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    • 2. 发明授权
    • Process for bonding magnetic heads
    • 粘结磁头的方法
    • US3672045A
    • 1972-06-27
    • US3672045D
    • 1970-04-29
    • SURFACE TECHNOLOGY CORP
    • ROBERTSON DAVID D
    • G11B5/235G11B5/42
    • G11B5/235Y10T29/49039
    • A process is disclosed for bonding magnetic heads by forming a low magnetic permeability spacer between pole pieces of a magnetic head. A primary gap material is deposited, preferably by R.F. sputtering, on the pole pieces. A bonding layer is deposited over the primary gap material, also preferably by R.F. sputtering. The thus coated pole pieces are vacuum degassed and heated to a temperature in the range of 150* to 450* C. The bonding layers are then mated and a pressure of from 50 to 100 psi is applied and held between 1/2 and 4 hours. Any material which has a relatively low magnetic permeability and can be applied by R.F. sputtering or thermal evaporation is suitable for the primary gap material. The bonding layer is formed of either copper, silver, gold or titanium, or any material which produces a good diffusion bond under the above conditions.
    • 公开了一种用于通过在磁头的磁极片之间形成低磁导率间隔物来结合磁头的方法。 主要间隙材料被沉积,优选地由R.F. 溅射,在极片上。 粘合层沉积在初级间隙材料上,也优选地由R.F. 溅射。 将如此涂覆的极片真空脱气并加热至150℃至450℃的温度。接合层然后配合,施加50至100psi的压力并保持在1/2至4小时 。 任何具有较低磁导率并可由R.F.施加的材料。 溅射或热蒸发适用于初级间隙材料。 接合层由铜,银,金或钛形成,或在上述条件下产生良好扩散接合的任何材料。