会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Setting module for the illumination of an optical instrument
    • 用于照明光学仪器的设置模块
    • US07002740B2
    • 2006-02-21
    • US10192874
    • 2002-07-11
    • Michael VeithUwe GrafJoachim Wienecke
    • Michael VeithUwe GrafJoachim Wienecke
    • G02B21/06
    • G02B21/06
    • The invention refers to a setting module for an illumination apparatus (2) of an optical instrument (1), in particular of a microscope, in which the illumination apparatus (2) comprises a light source (4), an illuminating optical system, and positioning elements (7, 8, 9, 16) with which the position of the light source (4) and/or of the illuminating optical system within the illumination apparatus (2) can be modified. The setting module (17) comprises a module housing (18) having at least one drive device (19, 20, 21, 22) and coupling members (27, 28, 29, 30) for the transfer of a drive motion to the positioning elements (7, 8, 9, 16).Also described is an illumination system comprising the illumination apparatus and the setting module. The result is to create an alignment capability with excellent functionality and user-friendliness, thereby making possible rapid positional adjustment of the light source and/or the illuminating optical system in the context of use under clean-room conditions.
    • 本发明涉及一种用于光学仪器(1)的照明装置(2)的设置模块,特别是显微镜,其中照明装置(2)包括光源(4),照明光学系统和 能够改变照明装置(2)内的光源(4)和/或照明光学系统的位置的定位元件(7,8,9,16)。 设置模块(17)包括具有至少一个驱动装置(19,20,21,22)和联接构件(27,28,29,30)的模块壳体(18),用于将驱动运动传递到定位 元素(7,8,9,16)。
    • 2. 发明授权
    • Arrangement and method for the identification of substrates
    • 底物鉴定的布置方法
    • US06845174B2
    • 2005-01-18
    • US10050114
    • 2002-01-18
    • Dominik GrauAndreas BirknerKnut HiltawskiFrank Bernhardt
    • Dominik GrauAndreas BirknerKnut HiltawskiFrank Bernhardt
    • G06K9/20G06K9/00
    • G06K9/20
    • An arrangement for the identification of a substrate (S) having at least one identification marking (I), comprising a turntable (2) for rotating a substrate (S) placed thereon; an illumination source (4) and a receiving device (5) for evaluating the intensity of the light emerging from the illumination source (4), the edge zone of the substrate (S) placed on the turntable (2), upon rotation thereof, influencing the light intensity striking the receiving device (5); a device (6) for reading the identification marking (I), having a sensing region (E); and a calculation device that calculates a manipulated variable for a correction rotation angle about the rotation axis (A) for alignment of the identification marking (I) with respect to the sensing region (E), and a manipulated variable for a correction motion for changing the position of the sensing region (E) with respect to the rotation axis (A) or with respect to the actual position of the identification marking (I), and outputs them to a positioning device. A corresponding identification method is also described.
    • 一种用于识别具有至少一个识别标记(I)的衬底(S)的装置,包括用于旋转放置在其上的衬底(S)的转台(2);照明源(4)和接收装置(5),用于 评估从照明源(4)出射的光的强度,旋转时放置在转台(2)上的基板(S)的边缘区域,影响撞击接收装置(5)的光强度;装置 (6),用于读取具有感测区域(E)的识别标记(I); 以及计算装置,用于计算关于所述识别标记(I)相对于所述感测区域(E)的对准的所述旋转轴线(A)的校正旋转角度的操作变量,以及用于改变所述校正运动的操作变量 感测区域(E)相对于旋转轴线(A)的位置或相对于识别标记(I)的实际位置的位置,并将其输出到定位装置。还描述了相应的识别方法。
    • 3. 发明申请
    • Arrangement and method for inspecting unpatterned wafers
    • 用于检查未图案化晶片的布置和方法
    • US20030038932A1
    • 2003-02-27
    • US10224415
    • 2002-08-21
    • LEICA MICROSYSTEMS JENA GmbH
    • Joachim WieneckeKuno Backhaus
    • G01N021/88
    • G01N21/9501
    • The invention concerns an arrangement (1) for inspecting preferably unpatterned wafers, and comprises: a first optical inspection device (2) for examining reference wafers (R), which operates using image data processing methods and thereby recognizes defects on the reference wafers; a scattered-light measuring instrument (3) that is calibrated with the reference wafers (R) by defining at least one threshold value for the recognition of defects on wafers (W) to be inspected, and that comprises means (6) for recording the locations of threshold value exceedances for the wafers (W) to be inspected; nullandnull a second optical inspection device (4) for examination, only at those locations at which a threshold value exceedance is identified, of the wafers (W) to be inspected, which also comprises a classification device. The scattered-light measuring instrument (3) and the second optical inspection device (4) are arranged in one production line (P) as sequentially located stations. The first optical inspection device (2), on the other hand, is arranged outside the production line (P). A corresponding method is also described.
