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1. 发明申请

US20100090707A1 TEST MODULE FOR RADIO FREQUENCY IDENTIFICATION CHIPS AND METHOD OF THE SAME 有权
标题翻译：无线电频率识别卡的测试模块及其方法
公开(公告)号：US20100090707A1
公开(公告)日：2010-04-15
申请号：US12574372
申请日：2009-10-06
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： G01R31/02
CPC分类号： G01R31/2822
摘要： A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.
摘要翻译：提供了一种用于射频识别（RFID）芯片的测试模块和方法。测试模块包括具有用于承载要测试的RFID芯片的芯片载体的测试头，芯片载体具有电子连接RFID芯片的第一天线。该模块还包括用于与第一天线通信的第二天线; 以及支撑芯片载体和第二天线的基座。测试模块还包括电子连接第二天线的测试计算机，其中测试计算机通过第一天线和第二天线之间的通信来评估RFID芯片的功能。

2. 发明申请

US20080066945A1 METHOD FOR MAKING CABLE WITH A CONDUCTIVE BUMP ARRAY, AND METHOD FOR CONNECTING THE CABLE TO A TASK OBJECT 有权
标题翻译：用于制造具有导电BUMP阵列的电缆的方法，以及将电缆连接到任务对象的方法
公开(公告)号：US20080066945A1
公开(公告)日：2008-03-20
申请号：US11945511
申请日：2007-11-27
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01B7/18
CPC分类号： H01L21/563 , G02F1/13452 , H01L2224/73203 , H01L2924/01079 , H05K1/118 , H05K3/244 , H05K3/305 , H05K3/325 , H05K3/361 , H05K2201/0367 , H05K2201/0373 , H05K2201/10977
摘要： A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.
摘要翻译：具有导电凸块的电缆通过在电缆基底上形成具有多个开口的光致抗蚀剂层来制造，在光致抗蚀剂层上涂覆导电层，由此开口中的导电层在电缆基底上的电路处形成凸块，然后除去光致抗蚀剂层。当将电缆连接到诸如LCD玻璃基板或PCB的任务对象时，仅使用通常的不导电浆料来连接电缆和任务对象，而不使用昂贵的各向异性导电膏或膜。

3. 发明授权

US07312142B2 Method for making cable with a conductive bump array, and method for connecting the cable to a task object 有权
标题翻译：用于制造具有导电凸块阵列的电缆的方法，以及用于将电缆连接到任务对象的方法
公开(公告)号：US07312142B2
公开(公告)日：2007-12-25
申请号：US11106151
申请日：2005-04-13
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01L21/44
CPC分类号： H01L21/563 , G02F1/13452 , H01L2224/73203 , H01L2924/01079 , H05K1/118 , H05K3/244 , H05K3/305 , H05K3/325 , H05K3/361 , H05K2201/0367 , H05K2201/0373 , H05K2201/10977
摘要： A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.
摘要翻译：具有导电凸块的电缆通过在电缆基底上形成具有多个开口的光致抗蚀剂层来制造，在光致抗蚀剂层上涂覆导电层，由此开口中的导电层在电缆基底上的电路处形成凸块，然后除去光致抗蚀剂层。当将电缆连接到诸如LCD玻璃基板或PCB的任务对象时，仅使用通常的不导电浆料来连接电缆和任务对象，而不使用昂贵的各向异性导电膏或膜。

4. 发明授权

US07273768B2 Wafer-level package and IC module assembly method for the wafer-level package 有权
标题翻译：晶圆级封装的晶圆级封装和IC模块组装方法
公开(公告)号：US07273768B2
公开(公告)日：2007-09-25
申请号：US11213847
申请日：2005-08-30
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01L21/50 , H01L21/58 , H01L21/60
CPC分类号： H01L23/3114 , H01L21/561 , H01L24/10 , H01L24/11 , H01L24/13 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05639 , H01L2224/05647 , H01L2224/11505 , H01L2224/1184 , H01L2224/11848 , H01L2224/13 , H01L2224/13099 , H01L2224/274 , H01L2224/2784 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： A wafer-level package and an IC module assembly method for a wafer-level package are provided in the present invention. The method comprises forming a metal bump on a wafer, applying a high polymer resin coating to the wafer, grinding a surface of the resin coating, printing an endpoint on the wafer, a grinding and cutting step and bonding the chips to an antenna or substrate with SMT. The present invention can be used to manufacture high quality chips of low cost with mass production to significantly reduce cost and maintain high quality of the products.
摘要翻译：在本发明中提供晶片级封装和晶片级封装的IC模块组装方法。该方法包括在晶片上形成金属凸块，向晶片施加高聚合物树脂涂层，研磨树脂涂层的表面，在晶片上印刷端点，研磨和切割步骤以及将芯片粘合到天线或基底与SMT。本发明可以用于大量生产低成本的高品质芯片，以显着降低成本并保持产品质量。

