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1. 发明申请

US20090200250A1 Cleanliness-improved wafer container 审中-公开
标题翻译：清洁度改善晶片容器
公开(公告)号：US20090200250A1
公开(公告)日：2009-08-13
申请号：US12012984
申请日：2008-02-07
申请人： Boris Kesil
发明人： Boris Kesil
IPC分类号： H01L21/673
CPC分类号： H01L21/67373 , H01L21/67366
摘要： A wafer container made from a polymer material with inner walls of the container coated with a thin easily washable wear-resistant and scratch-resistant barrier layer of SiO2 for preventing penetration of products of diffusion of polymers, such as free radicals, into the interior space of the carrier that retains a wafer. The SiO2 coatings on the walls of the container are applied by the PECVD process. The wafer container of the invention can be manufactured at low cost by molding it from a less expensive and lower grade polymer.
摘要翻译：由聚合物材料制成的晶片容器，其容器的内壁涂有薄的易于洗涤的耐磨和耐刮擦的SiO 2阻挡层，用于防止聚合物如自由基扩散产物渗入内部空间的保持晶片的载体。通过PECVD工艺施加容器壁上的SiO 2涂层。本发明的晶片容器可以通过从较便宜和较低级别的聚合物成型而以低成本制造。

2. 发明申请

US20070018469A1 Contamination-free edge gripping mechanism with withdrawable pads and method for loading/unloading and transferring flat objects 审中-公开
标题翻译：无抽吸式边缘夹持机构和装载/卸载和转移平面物体的方法
公开(公告)号：US20070018469A1
公开(公告)日：2007-01-25
申请号：US11188249
申请日：2005-07-25
申请人： Elik Gershenzon , Boris Kesil
发明人： Elik Gershenzon , Boris Kesil
IPC分类号： B65G49/07
CPC分类号： H01L21/68707
摘要： A wafer gripping mechanism of the invention comprises a thin flat body having one linearly moveable and rotating finger for gripping an edge of the flat object and a pair of soft withdrawable object supporting pads. A distinguishing feature of the mechanism of the invention is that the wafer supporting pads are withdrawable for placing the pads into position where they do not project beyond the outlines of the external surface of the insertable portion of the gripper. The absence of elements projecting from the surface of the gripper portion insertable into narrow spaces with high speed protects the gripping mechanism, wafer, chuck, etc. from damage due to possible collision. All the drive and actuation mechanisms that are used for rotation and axial movement of the gripping finger, as well as for rotation of the withdrawable pads are enclosed in a thin hollow casing made from a thin and light-weight sheet metal.
摘要翻译：本发明的晶片夹持机构包括具有一个可直线移动和旋转的指状物的薄平坦体，用于夹持平坦物体的边缘和一对软抽出物体支撑垫。本发明的机构的一个突出特征在于，晶片支撑垫是可取出的，用于将垫放置在不突出超过夹持器的可插入部分的外表面的轮廓的位置。没有从夹持部的表面突出的元件能够高速插入狭窄的空间中，因此能够保护夹持机构，晶片，卡盘等免受可能的碰撞的损坏。用于夹紧手指的旋转和轴向移动以及用于可抽出的垫的旋转的所有驱动和致动机构被封闭在由薄而轻的金属板制成的薄的中空套管中。

