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    • 1. 发明申请
    • Stacked CMOS Power Amplifier and RF Coupler Devices and Related Methods
    • 堆叠CMOS功率放大器和RF耦合器器件及相关方法
    • US20130045699A1
    • 2013-02-21
    • US13656033
    • 2012-10-19
    • Javelin Semiconductor, Inc.
    • Abhay Misra
    • H04B1/04H01R43/00
    • H03F3/195H01L2224/16225H01L2224/73265H03F3/24H03F2200/204H03G3/3042Y10T29/49117
    • Stacked CMOS power amplifier (PA) and radio frequency (RF) coupler devices and related methods are disclosed. The stacked device includes a CMOS PA die configured to receive a transmit input signal and to output an amplified transmit signal, and a RF coupler device configured to receive the amplified transmit signal, to output an antenna transmit signal, and to output an RF signal proportional to the antenna transmit signal. The CMOS PA die and the RF coupler device are stacked on top of and electrically coupled to each other, and the CMOS PA die and the RF coupler device are combined within a single semiconductor package. In some embodiments, the RF coupler device is positioned on top of the CMOS PA die, and in other embodiments the CMOS PA die is positioned on top of the RF coupler device.
    • 公开了叠层CMOS功率放大器(PA)和射频(RF)耦合器器件及相关方法。 叠层器件包括被配置为接收发射输入信号并输出​​放大的发射信号的CMOS PA管芯,以及被配置为接收放大的发射信号,输出天线发射信号并输出​​与之成比例的RF信号的RF耦合器装置 到天线发射信号。 CMOS PA管芯和RF耦合器件堆叠在彼此之上并电耦合,并且CMOS PA管芯和RF耦合器件在单个半导体封装内组合。 在一些实施例中,RF耦合器件位于CMOS PA管芯的顶部,并且在其它实施例中,CMOS PA管芯位于RF耦合器器件的顶部上。
    • 6. 发明授权
    • Stacked CMOS power amplifier and RF coupler devices and related methods
    • 叠层CMOS功率放大器和射频耦合器件及相关方法
    • US08301106B2
    • 2012-10-30
    • US12658294
    • 2010-02-10
    • Abhay Misra
    • Abhay Misra
    • H04B1/28H04B1/16
    • H03F3/195H01L2224/16225H01L2224/73265H03F3/24H03F2200/204H03G3/3042Y10T29/49117
    • Stacked CMOS power amplifier (PA) and radio frequency (RF) coupler devices and related methods are disclosed. The stacked device includes a CMOS PA die configured to receive a transmit input signal and to output an amplified transmit signal, and a RF coupler device configured to receive the amplified transmit signal, to output an antenna transmit signal, and to output an RF signal proportional to the antenna transmit signal. The CMOS PA die and the RF coupler device are stacked on top of and electrically coupled to each other, and the CMOS PA die and the RF coupler device are combined within a single semiconductor package. In some embodiments, the RF coupler device is positioned on top of the CMOS PA die, and in other embodiments the CMOS PA die is positioned on top of the RF coupler device.
    • 公开了叠层CMOS功率放大器(PA)和射频(RF)耦合器器件及相关方法。 叠层器件包括被配置为接收发射输入信号并输出​​放大的发射信号的CMOS PA管芯,以及被配置为接收放大的发射信号,输出天线发射信号并输出​​与之成比例的RF信号的RF耦合器装置 到天线发射信号。 CMOS PA管芯和RF耦合器件堆叠在彼此之上并电耦合,并且CMOS PA管芯和RF耦合器件在单个半导体封装内组合。 在一些实施例中,RF耦合器件位于CMOS PA管芯的顶部,并且在其它实施例中,CMOS PA管芯位于RF耦合器器件的顶部上。
    • 8. 发明授权
    • Reducing common mode effects in an output stage
    • 在输出阶段降低共模效应
    • US08116700B2
    • 2012-02-14
    • US12619062
    • 2009-11-16
    • Eric Kimball
    • Eric Kimball
    • H04B1/02H03F3/68H03F1/00
    • H03F3/195H03F1/565H03F3/211H03F3/24H03F2200/387H03F2200/451H03F2200/541H03F2203/21139H04B1/0458
    • In one embodiment, a power amplifier may include an output stage with multiple transformers and corresponding matching capacitances. The capacitances may include a first matching capacitance coupled in parallel with a secondary coil of a first transformer and a second matching capacitance coupled in parallel with a secondary coil of a second transformer, where the secondary coils are coupled in series in an output stack configuration. By accounting for parasitics present in the power amplifier, the first matching capacitance can be designed to have a greater capacitance than the second matching capacitor, even where the first and second transformers are configured to output substantially equal power levels.
    • 在一个实施例中,功率放大器可以包括具有多个变压器的输出级和相应的匹配电容。 电容可以包括与第一变压器的次级线圈并联耦合的第一匹配电容和与第二变压器的次级线圈并联耦合的第二匹配电容,其中次级线圈以输出堆叠配置串联耦合。 通过考虑存在于功率放大器中的寄生效应,即使第一和第二变压器被配置为输出基本相等的功率电平,第一匹配电容可被设计成具有比第二匹配电容器更大的电容。