5. 发明授权

US08344734B2 Test module for radio frequency identification chips and method of the same 有权
标题翻译：射频识别芯片的测试模块及其方法
公开(公告)号：US08344734B2
公开(公告)日：2013-01-01
申请号：US12574372
申请日：2009-10-06
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： G01R31/02
CPC分类号： G01R31/2822
摘要： A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.
摘要翻译：提供了一种用于射频识别（RFID）芯片的测试模块和方法。测试模块包括具有用于承载要测试的RFID芯片的芯片载体的测试头，芯片载体具有电子连接RFID芯片的第一天线。该模块还包括用于与第一天线通信的第二天线; 以及支撑芯片载体和第二天线的基座。测试模块还包括电子连接第二天线的测试计算机，其中测试计算机通过第一天线和第二天线之间的通信来评估RFID芯片的功能。

6. 发明授权

US07943426B2 Package structure for integrated circuit device and method of the same 有权
标题翻译：集成电路器件的封装结构及其方法
公开(公告)号：US07943426B2
公开(公告)日：2011-05-17
申请号：US12421512
申请日：2009-04-09
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/97 , H01L21/561 , H01L21/6835 , H01L23/14 , H01L23/3114 , H01L23/481 , H01L24/24 , H01L24/82 , H01L2221/68336 , H01L2221/68377 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/16 , H01L2224/24226 , H01L2224/2518 , H01L2224/274 , H01L2224/82039 , H01L2224/82047 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/3511 , H01L2224/82 , H01L2924/00
摘要： The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit devices; providing an extendable substrate having a first surface supporting the wafer; forming multiple anti-elongation layers on a second surface of the extendable substrate, the second surface being opposite to the first surface; forming multiple recesses in the wafer for separating the integrated circuit devices from each other; elongating the extendable substrate to enlarge the multiple recesses; and forming an insulating layer to fill the recesses and cover multiple integrated circuit devices.
摘要翻译：本发明公开了一种用于集成电路器件的封装结构及其制造方法。该方法包括向晶片提供多个集成电路器件; 提供具有支撑所述晶片的第一表面的可延伸基板; 在所述可延伸基板的第二表面上形成多个抗延伸层，所述第二表面与所述第一表面相对; 在所述晶片中形成多个凹槽以将所述集成电路器件彼此分离; 伸长可伸缩基片以扩大多个凹槽; 以及形成绝缘层以填充凹部并覆盖多个集成电路器件。

7. 发明授权

US08344500B2 Integrated circuit package module and method of the same 有权
标题翻译：集成电路封装模块及其方法相同
公开(公告)号：US08344500B2
公开(公告)日：2013-01-01
申请号：US12471712
申请日：2009-05-26
申请人： Lu-Chen Hwan , Po Ching Chen
发明人： Lu-Chen Hwan , Po Ching Chen
IPC分类号： H01L23/522
CPC分类号： H01L23/49572 , H01L24/13 , H01L24/16 , H01L2224/13099 , H01L2224/1319 , H01L2224/133 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/01005 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/12041 , H01L2924/12043 , H01L2924/13091 , H01L2924/14 , H01L2924/16195 , H05K3/321 , H05K2201/10666 , H05K2201/10727 , H01L2924/00 , H01L2924/00014
摘要： The present invention discloses an integrated circuit module and method of manufacturing the same. The integrated circuit module includes a chip and a carrier supporting the chip. The carrier defines a front side and a back side, and the chip is disposed on the front side. The carrier includes a first insulating layer defining a first opening at the back side, a second insulating layer defining a second opening and a chip accommodation opening at the front side, and a patterned conductive layer sandwiched in between the first insulating layer and the second insulating layer. The patterned conductive layer is formed with an inner contacting portion exposed through the chip accommodation opening and an outer contacting portion exposed through the first opening and the second opening. The inner contacting portion is connected to the chip through the chip accommodation opening. The outer contacting portion is provided for electronically connecting an electronic device to the patterned conductive layer selectively at the front side through the second opening and at the back side through the first opening.
摘要翻译：本发明公开了一种集成电路模块及其制造方法。集成电路模块包括芯片和支持芯片的载体。载体限定前侧和后侧，并且芯片设置在前侧。载体包括限定在后侧的第一开口的第一绝缘层，限定第二开口的第二绝缘层和在前侧的芯片容纳开口，以及夹在第一绝缘层和第二绝缘层之间的图案化导电层层。图案化导电层形成有通过芯片容纳开口暴露的内部接触部分和通过第一开口和第二开口露出的外部接触部分。内部接触部分通过芯片容纳开口连接到芯片。外部接触部分被设置用于通过第二开口在电子设备和图案化导电层的前侧选择性地连接电子器件，并且通过第一开口在后侧。

