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1. 发明授权

US07803307B2 Ultra high-temperature plastic package and method of manufacture 有权
标题翻译：超高温塑料包装及其制造方法
公开(公告)号：US07803307B2
公开(公告)日：2010-09-28
申请号：US11146856
申请日：2005-06-07
申请人： Michael Zimmerman
发明人： Michael Zimmerman
IPC分类号： C08J5/02 , C08G63/06
CPC分类号： C08G63/065 , B29C35/02 , B29C45/0053 , B29C45/14655 , B29C45/7207 , B29C71/02 , B29K2105/0079 , C08G63/19 , C08G63/605 , C08G63/78 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.
摘要翻译：用于微电子电路的封装包括由高分子量塑料材料制成的框架，例如液晶聚合物（LCP），附接到凸缘或引线框架。塑料材料注塑成型。塑料材料的初始聚合可以以液态发生，并产生具有初始熔融温度的中间材料。在框架被注塑成型后，框架被加热并进行进一步的（二次）聚合，从而延长塑料材料中的聚合物链。这些较长的聚合物链具有较高的分子量，并且所得到的最终材料具有比中间材料更高的熔融温度。所得到的超高分子量聚合物可以承受高温，例如在焊接过程中遇到的那些。因此，在进一步（二次）聚合之后，可以将模具焊接到凸缘上，而不会损坏塑料框架。

2. 发明授权

US08039945B2 Plastic electronic component package 有权
标题翻译：塑料电子元件包装
公开(公告)号：US08039945B2
公开(公告)日：2011-10-18
申请号：US12950528
申请日：2010-11-19
申请人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
发明人： Michael A. Zimmerman , Keith Smith , Jacob Shverdin
IPC分类号： H01L23/48
CPC分类号： H01L27/14618 , H01L23/10 , H01L23/3142 , H01L23/49861 , H01L24/48 , H01L27/14683 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/4899 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/12041 , H01L2924/15747 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/12569 , Y10T428/12618 , Y10T428/31678 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
摘要翻译：一种用于图像传感器或其它电子部件的塑料封装件，其包括塑料体，优选地由LCP材料构成，围绕引线框模制并限定其中要设置图像传感器的空腔。提供一种盖组件，其具有保持在塑料盖框架中的透明玻璃盖，其可焊接或以其他方式粘合到包装的塑料体以封闭安装在腔中的图像传感器。引线框通常由铜或铜合金或具有铜涂层的铁合金组成。至少在与塑料体接触的那些部分中，在引线框架的表面上形成界面层，其用于提供引线框架和塑料材料之间的显着改善的粘合性，以实现金属和塑料材料之间的密封。界面层由形成在引线框架的表面上的氧化亚铜基底层和形成在氧化亚铜层上的氧化铜层构成。氧化铜外层具有针状结构，其在形成包装时提供用于与模制在其上的塑料材料粘合的互锁机构。

3. 发明授权

US07736573B2 Thermoplastic material 有权
标题翻译：热塑性材料
公开(公告)号：US07736573B2
公开(公告)日：2010-06-15
申请号：US10920857
申请日：2004-08-18
申请人： Michael Zimmerman
发明人： Michael Zimmerman
IPC分类号： B29C45/00
CPC分类号： H01L21/50 , H01L23/047 , H01L23/10 , H01L23/492 , H01L23/49861 , H01L23/562 , H01L23/564 , H01L24/29 , H01L24/48 , H01L24/85 , H01L2224/32506 , H01L2224/45099 , H01L2224/48247 , H01L2224/73265 , H01L2224/85205 , H01L2924/00014 , H01L2924/01012 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/18301 , H01L2924/3511 , Y10T428/24132 , H01L2924/3512 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.
摘要翻译：用于容纳半导体或其他集成电路器件（“管芯”）的电路封装包括高铜凸缘，一个或多个高铜引线和模制到凸缘和引线的液晶聚合物框架。凸缘包括与模制框架机械地互锁的燕尾形凹槽或其他框架保持特征。在模制期间，框架的一部分形成在框架保持特征中或周围冻结的键。引线包括一个或多个引线保持特征以与框架机械地互锁。在模制期间，框架的一部分在这些引线保持特征中或附近冻结。框架包括防止水分渗透并使其热膨胀系数（CTE）与引线和法兰的CTE匹配的化合物。该框架被配制成可承受模具附着温度。在模具附接到凸缘上之后，将盖子超声波焊接到框架上。

4. 发明授权

US07679185B2 Microcircuit package having ductile layer 有权
标题翻译：具有延性层的微电路封装
公开(公告)号：US07679185B2
公开(公告)日：2010-03-16
申请号：US11983813
申请日：2007-11-09
申请人： Michael A. Zimmerman , Jonathan Harris
发明人： Michael A. Zimmerman , Jonathan Harris
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/142 , H01L21/4803 , H01L23/047 , H01L23/10 , H01L23/4924 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/48 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29144 , H01L2224/29183 , H01L2224/32245 , H01L2224/32506 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83444 , H01L2224/83455 , H01L2224/83805 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10329 , H01L2924/15747 , H01L2924/16195 , H01L2924/3511 , H01L2924/00 , H01L2924/01014 , H01L2924/3512 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.
摘要翻译：在铜凸缘和管芯之间具有延性层的微电路封装。延性层吸收凸缘和安装在凸缘上的半导体器件之间的应力，并且可以显着降低施加到半导体器件的应力。此外，封装提供铜凸缘和聚合物电介质与铜接近的TCE的组合，这导致低应力结构，提高了可靠性和导电性。

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