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1. 发明授权

US4564563A Solderable conductor 失效
标题翻译：可焊接导体
公开(公告)号：US4564563A
公开(公告)日：1986-01-14
申请号：US537740
申请日：1983-09-30
申请人： F. Wayne Martin , Samson Shahbazi , Ronald J. Schoonejongen
发明人： F. Wayne Martin , Samson Shahbazi , Ronald J. Schoonejongen
IPC分类号： H05K3/12 , C09D5/24 , C09D163/00 , H01B1/22 , H05K1/09 , H01B3/30
CPC分类号： H01B1/22 , H05K1/095 , Y10S428/901 , Y10T428/12014
摘要： A solderable electrically conductive composition includes metallic silver particles embedded in a matrix formed from acrylic, carboxylated vinyl and epoxy. The composition is formed by dissolving acrylic powder and vinyl powder in respective solvents to form a first solution and a second solution. The solutions are then mixed with metallic silver particles and an epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvents and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix containing acrylic, vinyl and epoxy, on the substrate.
摘要翻译：可焊接导电组合物包含嵌入由丙烯酸，羧化乙烯基和环氧树脂形成的基质中的金属银颗粒。通过将丙烯酸粉末和乙烯基粉末溶解在各自的溶剂中以形成第一溶液和第二溶液来形成组合物。然后将溶液与金属银颗粒和环氧树脂混合以形成施加到基材上以在其上形成膜的油墨。该膜被固化以蒸发溶剂并允许发生聚合，从而留下可嵌入的导电膜，该膜由在基体上包含丙烯酸，乙烯基和环氧树脂的基体中的金属银颗粒形成。

2. 发明授权

US4301439A Film type resistor and method of producing same 失效
标题翻译：薄膜型电阻器及其制造方法
公开(公告)号：US4301439A
公开(公告)日：1981-11-17
申请号：US972793
申请日：1978-12-26
申请人： Gary W. Johnson , David G. Hilson
发明人： Gary W. Johnson , David G. Hilson
IPC分类号： H01C7/00 , H01C17/24 , H01G4/40 , H01C10/00
CPC分类号： H01C17/24 , Y10T29/49099
摘要： A film type resistor especially suitable for use on planar electronic circuit substrates. The resistor is capable of being adjusted or trimmed to provide resistance values over a substantially wide range. The resistor can also be trimmed while actively functioning in a circuit including one or more other components, so as to provide a desired operating parameter for the circuit.

3. 发明授权

US4481261A Blister-resistant dielectric 失效
标题翻译：防水电介质
公开(公告)号：US4481261A
公开(公告)日：1984-11-06
申请号：US445687
申请日：1982-12-01
申请人： Gary W. Johnson , Ronald J. Schoonejongen , David G. Hilson, II
发明人： Gary W. Johnson , Ronald J. Schoonejongen , David G. Hilson, II
IPC分类号： H01B3/08 , H01B3/12 , H01L23/498 , H05K1/00 , H05K1/03 , B32B17/06
CPC分类号： H01L23/49894 , H01B3/085 , H01B3/12 , H01L2924/0002 , H05K1/0306 , H05K3/4676 , Y10T29/49126
摘要： A blister-resistant thick film dielectric is usable with multilayer circuits having one conductor layer comprising gold and another conductor layer comprising silver to prevent blistering and other unwanted phenomena resulting from an adverse electrochemical reaction from occurring between the conductor layers during the firing process. The dielectric is comprised be weight, without vehicle, of about 50% lead-boro-silicate glass, between about 25% to about 40% Al.sub.2 O.sub.3 and between about 10% to 25% an oxide mixture comprised of Co.sub.2 O.sub.3, Cr.sub.2 O.sub.3 Fe.sub.2 O.sub.3, said oxide mixture having been heated to about 1000.degree. C. for about 24 hours. In a preferred embodiment the dielectric is comprised by weight, without vehicle, of about 50% lead-boro-silicate, about 40% Al.sub.2 O.sub.3 and about 10% oxide mixture. The oxide mixture in a preferred embodiment is comprised by weight of about 37.4% Co.sub.2 O.sub.3, about 25.6% Cr.sub.2 O.sub.3 and about 37.0% Fe.sub.2 O.sub.3.
摘要翻译：耐泡厚膜电介质可用于具有一个包含金的导体层和包含银的另一个导体层的多层电路，以防止起泡和由于在烧结过程期间在导体层之间发生不利的电化学反应而导致的其它不期望的现象。电介质包括约50％的铅硼硅酸盐玻璃，约25％至约40％的Al 2 O 3和约10％至25％的氧化物混合物，由Co 2 O 3，Cr 2 O 3，Fe 2 O 3，所述氧化物混合物加热至约1000℃约24小时。在优选的实施方案中，电介质由重量百分比不含载体包含约50％的铅 - 硼硅酸盐，约40％的Al 2 O 3和约10％的氧化物混合物。优选实施方案中的氧化物混合物的重量为约37.4％的Co 2 O 3，约25.6％的Cr 2 O 3和约37.0％的Fe 2 O 3。