8. 发明授权

US07999191B2 Method for making cable with a conductive bump array, and method for connecting the cable to a task object 有权
标题翻译：用于制造具有导电凸块阵列的电缆的方法，以及用于将电缆连接到任务对象的方法
公开(公告)号：US07999191B2
公开(公告)日：2011-08-16
申请号：US11945511
申请日：2007-11-27
申请人： Lu-Chen Hwan
发明人： Lu-Chen Hwan
IPC分类号： H05K1/11 , H05K1/00
CPC分类号： H01L21/563 , G02F1/13452 , H01L2224/73203 , H01L2924/01079 , H05K1/118 , H05K3/244 , H05K3/305 , H05K3/325 , H05K3/361 , H05K2201/0367 , H05K2201/0373 , H05K2201/10977
摘要： A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.
摘要翻译：具有导电凸块的电缆通过在电缆基底上形成具有多个开口的光致抗蚀剂层来制造，在光致抗蚀剂层上涂覆导电层，由此开口中的导电层在电缆基底上的电路处形成凸块，然后除去光致抗蚀剂层。当将电缆连接到诸如LCD玻璃基板或PCB的任务对象时，仅使用通常的不导电浆料来连接电缆和任务对象，而不使用昂贵的各向异性导电膏或膜。

9. 发明申请

US20100229375A1 METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICE HAVING ANTENNA CONDUCTORS 有权
标题翻译：制造具有天线导体的集成电路装置的方法
公开(公告)号：US20100229375A1
公开(公告)日：2010-09-16
申请号：US12715551
申请日：2010-03-02
申请人： Lu-Chen Hwan , P.C. Chen , Yu-Lin Ma
发明人： Lu-Chen Hwan , P.C. Chen , Yu-Lin Ma
IPC分类号： H01P11/00 , H05K3/46
CPC分类号： H01Q23/00 , H01L23/645 , H01L23/66 , H01L24/48 , H01L2223/6677 , H01L2224/48091 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/13091 , H01L2924/14 , H01L2924/19015 , Y10T29/49016 , Y10T29/49018 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49155 , Y10T29/49169 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for manufacturing an integrated circuit device having antenna conductors is provided. The method includes the steps of providing a wafer with a plurality of integrated circuit components; forming a first antenna conductor on the surface of each integrated circuit component; forming a plurality of metal bumps above the first antenna conductor; coating an insulating layer to encapsulate the plurality of integrated circuit components and to cover the plurality of metal bumps; removing a portion of the insulating layer to expose a top portion of each metal bump; and forming a second antenna conductor on the insulating layer by screen printing.
摘要翻译：提供一种具有天线导体的集成电路装置的制造方法。该方法包括以下步骤：为晶片提供多个集成电路部件; 在每个集成电路部件的表面上形成第一天线导体; 在所述第一天线导体上方形成多个金属凸块; 涂覆绝缘层以封装所述多个集成电路部件并覆盖所述多个金属凸块; 去除所述绝缘层的一部分以暴露每个金属凸块的顶部; 以及通过丝网印刷在所述绝缘层上形成第二天线导体。

10. 发明授权

US07772698B2 Package structure for integrated circuit device 有权
标题翻译：集成电路器件封装结构
公开(公告)号：US07772698B2
公开(公告)日：2010-08-10
申请号：US12116152
申请日：2008-05-06
申请人： Lu-Chen Hwan , Yu-Lin Ma , P. C. Chen
发明人： Lu-Chen Hwan , Yu-Lin Ma , P. C. Chen
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/28 , H01L23/02
CPC分类号： H01L24/12 , H01L23/3114 , H01L23/3185 , H01L24/11 , H01L24/16 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05166 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/1191 , H01L2224/12105 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1319 , H01L2224/1329 , H01L2224/133 , H01L2224/1357 , H01L2224/13644 , H01L2224/13655 , H01L2224/16 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A package structure for packaging at least one of a plurality of integrated circuit devices of a wafer is provided. The package structure includes an extension metal pad, a first conductive bump and an insulator layer. The extension metal pad electrically contacts the at least one of the plurality of integrated circuit devices. The first conductive bump is located on the extension metal pad. The insulator layer is located over the at least one of the plurality of integrated circuit devices and on a sidewall of it.
摘要翻译：提供了一种用于封装晶片的多个集成电路器件中的至少一个的封装结构。封装结构包括延伸金属焊盘，第一导电凸块和绝缘体层。延伸金属焊盘与多个集成电路器件中的至少一个电接触。第一导电凸块位于延伸金属垫上。绝缘体层位于多个集成电路器件中的至少一个集成电路器件的上方及其侧壁上。

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