专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US10845379B1 Low power rotational detection methods and apparatus 有权
公开(公告)号：US10845379B1
公开(公告)日：2020-11-24
申请号：US16101276
申请日：2018-08-10
申请人： mCube, Inc.
发明人： Sanjay Bhandari , Kevin Huang
IPC分类号： H04R25/00 , G01P15/08 , A63F13/211 , A63F13/212 , G06F3/0346 , H04R1/10
CPC分类号： G01P15/0888 , A63F13/211 , A63F13/212 , G01P15/0885 , G06F3/0346 , H04R1/1091 , A63F2300/105
摘要： A wearable user device includes a first hearing aid configured to be disposed within a first ear of a user comprising a first MEMS accelerometer, a first magnetometer, and a first power source, wherein the first MEMS accelerometer is configured to determine a first plurality of movement data in response to a first head motion of the user, wherein the first magnetometer configured to determine a second plurality of movement data in response to the first head motion of the user; and wherein the first power source is configured to provide operating power to the first hearing aid, the first MEMS accelerometer, and to the first magnetometer, and a processor coupled to the first hearing aid, wherein the processor is configured to determine a first plurality of rotation data associated with the user in response to the first plurality of movement data and the second plurality of movement data.

2. 发明授权

US10267636B1 Method to test the quality factor of a MEMS gyroscope at chip probe 有权
公开(公告)号：US10267636B1
公开(公告)日：2019-04-23
申请号：US14987685
申请日：2016-01-04
申请人： mCube, Inc.
发明人： Sudheer S. Sridharamurthy , Tony Maraldo , Zheng-Yao Sun , Wenhua Zhang , Te-Hsi Terrence Lee , Sanjay Bhandari , Joseph Rastegar
IPC分类号： G01C19/5684 , B81C99/00
摘要： A method for a MEMS device comprises determining in a computer system, a first driving signal for the MEMS device in response to a first time delay and to a base driving signal, applying the first driving signal to the MEMS device to induce the MEMS device to operate at a first frequency, determining a second driving signal for the MEMS device in response to a second time delay and to the base driving signal, applying the second driving signal to the MEMS device to induce the MEMS device to operate at a second frequency, determining a first quality factor associated with the MEMS device in response to the first frequency and the second frequency, determining a quality factor associated with the MEMS device in response to the first quality factor, and determining whether the quality factor associated with the MEMS device, exceeds a threshold quality factor.

3. 发明授权

US10183860B2 Method to package multiple mems sensors and actuators at different gases and cavity pressures 有权
公开(公告)号：US10183860B2
公开(公告)日：2019-01-22
申请号：US14887622
申请日：2015-10-20
申请人： mCube Inc.
发明人： Wenhua Zhang , Shingo Yoneoka
IPC分类号： B81B7/02 , B81C1/00 , B81B7/00 , H01L21/56 , H01L41/113
摘要： A method for fabricating a multiple MEMS device includes providing a semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel. The first MEMS is encapsulated within the first cavity and the second MEMS device is encapsulated within the second cavity. These devices is encapsulated within a first encapsulation environment at a first air pressure, and encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity is then subjected to a second encapsulating environment at a second air pressure via the channel of the second cavity.

4. 发明授权

US10132630B2 Multi-axis integrated MEMS inertial sensing device on single packaged chip 有权
公开(公告)号：US10132630B2
公开(公告)日：2018-11-20
申请号：US14162718
申请日：2014-01-23
申请人： mCube Inc.
发明人： Terrence Lee , Wenhua Zhang , Sudheer Sridharamurthy , Shingo Yoneoka
IPC分类号： G01C19/5783 , G01C19/56 , G01P1/00 , B81B7/00 , G01P15/18 , G01P15/02 , G01P15/08
摘要： A multi-axis integrated MEMS inertial sensor device. The device can include an integrated 3-axis gyroscope and 3-axis accelerometer on a single chip, creating a 6-axis inertial sensor device. The structure is spatially configured with efficient use of the design area of the chip by adding the accelerometer device to the center of the gyroscope device. The design architecture can be a rectangular or square shape in geometry, which makes use of the whole chip area and maximizes the sensor size in a defined area. The MEMS is centered in the package, which is beneficial to the sensor's temperature performance. Furthermore, the electrical bonding pads of the integrated multi-axis inertial sensor device can be configured in the four corners of the rectangular chip layout. This configuration guarantees design symmetry and efficient use of the chip area.

5. 发明授权

US10107625B2 Integrated inertial sensing device 有权
公开(公告)号：US10107625B2
公开(公告)日：2018-10-23
申请号：US15442488
申请日：2017-02-24
申请人： mCube Inc.
发明人： Sanjay Bhandari , Ali J. Rastegar , Sudheer S. Sridharamurthy
IPC分类号： G01P3/00 , G01C19/5712 , B81B7/02 , B81B7/00
摘要： A CMOS IC substrate can include sense amplifiers, demodulation circuits and AGC loop circuit coupled to the MEMS gyroscope. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude. The system can include charge pumps to create higher voltages as required in the system. The system can incorporate ADC to provide digital outputs that can be read via serial interface such as I2C. The system can also include temperature sensor which can be used to sense and output temperature of the chip and system and can be used to internally or externally compensate the gyroscope sensor measurements for temperature related changes. The CMOS IC substrate can be part of a system which can include a MEMS gyroscope having a MEMS sensor overlying the CMOS IC substrate.