3. 发明授权

US06891380B2 System and method for measuring characteristics of materials with the use of a composite sensor 失效
标题翻译：使用复合传感器测量材料特性的系统和方法
公开(公告)号：US06891380B2
公开(公告)日：2005-05-10
申请号：US10449892
申请日：2003-06-02
申请人： Boris Kesil , Leonid Velikov , Yuri Vorobyev
发明人： Boris Kesil , Leonid Velikov , Yuri Vorobyev
IPC分类号： G01B7/06 , G01R27/04 , G01R27/32 , G01R33/12
CPC分类号： G01B7/105
摘要： The system of the invention for measuring characteristics of thin conductive and non-conductive material, such as bulk material or films, is based on the use of a resonance oscillating circuit that incorporates at least two components selected from the group consisting of an inductive coil and a capacitor, which in combination form a sensor that could be approached close to the surface to be measured. The measurement of the film or material characteristics, such as film resistance (film thickness) or a dielectric constant (film thickness) of a non-conductive material, is based on the principle that the sensor is approached to the measured surface at a distance, at which the inductance and capacitance of the sensor generate in the measured material a virtual coil and an additional capacitance, which strongly depend on the characteristics of the measured material. As the sensor approached towards the surface to be measured, the sensor-material system generates a series of resonances having different values of power. One of these resonances can be defined as the so-called full resonance, which is characterized by the maximum value of the power, and hence provides the most accurate measurement and can be used for precisely determining the measurement distance. By comparing the results of measurements with those known from measuring the precalibrated films or materials under the same conditions, it becomes possible to determine the target characteristics of the films or materials.
摘要翻译：用于测量薄导电和非导电材料（例如散装材料或薄膜）的特性的本发明的系统基于使用谐振振荡电路，该谐振振荡电路并入至少两个选自由感应线圈和电容器组合形成可以接近待测表面的传感器。不导电材料的薄膜或材料特性，如薄膜电阻（薄膜厚度）或介电常数（薄膜厚度）的测量是基于传感器距离被测表面接近的原理，传感器的电感和电容在测量材料中产生虚拟线圈和附加电容，这强烈依赖于测量材料的特性。当传感器靠近要测量的表面时，传感器材料系统产生具有不同功率值的一系列谐振。这些共振中的一个可以被定义为所谓的全共振，其特征在于功率的最大值，因此提供最精确的测量并且可以用于精确地确定测量距离。通过将测量结果与在相同条件下测量预校准的膜或材料已知的结果进行比较，可以确定膜或材料的目标特性。

4. 发明申请

US20090241998A1 Apparatus for foam-assisted wafer cleaning with use of universal fluid supply unit 审中-公开
标题翻译：使用通用流体供应单元进行泡沫辅助晶片清洗的设备
公开(公告)号：US20090241998A1
公开(公告)日：2009-10-01
申请号：US12079169
申请日：2008-03-26
申请人： Boris Kesil , Leonid Velikov
发明人： Boris Kesil , Leonid Velikov
IPC分类号： B08B3/10 , B08B13/00
CPC分类号： B08B3/003 , H01L21/02057 , H01L21/67028 , H01L21/67051 , H01L21/67057
摘要： An apparatus for foam-assisted cleaning comprising a closable container with a funnel-shaped working chamber formed between the surface of the semiconductor wafer and the tapered base plate. The apparatus is provided with a fluid supply unit that incorporates a foam generator in the form of conical body with a flat surface on a wider end face of the conical body. This flat surface functions as a deflector for jets of neutral gas ejected onto the deflector and reflected therefrom into the interior of the fluid supply body filled with a foamable liquid. The jets of neutral gas create a zone of reduced pressure that generates gas bubbles which form the foam. The latter is displaced from the foam generator into the working chamber through a Bernoulli nozzle formed by the tip of the conical body and the outlet opening of the foam generator. The foam is formed from de-ionized water, isopropyl alcohol, and, if necessary, a surfactant. In a modified form, the apparatus is provided with a drying unit for generating an IPA/N2 mist for eliminating spots left on the cleaned surface after evaporation of the residual drops of the cleaning liquid.
摘要翻译：一种用于泡沫辅助清洁的装置，其包括形成在半导体晶片的表面和锥形基板之间的漏斗形工作室的可关闭容器。该设备设置有流体供应单元，其包括锥形体形式的泡沫发生器，其具有在锥形体的较宽端面上的平坦表面。该平坦表面用作用于喷射到偏转器上的中性气体的射流的偏转器，并从其反射到填充有可发泡液体的流体供应体的内部。中性气体的射流产生一个减压区，产生形成泡沫的气泡。后者通过由锥形体的尖端和泡沫发生器的出口形成的伯努利喷嘴从泡沫发生器移动到工作室中。泡沫由去离子水，异丙醇和必要时的表面活性剂形成。在改进形式中，该设备设置有干燥单元，用于产生IPA / N 2雾，用于在清洁液体的剩余液滴蒸发后消除残留在清洁表面上的斑点。

