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1. 发明授权

US11317514B2 Method for forming circuits using seed layer and etchant composition for selective etching of seed layer 有权
公开(公告)号：US11317514B2
公开(公告)日：2022-04-26
申请号：US16484479
申请日：2018-02-09
申请人： InkTec Co., Ltd.
发明人： Kwang-Choon Chung , Byung Woong Moon , Su Han Kim , Jung Yoon Moon , Hyeon-Jun Seong , Jae Rin Kim
IPC分类号： H05K3/06 , C09K13/00 , H05K1/09 , H05K1/11 , H05K3/18 , H05K3/28 , H05K3/42
摘要： The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.

2. 发明授权

US11089691B2 Microcircuit forming method and etching fluid composition 有权
公开(公告)号：US11089691B2
公开(公告)日：2021-08-10
申请号：US16489361
申请日：2018-02-27
申请人： InkTec Co., Ltd.
发明人： Su Han Kim , Kwang-Choon Chung , Jung Yoon Moon , Sung In Ha , Byung Woong Moon
IPC分类号： H05K3/06 , C09K13/00 , H05K3/24 , H05K3/12 , H05K3/18 , H05K3/38 , H05K3/10
摘要： The disclosure relates to a microcircuit forming method. The microcircuit forming method according to the disclosure comprises: a seed-layer forming step for forming a high-reflectivity seed layer on a substrate material by using a conductive material; a pattern-layer forming step for forming a pattern layer on the seed layer, the pattern layer having a pattern hole arranged thereon to allow the seed layer to be selectively exposed therethrough; a plating step for filling the pattern hole with a conductive material; a pattern-layer removing step for removing the pattern layer; and a seed-layer patterning step for removing a part of the seed layer which does not overlap the conductive material in the plating step, wherein the high-reflectivity seed layer has a specular reflection property.

3. 发明授权

US09914743B2 Organic silver complexes, their preparation methods and their methods for forming thin layers 有权
公开(公告)号：US09914743B2
公开(公告)日：2018-03-13
申请号：US15071593
申请日：2016-03-16
申请人： Inktec Co., Ltd.
发明人： Kwang-Choon Chung , Hyun-Nam Cho , Myoung-Seon Gong , Yi-Sup Han , Jeong-Bin Park , Dong-Hun Nam , Seong-Yong Uhm , Young-Kwan Seo
IPC分类号： C23C18/08 , C07F1/00 , C07C271/02 , C07C211/65 , C09D5/24 , C09D11/30 , C09D11/52 , C25D3/46 , H05K3/10
CPC分类号： C07F1/00 , C07C211/65 , C07C271/02 , C07F1/005 , C09D5/24 , C09D11/30 , C09D11/52 , C23C18/08 , C25D3/46 , H05K3/105
摘要： Provided herein is a method for preparing a silver complex. The method includes reacting a silver oxide with a mixture of ammonium carbamate and isopropyl amine at room temperature in the presence of methanol.

4. 发明授权

US09365935B2 Etching solutions 有权
标题翻译：蚀刻解决方案
公开(公告)号：US09365935B2
公开(公告)日：2016-06-14
申请号：US14293388
申请日：2014-06-02
申请人： Inktec Co., Ltd.
发明人： Kwang Choon Chung , Hyun-Nam Cho , Young-Kwan Seo
IPC分类号： C23F1/30 , C09K13/00 , C23F1/14 , C09K13/06
CPC分类号： C23F1/30 , C09K13/00 , C09K13/06 , C23F1/14
摘要： The present invention provides an etching solution for silver or silver alloy comprising one at least ammonium compound represented by the formula (1), (2) or (3) below and an oxidant: wherein each of the variables is as defined herein.
摘要翻译：本发明提供一种用于银或银合金的蚀刻溶液，其包含至少一种由下式（1），（2）或（3）表示的铵化合物和氧化剂：其中每个变量如本文所定义。