4. 发明授权

US4535012A Fast curing solderable conductor 失效
标题翻译：快速固化可焊接导体
公开(公告)号：US4535012A
公开(公告)日：1985-08-13
申请号：US537735
申请日：1983-09-30
申请人： F. Wayne Martin , Samson Shahbazi , Ronald J. Schoonejongen
发明人： F. Wayne Martin , Samson Shahbazi , Ronald J. Schoonejongen
IPC分类号： H05K3/12 , C09D5/24 , C09D133/04 , C09D163/00 , H01B1/22 , H05K20060101 , H05K1/09 , B05D3/02
CPC分类号： H05K1/095 , H01B1/22
摘要： A solderable electrically conductive composition includes metallic silver particles embedded in a matrix of carboxylated vinyl and epoxy. The composition is formed by dissolving the vinyl in a solvent to form a solution. The solution is then mixed with the metallic silver particles and the epoxy to form an ink which is applied to a substrate to form a film thereon. The film is cured to evaporate the solvent and allow polymerization to occur thereby leaving a solderable electrically conductive film, formed from metallic silver particles embedded in a matrix of vinyl and epoxy, on the substrate.
摘要翻译：可焊接的导电组合物包括嵌入羧化乙烯基和环氧树脂基质中的金属银颗粒。通过将乙烯基溶解在溶剂中形成溶液来形成组合物。然后将溶液与金属银颗粒和环氧树脂混合以形成施加到基底上以在其上形成膜的油墨。该膜被固化以蒸发溶剂并允许发生聚合，从而留下可嵌入的导电膜，其由嵌入在基底中的乙烯基和环氧树脂基质中的金属银颗粒形成。

5. 发明授权

US4350618A Thick film conductors for use in microelectronic packaging 失效
标题翻译：用于微电子封装的厚膜导体
公开(公告)号：US4350618A
公开(公告)日：1982-09-21
申请号：US94900
申请日：1979-11-16
申请人： David G. Hilson , Gary W. Johnson , Ronald J. Schoonejongen
发明人： David G. Hilson , Gary W. Johnson , Ronald J. Schoonejongen
IPC分类号： H01L21/52 , H01B1/16 , H01L21/48 , H01L23/498 , H01L27/01 , H05K1/09 , H01B1/02 , C09D5/10 , H01L23/48
CPC分类号： H01L23/49883 , H01B1/16 , H01L21/4867 , H01L27/013 , H01L2924/0002 , H05K1/092
摘要： In a microelectronic package of the type where Si-based integrated circuits are eutectically attached to a Pd/Au-based thick film conductor, a method of reducing the potential for thermal runaway is taught. The method involves increasing the surface area of the Pd to lower the Vbe rating. This reduces the potential for thermal runaway in subsequent integrated circuit operation. It has also been found that increasing the particle size of the Au component further decreases the Vbe rating.
摘要翻译：在其中基于Si的集成电路共同附着到基于Pd / Au的厚膜导体的类型的微电子封装中，教导了减少热失控的可能性的方法。该方法包括增加Pd的表面积以降低Vbe等级。这降低了后续集成电路操作中热失控的可能性。还已经发现，增加Au成分的粒径进一步降低了Vbe等级。

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