5. 发明申请

US20090208669A1 Apparatus and method for application of a thin barrier layer onto inner surfaces of wafer containers 审中-公开
标题翻译：在薄片容器的内表面上施加薄的阻挡层的装置和方法
公开(公告)号：US20090208669A1
公开(公告)日：2009-08-20
申请号：US12070044
申请日：2008-02-15
申请人： Boris Kesil
发明人： Boris Kesil
IPC分类号： C23C16/505 , H05H1/24
CPC分类号： C23C16/509 , C23C16/045 , C23C16/402 , H01J37/321
摘要： A method and apparatus for coating the inner walls of polymer-made wafer containers with a thin silicon dioxide barrier film, which is characterized by good washability and possesses high scratch-resistant and wear-resistant properties. In compliance with requirements of high purity, the barrier layer also protects the surfaces of semiconductor wafers from volatile substances of polymer material of the container walls. The apparatus comprises a base plate and an RF antenna unit that is inserted into the preliminarily sealed and evacuated container. The apparatus is connected to the front side of the container through a standard mechanical interface provided on the facing side of the apparatus. The barrier layer is deposited with the use of a plasma-enhanced chemical-vapor-deposition process as a result of a plasma-chemical reaction in a working gas comprising a mixture of silane with excess oxygen.
摘要翻译：一种用薄的二氧化硅阻隔膜涂覆聚合物制造的晶片容器的内壁的方法和装置，其特征在于具有良好的可洗性并且具有高抗划伤性和耐磨性。根据高纯度的要求，阻挡层还保护半导体晶片的表面免受容器壁的聚合物材料的挥发性物质的影响。该装置包括插入预先密封和抽空的容器中的基板和RF天线单元。该设备通过设置在设备的相对侧上的标准机械接口连接到容器的前侧。通过在包含硅烷与过量氧的混合物的工作气体中的等离子体化学反应的结果，使用等离子体增强化学气相沉积工艺来沉积阻挡层。

6. 发明授权

US06989675B2 Method and apparatus for precision measurement of film thickness 失效
标题翻译：用于精密测量膜厚度的方法和装置
公开(公告)号：US06989675B2
公开(公告)日：2006-01-24
申请号：US10386648
申请日：2003-03-13
申请人： Boris Kesil , Leonid Velikov , Yuri Vorobyev
发明人： Boris Kesil , Leonid Velikov , Yuri Vorobyev
IPC分类号： G01R27/32
CPC分类号： G01B15/02
摘要： An apparatus for measuring thickness in super-thin films consists of a special resonator unit in the form of an open-bottom cylinder which is connected to a microwave swept frequency microwave source via a decoupler and a matching unit installed in a waveguide that connects the resonator unit with the microwave source. The apparatus operates on the principle that thin metal film F, the thickness of which is to be measured, does not contact the end face of the open bottom of the cylindrical resonator sensor unit and functions as a bottom of the cylindrical body. The design of the resonator excludes generation of modes other than the resonance mode and provides the highest possible Q-factor. As the conductivity directly related to the film thickness, it is understood that measurement of the film thickness is reduced to measurement of the resonance peak amplitudes. This means that superhigh accuracy inherent in measurement of the resonance peaks is directly applicable to the measurement of the film thickness or film thickness deviations.
摘要翻译：用于测量超薄膜厚度的装置由开 - 底圆柱体形式的特殊谐振器单元组成，该谐振器单元经由去耦器连接到微波扫频频率微波源，并且匹配单元安装在将谐振器单位与微波源。该装置的工作原理是，其厚度要测量的薄金属薄膜F不与圆柱形谐振器传感器单元的开口底部的端面接触并用作圆柱体的底部。谐振器的设计不包括谐振模式以外的模式的产生，并提供最高可能的Q因子。作为与膜厚度直接相关的电导率，可以理解，膜厚度的测量减小到谐振峰值振幅的测量。这意味着测量共振峰值固有的超高精度直接适用于膜厚度或膜厚偏差的测量。