5. 发明授权

US09167735B2 Method for manufacturing electromagnetic interference shielding film 有权
标题翻译：制造电磁干扰屏蔽膜的方法
公开(公告)号：US09167735B2
公开(公告)日：2015-10-20
申请号：US13805843
申请日：2010-11-12
申请人： Kwang Choon Chung , Hyun Nam Cho , Myung Bong Yoo , Nam-Boo Cho , Seok Pil Jin , Seong Hoon No
发明人： Kwang Choon Chung , Hyun Nam Cho , Myung Bong Yoo , Nam-Boo Cho , Seok Pil Jin , Seong Hoon No
IPC分类号： H05K9/00
CPC分类号： H05K9/0088 , Y10T156/10
摘要： Provided is a method for manufacturing an electromagnetic interference (EMI) shielding film, including: (a) providing a single insulating layer on a first protective film, the insulating layer being made of an insulating layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and at least one filler selected from a flame-retardant filler and an abrasion-resistant filler; (b) providing a metal layer on the insulating layer; (c) providing a conductive adhesive layer on the metal layer, the conductive adhesive layer being made from a conductive adhesive layer composition including at least one resin selected from a thermoplastic resin and a thermosetting resin and a conductive filler; and (d) providing a second protective film on the conductive adhesive layer, and an EMI shielding film manufactured by the method.
摘要翻译：提供一种制造电磁干扰（EMI）屏蔽膜的方法，包括：（a）在第一保护膜上提供单个绝缘层，所述绝缘层由绝缘层组合物制成，所述绝缘层组合物包括至少一种选自热塑性塑料树脂和热固性树脂以及选自阻燃填料和耐磨填料的至少一种填料; （b）在绝缘层上设置金属层; （c）在金属层上设置导电粘合剂层，导电粘合剂层由包含至少一种选自热塑性树脂和热固性树脂的树脂和导电填料的导电粘合剂层组合物制成; 和（d）在导电粘合剂层上提供第二保护膜，以及通过该方法制造的EMI屏蔽膜。

6. 发明授权

US08979972B2 Method for manufacturing metal flakes 有权
标题翻译：制造金属薄片的方法
公开(公告)号：US08979972B2
公开(公告)日：2015-03-17
申请号：US13060857
申请日：2009-08-24
申请人： Kwang Choon Chung , Hyun Nam Cho , Dong Rip Kim , Ji Hoon Yoo
发明人： Kwang Choon Chung , Hyun Nam Cho , Dong Rip Kim , Ji Hoon Yoo
IPC分类号： B22F9/04 , B22F9/30 , B22F1/00
CPC分类号： B22F9/30 , B22F1/0055 , B22F9/04
摘要： Disclosed herein is a method of manufacturing a metal flake, including the steps of: applying metal ink containing an organic metal compound onto a substrate; calcining the metal ink applied on the substrate to form a thin metal film; separating the formed thin metal film from the substrate; and pulverizing the separated thin metal film. The method of manufacturing a metal flake is characterized in that the thickness and size of metal flakes can be easily adjusted, metal flakes having excellent conductivity and gloss can be obtained, and metal flakes can be mass-produced using environmentally friendly and economical methods.
摘要翻译：本文公开了一种制造金属薄片的方法，包括以下步骤：将含有有机金属化合物的金属墨施加到基底上; 煅烧施加在基板上的金属油墨以形成薄金属膜; 将形成的薄金属膜与基板分离; 并粉碎分离的金属薄膜。金属薄片的制造方法的特征在于，可以容易地调整金属薄片的厚度和尺寸，可以获得具有优异的导电性和光泽的金属薄片，并且可以使用环保且经济的方法大量生产金属薄片。

7. 发明授权

US08866128B2 Organic electroluminescent device and preparation method thereof 有权
标题翻译：有机电致发光器件及其制备方法
公开(公告)号：US08866128B2
公开(公告)日：2014-10-21
申请号：US12377433
申请日：2007-08-13
申请人： Hyun-Nam Cho , Ji-Hoon Yoo , Kwang-Choon Chung
发明人： Hyun-Nam Cho , Ji-Hoon Yoo , Kwang-Choon Chung
IPC分类号： H01L35/24 , H01L51/50 , H05B33/22 , H05B33/14
CPC分类号： H05B33/14 , H01L51/0037 , H01L51/0042 , H01L51/005 , H01L51/0059 , H01L51/0081 , H01L51/0085 , H01L51/5012 , H01L51/5016 , H01L51/5036 , H01L51/5044 , H01L51/5096 , H01L51/5278 , H05B33/22
摘要： The present invention relates to a method capable of considerably improving the characteristics of an organic electroluminescent device. The present invention provides a method capable of reducing operating voltage and improving efficiency by inserting an inorganic oxide interlayer configured of at least one layer between light-emitting layers.
摘要翻译：本发明涉及能够显着改善有机电致发光器件的特性的方法。本发明提供了一种能够通过在发光层之间插入由至少一层构成的无机氧化物中间层来降低工作电压并提高效率的方法。

