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1. 发明申请

US20020088924A1 Digital laser image recorder 失效
标题翻译：数码激光影像记录仪
公开(公告)号：US20020088924A1
公开(公告)日：2002-07-11
申请号：US10091904
申请日：2002-03-05
申请人： Raytheon Company, a Delware corporation
发明人： John D. Boardman , Mervin L. Gangstead
IPC分类号： H01L027/00
CPC分类号： G11B7/126 , G11B7/0025 , G11B7/0045 , G11B7/0916 , G11B7/12 , G11B7/127 , G11B7/1356 , G11B7/1398 , G11B7/14
摘要： The digital laser image recorder includes a data manipulation and control system which may provide digital data to a digital light source for conversion to an analog modulated light beam. A scanner may also be provided to direct the light beam toward a writing surface which may be disposed on the interior of a rotatable cylinder. A film handling device operable to deliver sheet film to the writing surface may also deliver sheet film from the writing surface to an associated output tray after writing. In another embodiment, beam shaping optics may be provided to convert the analog modulated light beams to collimated beams of a predetermined size and circular distribution. The beam shaping optics may also incorporate a power control filter to control the intensity of the collimated beams. In yet another embodiment, a shutter may be provided. The shutter may have a reflective surface with a first position in which the shutter reflects the light beams away from the scanner, and a second position in which the light beams strike the scanner. A photodiode may also be provided to measure the intensity of the reflected light beams. In still another embodiment, focusing optics may be provided to focus the collimated beams to form laser beams which may be directed toward the scanner.
摘要翻译：数字激光图像记录器包括数据操作和控制系统，其可以将数字数据提供给数字光源以转换为模拟调制光束。还可以提供扫描器以将光束引向可以设置在可旋转圆柱体的内部上的书写表面。可将片状薄膜输送到书写面的薄膜处理装置也可以在书写之后将片状薄膜从写入表面输送到相关的输出托盘。在另一个实施例中，可以提供光束整形光学器件以将模拟调制光束转换成预定尺寸和圆形分布的准直光束。光束整形光学器件还可以并入功率控制滤波器以控制准直光束的强度。在另一个实施例中，可以提供快门。快门可以具有反射表面，其具有第一位置，其中快门将光束反射远离扫描仪，以及第二位置，光束撞击扫描仪。还可以提供光电二极管来测量反射光束的强度。在另一个实施例中，可以提供聚焦光学器件以聚焦准直光束以形成可以被引向扫描仪的激光束。

2. 发明申请

US20020000646A1 Vacuum package fabrication of integrated circuit components 有权
标题翻译：集成电路元件的真空封装制造
公开(公告)号：US20020000646A1
公开(公告)日：2002-01-03
申请号：US09928031
申请日：2001-08-10
申请人： Raytheon Company, a Delware Corporation
发明人： Roland W. Gooch , Thomas R. Schimert
IPC分类号： H01L023/495
CPC分类号： B81B7/0077 , H01L2924/0002 , Y10S438/909 , H01L2924/00
摘要： A method for vacuum packaging MEMS or similar devices during device fabrication comprises forming a plurality of MEMS devices (12), or similar devices, on a device wafer (10). A device sealing ring (16) is formed between the MEMS devices (12) and bonding pads (14) connected to a MEMS device. A solder adhesion layer (24) forms part of the device sealing ring (16) surrounding each MEMS or similar device (12). A lid wafer (30) is formed having a plurality of lid sealing rings (32) corresponding in number and location to the device sealing rings (16). Each lid sealing ring (32) surrounds a cavity (34). The device wafer (30) is aligned with the lid wafer (10) to align each device sealing ring (16) with the corresponding lid sealing ring (32), leaving a gap between the lid wafer (30) and the device wafer (10). The resulting assembly (50) is placed in a vacuum furnace. The vacuum furnace is evacuated and heated to a temperature sufficient to allow outgassing of all surface areas of the lid wafer (30) and the device (10). The device wafer (30) is brought into contact with the lid wafer (10) thereby creating a vacuum package over each MEMS device (12). The assembly (50) is cooled at a rate sufficient to minimize subsequent outgassing of the surfaces while minimizing thermal stresses upon the vacuum package. After the assembly (50) is cooled, each vacuum packaged MEMS device (12) is tested, and the assembly (50) is then diced into individual vacuum packaged MEMS devices (12).
摘要翻译：在器件制造过程中，用于真空封装MEMS或类似器件的方法包括在器件晶片（10）上形成多个MEMS器件（12）或类似器件。在MEMS器件（12）和连接到MEMS器件的接合焊盘（14）之间形成器件密封环（16）。焊接粘合层（24）形成围绕每个MEMS或类似装置（12）的装置密封环（16）的一部分。盖子晶片（30）形成为具有多个对应于设备密封环（16）的数量和位置的盖子密封环（32）。每个盖密封环（32）围绕空腔（34）。器件晶片（30）与盖晶片（10）对准，以使每个器件密封环（16）与相应的盖密封环（32）对齐，在盖晶片（30）和器件晶片（10）之间留有间隙）。将所得的组件（50）放置在真空炉中。将真空炉抽真空并加热到足以使盖晶片（30）和装置（10）的所有表面区域除气的温度。器件晶片（30）与盖晶片（10）接触，从而在每个MEMS器件（12）上形成真空封装。组件（50）以足以使随后的表面脱气最小化的速率被冷却，同时最小化真空包装上的热应力。在组装（50）被冷却之后，测试每个真空封装的MEMS器件（12），然后将组件（50）切成单个真空封装的MEMS器件（12）。

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