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1. 发明申请

US20230050310A1 Electroless Plating Process and Two-Layer Plating Film 有权
公开(公告)号：US20230050310A1
公开(公告)日：2023-02-16
申请号：US17792643
申请日：2021-01-12
申请人： KOJIMA CHEMICALS CO., LTD.
发明人： Hideto Watanabe , Tomohito Kato
IPC分类号： C23C18/16 , H05K3/24 , C23C18/34 , C23C18/48
摘要： An electroless plating process that enables reduction in production costs and a two-layer plating film obtained by the process including an electroless plating process for forming a nickel plating film and a gold plating film in this order on a surface of a copper material by a electroless plating method. The electroless plating process includes a step of forming a nickel plating film containing boron by a reductive electroless nickel strike plating method, and a step of forming a gold plating film by a reductive electroless gold plating method. The two-layer plating film according to the present disclosure is formed by this process.

2. 发明申请

US20100199882A1 Electroless Pure Palladium Plating Solution 有权
标题翻译：无电镀纯钯电镀液
公开(公告)号：US20100199882A1
公开(公告)日：2010-08-12
申请号：US12085930
申请日：2007-02-28
申请人： Kazuhiro Kojima , Hideto Watanabe
发明人： Kazuhiro Kojima , Hideto Watanabe
IPC分类号： C09D5/00
CPC分类号： C23C18/42
摘要： An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.
摘要翻译：提供能够形成具有较少电镀膜变化的纯钯电镀膜的无电镀纯钯电镀溶液。无电解镀钯溶液包含含有（a）0.001〜0.5mol / l水溶性钯化合物的水溶液，（b）0.005〜10mol /升选自脂肪族羧酸酸和水溶性盐，（c）0.005〜10摩尔/升的磷酸和/或磷酸盐，和（d）0.005〜10摩尔/升的硫酸和/或硫酸盐。

3. 发明授权

US07632343B2 Electroless palladium plating solution 有权
标题翻译：无电镀钯溶液
公开(公告)号：US07632343B2
公开(公告)日：2009-12-15
申请号：US12186136
申请日：2008-08-05
申请人： Kazuhiro Kojima , Hideto Watanabe
发明人： Kazuhiro Kojima , Hideto Watanabe
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , H05K3/244
摘要： An electroless palladium plating solution is capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness. An electroless palladium plating solution includes: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate: the first complexing agent being an organopalladium complex having ethylenediamine as a ligand: the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
摘要翻译：化学镀钯溶液能够直接在化学镀镍膜上形成纯钯电镀膜，而不需要（预处理）诸如取代的钯电镀处理等，其中纯钯电镀膜具有良好的附着力和较小的电镀膜变化厚度。化学镀钯溶液包括：第一络合剂，第二络合剂，磷酸或磷酸盐，硫酸或硫酸盐，甲酸或甲酸盐：第一络合剂是具有乙二胺作为配体的有机钯络合物：第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。

4. 发明申请

US20090044720A1 ELECTROLESS PALLADIUM PLATING SOLUTION 有权
标题翻译：电镀磷酸盐溶液
公开(公告)号：US20090044720A1
公开(公告)日：2009-02-19
申请号：US12186136
申请日：2008-08-05
申请人： Kazuhiro Kojima , Hideto Watanabe
发明人： Kazuhiro Kojima , Hideto Watanabe
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , H05K3/244
摘要： [Object] To provide, an electroless palladium plating solution capable of forming a pure palladium plating film directly on an electroless nickel plating film without (pre)treatment such as substituted palladium plating treatment or the like, which pure palladium plating film has good adhesion and small variations in plating film thickness.[Means to Solve the Problem] An electroless palladium plating solution comprising: a first complexing agent, a second complexing agent, phosphoric acid or a phosphate, sulfuric acid or a sulfate, and formic acid or a formate; the first complexing agent being an organopalladium complex having ethylenediamine as a ligand; the second complexing agent being a chelating agent having a carboxyl group or a salt thereof and/or a water-soluble aliphatic organic acid or a salt thereof.
摘要翻译：本发明提供一种无电镀钯溶液，其能够直接在化学镀镍膜上形成纯钯电镀膜，而不需要（预处理）如取代的钯电镀处理等，该纯钯电镀膜具有良好的附着力，镀膜厚度变化小。解决问题的方法一种无电镀钯溶液，包括：第一络合剂，第二络合剂，磷酸或磷酸盐，硫酸或硫酸盐，甲酸或甲酸盐; 第一络合剂是具有乙二胺作为配体的有机钯络合物; 第二络合剂是具有羧基的螯合剂或其盐和/或水溶性脂族有机酸或其盐。

