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    • 3. 发明授权
    • Mold clamping device
    • 模具夹紧装置
    • US08366438B2
    • 2013-02-05
    • US12741848
    • 2008-04-09
    • Naoki KatoToshihiko Kariya
    • Naoki KatoToshihiko Kariya
    • B29C45/64
    • B22D17/26B22D17/266B29C45/1747B29C45/6728
    • In a mold clamping device including a fixed platen, a movable platen, a plurality of tie bars, and mold clamping half nuts, a pair of additional half members which is restricted in the axial direction of the tie bar and moves in an opening/closing direction of the half nuts relative to the mold clamping half nuts is further provided, and when the mold clamping half nuts are closed and mated with the screw or the ring groove of the tie bar, the additional half members are closed to hold the tie bar so that play at mated parts is removed or cancelled by fixation.
    • 在包括固定压板,可移动压板,多个连接杆和模具夹紧半螺母的模具夹紧装置中,一对附加的半部件在连接杆的轴向方向上被限制并且在打开/关闭 还提供了半螺母相对于模具夹紧半螺母的方向,并且当夹紧半螺母被关闭并且与连接杆的螺钉或环槽相配合时,附加的半部件被关闭以保持连接杆 以便通过固定来消除或取消配合部位的游戏。
    • 5. 发明授权
    • Mold temperature control circuit of injection molding device and method for discharging heating medium
    • 注射成型装置的模具温度控制电路和放热加热介质的方法
    • US08318061B2
    • 2012-11-27
    • US13001912
    • 2009-06-29
    • Michitaka HattoriSatoshi ImaedaToshihiko Kariya
    • Michitaka HattoriSatoshi ImaedaToshihiko Kariya
    • B29C45/73
    • B29C45/7306B29C45/78B29C2045/7393
    • In a mold temperature control circuit of an injection molding device, such a molding cycle is repeated that, prior to injection of a resin, a heating-use medium is returned to molds and heated to a temperature suitable for resin injection, after injection of the resin, the heating-use medium is switched to a cooling-use medium, thereby the cooling-use medium is returned to the molds and cooling is conducted to give a temperature equal to or lower than a temperature at which the resin is solidified. In the mold temperature control circuit of the injection molding device, a junction piping is able to commonly use the respective supply pipings of the heating-use medium, the cooling-use medium and the scavenging compressed air to the molds and the respective discharge pipings thereof, and there is provided mold bypass piping coupling the supply-side junction piping of the heating medium with the discharge-side junction piping, a mold bypass on-off valve, a passed heating medium sensor, a mold-temperature adjusting control device which stores a mold temperature determination program and a passed heating medium determination program.
    • 在注射成型装置的模具温度控制电路中,重复这样的成型周期,在注射树脂之前,将加热用介质返回到模具中并加热至适于树脂注射的温度, 树脂,将加热用介质切换到冷却用介质,由此将冷却用介质返回到模具中,进行冷却,得到等于或低于树脂固化温度的温度。 在注射成型装置的模具温度控制电路中,连接管路能够共同使用加热用介质,冷却用介质和扫气压缩空气到模具及其排出管道的各自的供给管道 并且提供了将加热介质的供给侧接合管与排出侧接合管连接的模具旁通管,模具旁通开闭阀,通过的加热介质传感器,存储 模具温度确定程序和通过的加热介质确定程序。