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    • 5. 发明授权
    • Low surface roughness electrolytic copper foil and process for producing the same
    • 低表面粗糙度电解铜箔及其制造方法
    • US07789976B2
    • 2010-09-07
    • US10555356
    • 2004-05-12
    • Yasushi SanoNaoshi Akamine
    • Yasushi SanoNaoshi Akamine
    • C22C9/05C25D3/38
    • C25D3/38C25D1/04H05K1/09Y10T428/12431Y10T428/12993
    • An electrodeposited copper foil with low surface roughness having a surface roughness Rz not higher than 2.5 μm and an elongation percentage not smaller than 6% at 180° C. in which tensile strength at 25° C. measured within 20 min of the point in time of ending electrodeposition is not higher than 500 MPa and the lowering rate of tensile strength at 25° C. measured within 300 min of the point in time of ending electrodeposition is not higher than 10%. The electrodeposited copper foil with low surface roughness is produced by a process employing aqueous solution of sulfuric acid-copper sulfate as electrolyte and conducting a DC current between an insoluble anode of titanium coated with a platinum metal element or its oxide element and a titanium cathode drum facing the anode, wherein the electrolyte contains hydroxyethylcellulose, polyethyleneimine, a sulfonate of active organic sulfur compound, acetylene glycol and chlorine ions.
    • 表面粗糙度Rz不高于2.5μm的电沉积铜箔和在180℃下的伸长率不小于6%,其中在25℃下的拉伸强度在时间点的20分钟内测量 结垢电沉积不高于500MPa,在终电点300分钟内测定的25℃下的拉伸强度降低率不高于10%。 具有低表面粗糙度的电沉积铜箔通过使用硫酸 - 硫酸铜的水溶液作为电解质并在涂覆有铂金属元素或其氧化物元素的钛的不溶性阳极和钛阴极鼓之间传导DC电流的方法来生产 面向阳极,其中电解质包含羟乙基纤维素,聚乙烯亚胺,活性有机硫化合物的磺酸盐,乙炔二醇和氯离子。