5. 发明申请

US20160230287A1 REDUCTIVE ELECTROLESS GOLD PLATING SOLUTION, AND ELECTROLESS GOLD PLATING METHOD USING THE PLATING SOLUTION 审中-公开
标题翻译：减少电镀金镀层溶液和使用镀液的电镀镀金方法
公开(公告)号：US20160230287A1
公开(公告)日：2016-08-11
申请号：US15025321
申请日：2015-08-21
申请人： KOJIMA CHEMICALS CO., LTD.
发明人： Tomohito KATO , Hideto WATANABE
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , C23C18/1637 , C23C18/1651 , C23C18/32
摘要： The present invention has an object to provide an electroless gold plating solution capable of suppressing the corrosion of a substrate metal and realizing excellent wire bondability, and containing no hazardous substance. In order to achieve the object, as a reductive electroless gold plating solution used for formation of an electroless plated gold film on a surface of a plating target by electroless plating, an electroless plating solution containing a water-soluble gold compound, citric acid or a citrate salt, ethylenediaminetetraacetic acid or an ethylenediaminetetraacetate salt, hexamethylenetetramine, and a chain polyamine having an alkyl group having 3 or more carbon atoms and 3 or more amino groups is adopted.
摘要翻译：本发明的目的是提供一种能够抑制基板金属的腐蚀并且实现优异的引线接合性，并且不含有有害物质的无电镀金液。为了实现该目的，作为通过化学镀在用于形成镀覆靶的表面上的化学镀金膜的还原性无电镀金液，可以使用含有水溶性金化合物，柠檬酸或柠檬酸盐，乙二胺四乙酸或乙二胺四乙酸盐，六亚甲基四胺和具有3个或更多个碳原子的烷基和3个或更多个氨基的链多胺。

6. 发明申请

US20120118196A1 ELECTROLESS PALLADIUM PLATING SOLUTION 有权
标题翻译：电镀磷酸盐溶液
公开(公告)号：US20120118196A1
公开(公告)日：2012-05-17
申请号：US13319194
申请日：2010-05-07
申请人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
发明人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
IPC分类号： C09D1/00
CPC分类号： C23C18/44 , H01L2224/85464 , H05K3/244
摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
摘要翻译：公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。

7. 发明授权

US08562727B2 Electroless palladium plating solution 有权
标题翻译：无电镀钯溶液
公开(公告)号：US08562727B2
公开(公告)日：2013-10-22
申请号：US13319194
申请日：2010-05-07
申请人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
发明人： Hideto Watanabe , Kazuhiro Kojima , Kaoru Yagi
IPC分类号： C23C18/44
CPC分类号： C23C18/44 , H01L2224/85464 , H05K3/244
摘要： Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.
摘要翻译：公开了一种化学镀钯溶液，其可以形成对电子部件等具有优异的焊接性质的镀层，并且具有优异的引线接合性能。化学镀钯溶液包括钯化合物，胺化合物，无机硫化合物和还原剂，其中使用次磷酸或次磷酸化合物与甲酸或甲酸化合物的组合作为还原剂，以及其中钯化合物，胺化合物，无机硫化合物，次磷酸化合物，甲酸或甲酸化合物的含量为0.001至0.1摩尔/升0.05至5摩尔/升0.01至0.1摩尔分别为0.05〜1.0摩尔/升和0.001〜0.1摩尔/升。无电镀钯溶液的特征在于具有优异的焊接性能和优良的引线接合性能。

8. 发明授权

US12018378B2 Electroless plating process 有权
公开(公告)号：US12018378B2
公开(公告)日：2024-06-25
申请号：US16485543
申请日：2018-06-21
申请人： KOJIMA CHEMICALS, CO., LTD.
发明人： Tomohito Kato , Hideto Watanabe
IPC分类号： C23C18/34 , C23C18/16 , C23C18/44 , H01L21/768
CPC分类号： C23C18/44 , C23C18/1651 , C23C18/34 , H01L21/7685 , H01L21/76874
摘要： An object is to provide an electroless plating process which can thin a film thickness of a nickel film and can obtain a film having excellent mounting characteristics, when the nickel film and a gold film are sequentially formed on a surface of a copper material. In order to solve the above-mentioned problems, provided is an electroless plating process which sequentially forms a nickel film and a gold film on a surface of a copper material by an electroless plating method and includes: a step of forming the nickel film on the surface of the copper material by an electroless strike plating method; and a step of forming the gold film by a reduction-type electroless plating method.