8. 发明申请

US20130156684A1 PROCESS FOR PREPARATION OF SILVER OXIDE 有权
标题翻译：制备银氧化物的方法
公开(公告)号：US20130156684A1
公开(公告)日：2013-06-20
申请号：US13755101
申请日：2013-01-31
申请人： Inktec Co., Ltd.
发明人： Kwang Choon CHUNG , Hyun Nam CHO , Ji Hoon YOO , Kee In SON
IPC分类号： C01G5/00
CPC分类号： C01G5/00 , B82Y30/00 , C01P2004/03 , C01P2004/62 , C01P2004/64
摘要： A process for preparation of silver oxide with various shape and size using a silver complex compound having a special structure, includes 1) step of preparing a precursor solution including a silver complex compound obtained by reacting a silver compound with one or more mixture selected from the group consisting of an ammonium carbamate-based compound, an ammonium carbonate-based compound or an ammonium bicarbonate-based compound in the presence of a solvent; and 2) step of preparing silver oxide by reacting the precursor solution including the silver complex compound of step 1) with an oxidant. The shape and particle size of the silver oxide prepared according to the preparation process can be changed.
摘要翻译：使用具有特殊结构的银络合物制备具有各种形状和大小的氧化银的方法包括：1）制备包含银络合物的前体溶液的步骤，所述前体溶液是通过使银化合物与一种或多种选自在溶剂存在下由氨基甲酸铵类化合物，碳酸铵类化合物或碳酸氢铵类化合物组成的组; 和2）通过使包含步骤1）的络合物的前体溶液与氧化剂反应来制备氧化银的步骤。根据制备方法制备的氧化银的形状和粒径可以改变。

9. 发明授权

US08445578B2 Compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using same 有权
标题翻译：用于形成具有有机银络合物的反射层的组合物，以及使用其制备反射层的方法
公开(公告)号：US08445578B2
公开(公告)日：2013-05-21
申请号：US12226779
申请日：2007-04-27
申请人： Kwang-Choon Chung , Hyun-Nam Cho , Seong-Yong Uhm , Young-Kwan Seo
发明人： Kwang-Choon Chung , Hyun-Nam Cho , Seong-Yong Uhm , Young-Kwan Seo
IPC分类号： C04B28/14
CPC分类号： C07F1/005 , B05D3/0209 , B05D5/068 , B05D7/57 , C08K5/0091 , C09D5/004 , C09D7/63 , C09D11/03 , C09D11/037 , F21V7/22 , G02B5/0808
摘要： The present invention relates to compositions for forming reflecting layer having organic silver complexes, and method for preparing reflecting layer using the same. More specifically, it relates to compositions for forming reflecting layer including silver complexes that have distinct structures and the method for preparing reflecting layer, where primary coating is applied to promote the adhesive force to materials such as plastic, ceramic, metal, etc. and then a high-reflecting layer is formed by using the silver coating fluid, followed by transparent coating for protection.
摘要翻译：本发明涉及用于形成具有有机银络合物的反射层的组合物，以及使用其制备反射层的方法。更具体地说，本发明涉及形成反射层的组合物，其中包括具有不同结构的银络合物和制备反射层的方法，其中施加初级涂层以促进对塑料，陶瓷，金属等材料的粘合力，然后通过使用银涂布液形成高反射层，接着进行透明涂层保护。

10. 发明授权

US08282860B2 Process for preparation of silver nanoparticles, and the compositions of silver ink containing the same 有权
标题翻译：制备银纳米颗粒的方法，以及含有它们的银墨的组合物
公开(公告)号：US08282860B2
公开(公告)日：2012-10-09
申请号：US12376893
申请日：2007-08-02
申请人： Kwang-Choon Chung , Hyun-Nam Cho , Byung Hun Kim , Su Han Kim , Myung Bong Yoo , Nam Boo Cho , Yi Sup Han
发明人： Kwang-Choon Chung , Hyun-Nam Cho , Byung Hun Kim , Su Han Kim , Myung Bong Yoo , Nam Boo Cho , Yi Sup Han
IPC分类号： H01B1/00
CPC分类号： C09D11/322 , B22F9/24 , B22F2998/00 , B82Y30/00 , C09D11/52 , B22F1/0018 , B22F9/30
摘要： The present invention relates to a process for preparation of silver nanoparticles and the compositions of silver ink containing the same. The present invention can prepare the silver nanoparticles with various shapes through a simple preparation process, improve the selectivity of the size of the silver nanoparticles, fire the silver nanoparticles even at a low temperature of 150° C. or less during a short time, provide the ink compositions capable of forming the coating or the fine pattern showing the high conductivity, and provide the ink compositions capable of being applied to the reflective film material, the electromagnetic wave shield, and the antimicrobial agent, etc.
摘要翻译：本发明涉及一种制备银纳米颗粒的方法和含有该纳米颗粒的银墨的组合物。本发明可以通过简单的制备方法制备具有各种形状的银纳米颗粒，提高银纳米颗粒尺寸的选择性，即使在短时间内在150℃或更低的低温下也能使银纳米颗粒发火，提供能够形成涂层的油墨组合物或显示高导电性的精细图案，并且提供能够应用于反射膜材料，电磁波屏蔽和抗微生物剂等的油墨组合物。

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