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    • 1. 发明授权
    • Method of receiving small-sized electronic parts
    • 接收小型电子零件的方法
    • US4702788A
    • 1987-10-27
    • US853211
    • 1986-04-17
    • Tokujiro Okui
    • Tokujiro Okui
    • B65B15/04B65D73/02H05K13/04B32B31/00
    • H05K13/0417Y10T156/1056Y10T156/1064Y10T156/1082Y10T156/1168Y10T428/1476Y10T428/24331
    • A number of holes for individually receiving small-sized electronic parts such as chip capacitors and ceramic capacitors are formed in a strip of carrier tape to preserve these parts. The carrier tape is made of a strip of base material and a strip of double-sided adhesive tape stuck on one surface of the base material such that the area of each portion of the adhesive layer exposed through the holes is smaller than the area of each hole. The base material is made of an electrically conductive material. Alternatively, the base material may be made of nonconductive material and the surface may be treated so as to be electrically conductive. Incisions are formed in the adhesive layer to facilitate removal of the adhesive in withdrawing the electronic parts from the tape. When the electronic parts are inserted in the holes, they are stuck on the adhesive layer, and then the tape is wound on a reel for storgage.
    • 用于单独接收诸如片状电容器和陶瓷电容器的小尺寸电子部件的多个孔形成在载带条中以保持这些部件。 载带由基材条和粘贴在基材的一个表面上的双面胶带形成,使得通过孔露出的粘合剂层的每个部分的面积小于每个部分的面积 孔。 基材由导电材料制成。 或者,基材可以由非导电材料制成,并且表面可以被处理以便导电。 在粘合剂层中形成切口,以有助于从胶带中取出电子部件中的粘合剂。 当电子部件插入孔中时,将它们粘贴在粘合剂层上,然后将带卷绕在用于存放的卷轴上。