6. 发明授权

US10036635B2 Multi-axis MEMS rate sensor device 有权
公开(公告)号：US10036635B2
公开(公告)日：2018-07-31
申请号：US14163789
申请日：2014-01-24
申请人： mCube Inc.
发明人： Wenhua Zhang , Sudheer Sridharamurthy , Shingo Yoneoka , Terrence Lee
IPC分类号： B81B3/00 , G01C19/574
CPC分类号： G01C19/574
摘要： A MEMS rate sensor device. In an embodiment, the sensor device includes a MEMS rate sensor configured overlying a CMOS substrate. The MEMS rate sensor can include a driver set, with four driver elements, and a sensor set, with six sensing elements, configured for 3-axis rotational sensing. This sensor architecture allows low damping in driving masses and high damping in sensing masses, which is ideal for a MEMS rate sensor design. Low driver damping is beneficial to MEMS rate power consumption and performance, with low driving electrical potential to achieve high oscillation amplitude.

7. 发明授权

US09975759B2 Method and structure of MEMS PLCSP fabrication 有权
公开(公告)号：US09975759B2
公开(公告)日：2018-05-22
申请号：US15647107
申请日：2017-07-11
申请人： mCube, Inc.
发明人： Chien Chen Lee , Tzu Feng Chang
IPC分类号： H01L29/66 , B81B7/00 , B81C1/00 , G01P15/08 , G01R33/02 , G01C19/5783 , G01L1/00 , B81B3/00 , G01L9/00 , G01C19/5719
CPC分类号： B81B7/0074 , B81B3/0035 , B81B3/0062 , B81B3/0072 , B81B7/0032 , B81B7/0045 , B81B7/0048 , B81B7/0051 , B81B7/0054 , B81B7/0077 , B81B2201/0235 , B81B2201/0242 , B81B2201/025 , B81B2201/0264 , B81B2207/012 , B81C1/00134 , B81C1/00158 , B81C1/0023 , B81C1/00261 , B81C1/00269 , B81C2203/0792 , G01C19/5719 , G01C19/5783 , G01L1/00 , G01L9/0042 , G01L19/0069 , G01L19/147 , G01P15/0802 , G01R33/02 , H04R2201/003
摘要： A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

8. 发明申请

US20170248628A1 MULTIPLE MEMS DEVICE AND METHODS 审中-公开
公开(公告)号：US20170248628A1
公开(公告)日：2017-08-31
申请号：US15444162
申请日：2017-02-27
申请人： mCube, Inc.
发明人： Sanjay BHANDARI , Ken WANG , Ben LEE
IPC分类号： G01P15/08 , B81B7/00
CPC分类号： G01P15/08 , B81B7/0074 , B81B7/0087 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , G01P15/0802 , H01L2224/32145 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.

9. 发明授权

US09377487B2 Transducer structure and method for MEMS devices 有权
公开(公告)号：US09377487B2
公开(公告)日：2016-06-28
申请号：US13922539
申请日：2013-06-20
申请人： mCube Inc.
发明人： Daniel N. Koury, Jr. , Sudheer Sridharamurthy
IPC分类号： H01G7/00 , G01R3/00 , G01P15/125 , B81B3/00 , G01C19/5783 , G01P15/08
CPC分类号： G01R3/00 , B81B3/0072 , B81B2203/0163 , B81B2203/0307 , G01C19/5783 , G01P15/125 , G01P2015/0857 , Y10T29/49007
摘要： An improved MEMS transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region. At least one intermediate anchor structure is disposed within the inner surface region. The apparatus includes an intermediate spring structure operably coupled to the central anchor structure, and at least one portion of the inner surface region. A capacitor element is disposed within the inner surface region.

10. 发明授权

US09377308B2 Indoor map data as a recalibration source for low-cost MEMS inertial navigation 有权
标题翻译：室内地图数据作为低成本MEMS惯性导航的重新校准源
公开(公告)号：US09377308B2
公开(公告)日：2016-06-28
申请号：US13758707
申请日：2013-02-04
申请人： mCube, Incorporated
发明人： Joe Kelly , Jobe Price , Rahul Bakshi , Mark D. Schneider
IPC分类号： G01C21/16 , G01C21/20 , G01C25/00
CPC分类号： G01C21/16 , G01C21/206 , G01C25/005
摘要： A computer-implemented method for determining an estimated user location performed on a computer system programmed to perform the method includes determining in physical sensors, movements in response to movement of the computer system, determining in a processor a physical context, in response to the movements, determining in the processor whether the physical context is substantially similar to a map-based context associated with a location on the map, when a map-based context is substantially similar to the physical context, the method includes determining in the processor the location on the map associated with the map-based context, determining in the processor a graphical user interface in response to the location on the map, and displaying the graphical user interface on a display of the computer system.
摘要翻译：用于确定在被编程为执行该方法的计算机系统上执行的估计用户位置的计算机实现的方法包括在物理传感器中确定响应于计算机系统的移动的移动，响应于该运动在处理器中确定物理上下文在所述处理器中确定所述物理上下文是否基本上类似于与所述地图上的位置相关联的基于地图的上下文，当基于地图的上下文基本上类似于所述物理上下文时，所述方法包括在所述处理器中确定位置所述地图与所述基于地图的上下文相关联，在所述处理器中确定响应于所述地图上的位置的图形用户界面，以及在所述计算机系统的显示器上显示所述图形用户界面。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式