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    • 8. 发明申请
    • RF SYSTEM-IN-PACKAGE WITH QUASI-COAXIAL COPLANAR WAVEGUIDE TRANSITION
    • 具有相同共振波导转换的射频系统包装
    • US20150270616A1
    • 2015-09-24
    • US14217682
    • 2014-03-18
    • Peraso Technologies, Inc.
    • Saman JafarlouMohammad Fakharzadeh
    • H01Q13/02H01P5/00H01P11/00H01P3/02
    • H01Q13/02H01P5/107H01Q13/0283Y10T29/49018Y10T29/49165
    • An IC package includes an IC die disposed at a first surface of a substrate, which includes a signal via extending between first and second metal layers. The first metal layer is proximate to the first surface and includes a first coplanar waveguide. The first coplanar waveguide has a first signal line coupling a die bump to the signal via and has a first ground plane co-planar with the first signal line. The second metal layer is proximate to a second surface and includes a second coplanar waveguide that has a second signal line coupling the signal via to a launcher element and has a second ground plane co-planar with the second signal line. The IC package further includes a waveguide channel aperture comprising a region surrounding the launcher element and which is substantially devoid of conductive material and a via fence disposed at a perimeter of the first region.
    • IC封装包括设置在基板的第一表面处的IC管芯,其包括在第一和第二金属层之间延伸的信号通路。 第一金属层靠近第一表面并且包括第一共面波导。 第一共面波导具有将管芯凸起与信号通孔相连的第一信号线,并具有与第一信号线共面的第一接地平面。 第二金属层靠近第二表面并且包括第二共面波导,其具有将信号通孔耦合到发射元件的第二信号线,并具有与第二信号线共面的第二接地平面。 IC封装还包括波导沟道孔,该波导通道孔包括围绕发射器元件的区域,并且其基本上不含导电材料,并且布置在第一区域周边的通孔栅栏。