件支撑的两端的加强垫。加强构件增加了第一和第二缓冲构件的强度，使得能够更安全地保护包装在包装构件中的平板显示装置

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