7. 发明申请

US20090217950A1 Method and apparatus for foam-assisted wafer cleaning 审中-公开
标题翻译：泡沫辅助晶片清洗方法和设备
公开(公告)号：US20090217950A1
公开(公告)日：2009-09-03
申请号：US12074174
申请日：2008-03-03
申请人： Boris Kesil
发明人： Boris Kesil
IPC分类号： B08B13/00 , B08B3/04 , B08B5/00
CPC分类号： B08B3/003 , H01L21/02052 , H01L21/67051
摘要： A foam-assisted wafer-cleaning and drying method and apparatus based on forming a funnel-shaped space between the base plate of the apparatus and the wafer to be cleaned and supplying a foam cleaning liquid to the aforementioned space through the central opening of the base plate for displacing the cleaning liquid foam consisting of a plurality of bubbles from the center of the wafer toward the wafer periphery with a constant speed of movement of the bubbles provided by gradually decrease of distance from the base plate to the wafer in the radial outward direction from the center of the wafer. The nanoparticles of contaminants are caught with a surface-tension force developed by bubble meniscuses on the wafer surface.
摘要翻译：一种泡沫辅助的晶片清洁和干燥方法和装置，其基于在所述装置的基板和待清洁的晶片之间形成漏斗形空间，并且通过所述基座的中心开口将泡沫清洁液体供应到所述空间板，用于将由多个气泡组成的清洁液体泡沫从晶片的中心朝向晶片周边移动，以通过从基板到晶片的径向向外方向的距离逐渐减小而提供的气泡的移动速度恒定从晶圆的中心。污染物的纳米颗粒被在晶片表面上由气泡失效所产生的表面张力卡住。

8. 发明申请

US20090121586A1 Apparatus for transforming inverse piezoelectric effect into rotary motion and method of manufacturing aforementioned apparatus 审中-公开
标题翻译：用于将反压电效应转换成旋转运动的装置以及制造上述装置的方法
公开(公告)号：US20090121586A1
公开(公告)日：2009-05-14
申请号：US11983715
申请日：2007-11-13
申请人： Boris Kesil
发明人： Boris Kesil
IPC分类号： H02N2/12 , H01L41/22
CPC分类号： H02N2/103 , H02N2/002 , H02N2/0065 , Y10T29/42
摘要： An electric motor operating on the principle of conversion of inverse piezoelectric oscillations into continuous rotation. The motor has a stator having a flange that on a bearing rotatingly supports a shaft with a cup-shaped stator attached to the shaft. The flange also supports a ring-shaped piezoelectric element, the outer surface of which is embraced with an elastic band having radial outward blades. The blades abut the inner surface of the rotor and are inclined at an angle that in the point of contact between the tips of the blades and the rotor provides development of a force component in the direction of the rotation of the rotor. The ring-shaped piezoelectric element is fitted onto a collet that compensates for contractions and expansions of the piezoelectric element under the inverse piezoelectric effect.
摘要翻译：电动机的工作原理是将反压电振荡转换为连续旋转。该电动机具有一个定子，该定子具有一个凸缘，该凸缘在轴承上旋转地支撑一个带有安装在轴上的杯形定子的轴。凸缘还支撑环形压电元件，其外表面包括具有径向向外的叶片的弹性带。叶片邻接转子的内表面并且以与叶片的尖端之间的接触点的角度倾斜，并且转子提供在转子的旋转方向上的力分量的显影。环形压电元件安装在夹头上，补偿压电元件在反压电效应下的收缩和膨胀。

9. 发明授权

US07140655B2 Precision soft-touch gripping mechanism for flat objects 失效
公开(公告)号：US07140655B2
公开(公告)日：2006-11-28
申请号：US09944605
申请日：2001-09-04
申请人： Boris Kesil , David Margulis , Elik Gershenzon
发明人： Boris Kesil , David Margulis , Elik Gershenzon
IPC分类号： B66C1/44 , B65G49/07
CPC分类号： B25J9/1633 , G05B2219/37003 , G05B2219/39505 , Y10S414/141
摘要： A precision soft-touch gripping mechanism has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force. Several embodiments relate to different arrangements of gripping rollers and mechanisms for control of the gripping force and speed of gripping required for gripping the wafer with a soft and reliable touch.

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