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1. 发明申请

US20130189801A1 ADVANCED FINISHING CONTROL 审中-公开
标题翻译：高级完成控制
公开(公告)号：US20130189801A1
公开(公告)日：2013-07-25
申请号：US13741256
申请日：2013-01-14
申请人： SEMCON TECH, LLC
发明人： Charles J. Molnar
IPC分类号： H01L21/66 , H01L21/306
CPC分类号： H01L22/12 , B24B37/013 , B24B37/042 , B24B49/04 , H01L21/30625 , H01L21/31053 , H01L21/3212 , H01L22/26
摘要： A finishing operation for a workpiece involves supplying an organic boundary lubricant to an operative finishing interface located between a finishing apparatus finishing element finishing surface and a surface of the workpiece being finished, and sensing in situ finishing information with an operative sensor. A change for a process control parameter is determined using the in situ finishing information, information from metrology equipment operatively coupled to the finishing apparatus, and information related to the finishing apparatus. An operative controller thereafter changes the process control parameter to change a processing control at least in part related to the finishing operation.
摘要翻译：对于工件的精加工操作涉及将有机边界润滑剂供应到位于精加工设备精加工元件精加工表面和正被加工的工件的表面之间的操作完成界面处，以及用操作传感器感测原位完成信息。使用原位整理信息，可操作地耦合到整理装置的计量设备的信息以及与整理装置相关的信息来确定过程控制参数的变化。然后，操作控制器改变处理控制参数，以至少部分地与完成操作相关的改变处理控制。

2. 发明授权

US08353738B2 Advanced finishing control 有权
标题翻译：高级整理控制
公开(公告)号：US08353738B2
公开(公告)日：2013-01-15
申请号：US13136437
申请日：2011-08-01
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： B24B49/00 , B24B51/00
CPC分类号： B24B37/042 , G05B19/41865 , G05B2219/31265 , G05B2219/31415 , G05B2219/45031 , G06Q10/06 , G06Q50/04 , H01L21/67248 , H01L21/68785 , Y02P90/18 , Y02P90/20 , Y02P90/22 , Y02P90/30 , Y02P90/86
摘要： Methods of using in situ finishing information for finishing workpieces and semiconductor wafers are described. Methods of using yield information at least in part related to cost of manufacture for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tracked current in-process cost of manufacture information, or current cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve feedforward and feedback control are discussed. The workpieces can be tracked individually or by process group such as a process batch.
摘要翻译：描述了使用原位精加工信息来完成工件和半导体晶片的方法。描述了至少部分地与完成工件和半导体晶片的制造成本相关的产量信息的方法。讨论了使用当前的制造过程成本信息，跟踪电流在制造信息的过程成本或制造参数的当前成本来改变或改进制造工件的成本。讨论了使用跟踪，使用过程中跟踪信息，包括多种设备的网络和使用原位整理信息的工件的质量或制造成本的可观察的变化。讨论了改变或改进过程控制的工厂，设备和方法。讨论了改变或改进实时过程控制的工厂，设备和方法。讨论了改变或改进前馈和反馈控制的工厂，设备和方法。工件可以单独跟踪，也可以由工艺组进行跟踪，例如工艺批次。

3. 发明授权

US08357286B1 Versatile workpiece refining 有权
标题翻译：多功能工件精制
公开(公告)号：US08357286B1
公开(公告)日：2013-01-22
申请号：US11978346
申请日：2007-10-29
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： C25F3/15
CPC分类号： B24B37/042 , B24B37/005 , H01L21/31053 , H01L21/3212 , H01L22/12 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece.
摘要翻译：讨论了对工件的第一层和第二层进行精制的通用方法。公开了新的精炼方法和精炼装置。新的精炼方法可以帮助提高产量并明显地改变制造工艺的成本。这些方法可以应用于具有非常接近公差的工件，例如半导体晶片。还讨论了新的控制方法。讨论了使用控制器，处理器，计算机和处理器可读存储器件的方法。使用存储信息是对过程控制的变更进行讨论。讨论使用过程模型进行改进。公开了利用来自工件的第一层和第二层的存储信息确定改变的过程控制。改变的过程控制可以对工件的制造成本做出明显的改变。

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