    • 本发明涉及一种用于检查优选未图案化晶片的装置(1),包括:用于检查参考晶片(R)的第一光学检查装置(2),其使用图像数据处理方法进行操作,从而识别参考晶片上的缺陷; 通过限定用于识别要检查的晶片(W)上的缺陷的至少一个阈值,通过用参考晶片(R)校准的散射光测量仪器(3),并且包括用于记录 要检查的晶片(W)的阈值超出位置; 以及还包括分类装置的第二光学检查装置(4),仅用于检测要检查的晶片(W)的阈值超标的那些位置。 散射光测量仪器(3)和第二光学检测装置(4)以一个生产线(P)的形式排列成顺序定位的工位。 另一方面,第一光学检查装置(2)布置在生产线(P)的外侧。 还描述了相应的方法。
    • 4. 发明申请
    • Arrangement and method for illuminating a specimen field in an optical instrument
    • 用于照射光学仪器中的样品场的布置和方法
    • US20030015643A1
    • 2003-01-23
    • US10193126
    • 2002-07-12
    • LEICA MICROSYSTEMS JENA GmbH
    • Michael VeithUwe GrafJoachim Wienecke
    • G01J001/32
    • G01J1/32G02B21/06
    • According to the present invention, an arrangement for illuminating a specimen field in an optical instrument (40) comprises an illumination device (41) having a light source (42) and an illuminating optical system (43), at least the position of the light source (42) being adjustable; a setting device (44) having at least one motorized drive system (45, 46) for automatic positional adjustment of the light source (42) and/or the illuminating optical system (43); at least one measurement device (55) for sensing parameters of the light generated by the illumination device (41); and a control device (56) that, from a comparison of the measured parameters with predefined reference parameters, generates positioning commands for the motorized drive systems (45, 46) for positional adjustment of the light source (42) and/or the illuminating optical system (43). A corresponding method is also described. Reproducible illumination of the specimen field with consistently high illumination quality is thereby achieved. Realignment is performed, if necessary, automatically.
    • 根据本发明,用于照射光学仪器(40)中的样本场的装置包括具有光源(42)和照明光学系统(43)的照明装置(41),至少所述光的位置 源(42)可调; 具有用于光源(42)和/或照明光学系统(43)的自动位置调整的至少一个电动驱动系统(45,46)的设定装置(44)。 至少一个测量装置(55),用于感测由照明装置(41)产生的光的参数; 以及控制装置(56),其从所述测量参数与预定参考参数的比较中产生用于所述电动驱动系统(45,46)的定位命令,以用于所述光源(42)和/或所述照明光学 系统(43)。 还描述了相应的方法。 由此实现了具有始终如一的高照明质量的样品场的可再现照明。 如果需要,将自动执行重新排列。
    • 5. 发明申请
    • Arrangement and method for the identification of substrates
    • 底物鉴定的布置方法
    • US20020097905A1
    • 2002-07-25
    • US10050114
    • 2002-01-18
    • Leica Microsystems Jena GmbH
    • Dominik GrauAndreas BirknerKnut HiltawskiFrank Bernhardt
    • G06K009/00
    • G06K9/20
    • An arrangement for the identification of a substrate (S) having at least one identification marking (I), comprising a turntable (2) for rotating a substrate (S) placed thereon; an illumination source (4) and a receiving device (5) for evaluating the intensity of the light emerging from the illumination source (4), the edge zone of the substrate (S) placed on the turntable (2), upon rotation thereof, influencing the light intensity striking the receiving device (5); a device (6) for reading the identification marking (I), having a sensing region (E); and a calculation device that calculates a manipulated variable for a correction rotation angle about the rotation axis (A) for alignment of the identification marking (I) with respect to the sensing region (E), and a manipulated variable for a correction motion for changing the position of the sensing region (E) with respect to the rotation axis (A) or with respect to the actual position of the identification marking (I), and outputs them to a positioning device. A corresponding identification method is also described.
    • 用于识别具有至少一个识别标记(I)的基底(S)的装置,包括用于旋转放置在其上的基底(S)的转盘(2) 用于评估从照明源(4)出射的光的强度的照明源(4)和接收装置(5),所述照明源(4)和放置在所述转盘(2)上的所述衬底(S)的边缘区域) 影响接收装置(5)的光强度; 用于读取识别标记(I)的装置(6),具有感测区域(E); 以及计算装置,其针对所述旋转轴线(A)计算用于所述识别标记(I)相对于所述感测区域(E)的对准的校正旋转角度的操作变量,以及用于改变所述校正运动的操作变量 感测区域(E)相对于旋转轴线(A)的位置或相对于识别标记(I)的实际位置的位置,并将其输出到定位装置。 还描述了相应的识别方法。
    • 6. 发明申请
    • Arrangement for the visual inspection of substrates
    • 底物目视检查的安排
    • US20020097394A1
    • 2002-07-25
    • US10041560
    • 2002-01-10
    • LEICA MICROSYSTEMS JENA GmbH
    • Karsten Urban
    • G01N021/88
    • G02B21/0016G02B21/18
    • An arrangement for the visual inspection of substrates (S) comprises a microscope (2) for viewing the substrate (S) present at an inspection point (I); at least one viewing field (11), arranged next to a microscope viewing port (2a), for viewing an image or an image area of the substrate (S); and/or at least one further viewing field (12), arranged next to the microscope viewing port (2a), for direct viewing of the substrate (S) or a portion of the substrate (S); the microscope viewing port (2a) and the viewing fields (11, 12) being arranged with respect to an operating position (P) in such a way that from the operating position (P), the viewer looks in a first viewing direction (A) perpendicularly onto the microscope viewing port (2a), and in at least one further viewing direction (B, Bnull) approximately perpendicularly in each case onto one of the viewing fields (11, 12). The first viewing direction (A) and the viewing directions (B, Bnull) enclose acute angles (null, nullnull). The result is to create an inspection arrangement notable for favorable ergonomic properties and a compact design.