9. 发明授权

US07981202B2 Electroless pure palladium plating solution 有权
标题翻译：无电镀纯钯电镀液
公开(公告)号：US07981202B2
公开(公告)日：2011-07-19
申请号：US12085930
申请日：2007-02-28
申请人： Kazuhiro Kojima , Hideto Watanabe
发明人： Kazuhiro Kojima , Hideto Watanabe
IPC分类号： C23C18/44
CPC分类号： C23C18/42
摘要： An electroless pure palladium plating solution capable of forming pure palladium plating films having less plating film variations is provided. The electroless pure palladium plating solution comprises an aqueous solution containing (a) 0.001 to 0.5 mol/liter of a water-soluble palladium compound, (b) 0.005 to 10 mol/liter of at least two members selected from the group consisting of aliphatic carboxylic acids and water-soluble salts thereof, (c) 0.005 to 10 mol/liter of phosphoric acid and/or a phosphate, and (d) 0.005 to 10 mol/liter of sulfuric acid and/or a sulfate.
摘要翻译：提供能够形成具有较少电镀膜变化的纯钯电镀膜的无电镀纯钯电镀溶液。无电解镀钯溶液包含含有（a）0.001〜0.5mol / l水溶性钯化合物的水溶液，（b）0.005〜10mol /升选自脂肪族羧酸酸和水溶性盐，（c）0.005〜10摩尔/升的磷酸和/或磷酸盐，和（d）0.005〜10摩尔/升的硫酸和/或硫酸盐。

10. 发明申请

US20070114499A1 Process for producing metal micropowder having particle diameter uniformalized 审中-公开
标题翻译：制造具有均匀粒径的金属微粉的方法
公开(公告)号：US20070114499A1
公开(公告)日：2007-05-24
申请号：US10581084
申请日：2004-11-30
申请人： Shinroku Kawasumi , Shnichiro Kawasumi
发明人： Shinroku Kawasumi , Shnichiro Kawasumi
IPC分类号： H01B1/22
CPC分类号： B22F1/0014 , B22F1/025 , B22F9/24 , B22F2998/10
摘要： Provision of a preparing method for the production of a metal micropowder having a uniform diameter which is of value for preparation of precious metal electrodes. A method for producing a metal micropowder having a uniform particle diameter which is performed sequentially by preparing a colloidal solution which contains two metal (e.g., Ag and Pd) salts having different oxidation-reduction potentials; bringing a reducing agent into contact with the colloidal solution, whereby first precipitating micro-particles of a metal (e.g., Ag) having a relatively low oxidation-reduction potential and then depositing a metal (e.g Pd) having a relatively high oxidation-reduction potential on the micro-particles, to produce double layered particles composed of the micro-particles of a metal of a relatively low oxidation-reduction potential coated with a metal of a relatively high oxidation-reduction potential; and bringing the colloidal solution containing the double layered particles into contact with a third metal (e.g., Ag—Pd, Pt) salt and a reducing agent.
摘要翻译：提供一种制备具有均匀直径的金属微粉的制备方法，其具有制备贵金属电极的价值。一种具有均匀粒径的金属微粉的制造方法，其通过制备含有两种具有不同氧化还原电位的金属（例如Ag和Pd）盐的胶体溶液依次进行; 使还原剂与胶体溶液接触，由此首先沉淀具有较低氧化还原电位的金属（例如Ag）的微粒，然后沉积具有较高氧化还原电位的金属（例如Pd）在微粒子上产生双层微粒，其由涂覆有较高氧化还原电位的金属的较低氧化还原电位的金属的微粒组成; 并使含有双层颗粒的胶体溶液与第三金属（例如Ag-Pd，Pt）盐和还原剂接触。

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