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2. 发明授权

US4996131A Offset plate with thin chromium layer and method of making 失效
标题翻译：具有薄铬层的胶版和制作方法
公开(公告)号：US4996131A
公开(公告)日：1991-02-26
申请号：US356379
申请日：1989-05-23
申请人： Jean-Marie Nouel
发明人： Jean-Marie Nouel
IPC分类号： B41N1/08
CPC分类号： B41N1/08
摘要： An offset printing plate and method of manufacturing comprising providing a hard, hydrophilic supporting base material of steel, depositing a layer of dull, porous, ink-rejecting chromium directly onto the surface of the steel base material, the chromium layer having a thickness no greater than one micron and being sufficiently thin and porous to permit the desirable properties of hardness and hydrophilicity of the subjacent steel base material to manifest themselves through the chromium layer during printing, and sufficiently thin to permit removal of the chromium layer from a selected area of the offset printing plate by scraping to expose the subjacent surface of the steel base material. A layer of photosensitive resist material is then applied to the plate, the photosensitive resist material being hydrophobic and ink-receptive after insolation and being of sufficient thickness to substantially prevent oxidation of the steel base material through the porous chromium layer during the normal storage period of the offset printing plate prior to use. The chromium may be deposited by immersing the hydrophilic steel base material in the chromium plating solution held at a temperature of between 25.degree. and 35.degree. C. for an initial period of time without a plating current, then applying the plating current, followed by cutting the current to product the dull and porous chromium layer. Alternatively, the chromium deposit may be formed by plating the base material at a temperature of between 5.degree. and 8.degree. C.
摘要翻译：一种胶版印刷版及其制造方法，其特征在于，提供钢的硬质亲水性支撑基材，将一层沉闷，多孔，拒油铬直接沉积在钢基材表面上，铬层厚度不大超过一微米，并且足够薄且多孔，以允许下层钢基材的硬度和亲水性所需的性能在印刷过程中通过铬层表现出来，并且足够薄以允许从层的选定区域去除铬层胶印板通过刮擦暴露出钢基材的下表面。然后将一层感光抗蚀剂材料施加到板上，光敏抗蚀剂材料在日晒之后是疏水性和油墨接受性的，并且具有足够的厚度，以在正常储存期间基本上防止钢基材通过多孔铬层的氧化胶版印刷前使用。可以通过将亲水性钢基材浸入保持在25℃至35℃的镀铬溶液中的初始时间而不具有电镀电镀，然后施加电镀电流，然后切割目前产品的沉积和多孔铬层。或者，铬沉积物可以通过在5℃至8℃的温度下镀覆基材而形成。

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