    • 用于基板(S)的目视检查的装置包括用于观察存在于检查点(I)处的基板(S)的显微镜(2)。 布置在显微镜观察端口(2a)旁边的至少一个视野(11),用于观察衬底(S)的图像或图像区域; 和/或至少一个放置在显微镜观察口(2a)旁边的另外的视场(12),用于直接观察衬底(S)或衬底(S)的一部分; 相对于操作位置(P),显微镜观察端口(2a)和观察区域(11,12)以从操作位置(P)的方式布置,观察者观看第一观察方向(A ),并且在至少一个另外的观察方向(B,B')上,垂直地垂直于显微镜观察端口(2a),在每种情况下大致垂直于其中一个视野(11,12)。 第一观察方向(A)和观察方向(B,B')包围锐角(α,α')。 结果是创建一个显着的有利的人体工程学特性和紧凑设计的检查装置。
    • 8. 发明授权
    • Method for determining layer thickness ranges
    • 确定层厚范围的方法
    • US06985237B2
    • 2006-01-10
    • US10462280
    • 2003-06-16
    • Hakon MikkelsenJoachim Wienecke
    • Hakon MikkelsenJoachim Wienecke
    • G01B11/02
    • G01B11/0625
    • The invention concerns a method for the determination of layer thickness ranges of layers of a specimen, in which the reflection spectrum of the specimen is measured in a specified wavelength range and then smoothed, the number of extremes in the smoothed reflection spectrum is determined, and the determination of the layer thickness ranges is accomplished by comparison with the number of extremes in the modeled reflection spectra, such that for each layer the thickness in that layer is varied in steps having a predetermined increment, and a reflection spectrum is modeled. In a method of this kind, the wavelength range and the increments are specified in self-consistent fashion using a sensitivity criterion.
    • 本发明涉及一种用于确定样品层的层厚度范围的方法,其中在特定波长范围内测量样品的反射光谱然后平滑,确定平滑反射光谱中的极限数量,以及 通过与建模的反射光谱中的极限数量进行比较来实现层厚度范围的确定,使得对于每层,该层中的厚度在具有预定增量的步骤中变化,并且对反射光谱进行建模。 在这种方法中,使用灵敏度标准以自相矛盾的方式指定波长范围和增量。
    • 10. 发明授权
    • Method for evaluating pattern defects on a water surface
    • 评估水面图案缺陷的方法
    • US06941009B2
    • 2005-09-06
    • US09797909
    • 2001-03-05
    • Joachim Wienecke
    • Joachim Wienecke
    • G01N21/95G01N21/956H01L21/66G08K9/00
    • G01N21/95607G01N21/9501G01N2021/8867H01L2223/54466
    • The invention concerns a method for evaluating pattern defects on a wafer surface, comprising the following steps: acquiring the surface data of a plurality of individual image fields (4) of a series-produced wafer (1); storing the data in a reference data set and making it available as reference data for the inspection of further wafers of the same series; inspecting, successively in time, the individual image fields (4) on the surface of a wafer (1) presently being examined; retrieving from the reference data set a reference datum corresponding to the respective individual image field (4) presently being inspected; comparing the surface of each individual image field (4) currently being inspected to the corresponding reference datum; if one or more deviations are identified, subsequently classifying the deviations into critical and noncritical defects in terms of the functionality of the chip; and simultaneously updating or adding to the reference data set.
    • 本发明涉及一种用于评估晶片表面上的图案缺陷的方法,包括以下步骤:获取串联生产的晶片(1)的多个单独图像场(4)的表面数据; 将数据存储在参考数据集中并使其可用作用于检查相同系列的另外的晶片的参考数据; 在时间上连续检查当前正在检查的晶片(1)的表面上的各个图像场(4); 从参考数据集中检索与当前正在检查的各个图像字段(4)相对应的参考数据; 将当前被检查的每个单独图像场(4)的表面与对应的参考基准进行比较; 如果识别出一个或多个偏差,则随后在芯片的功能方面将偏差分类为关键和非临界缺陷; 并同时更新或添加到参考数据集。