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1. 发明授权

US07271012B2 Failure analysis methods and systems 有权
标题翻译：故障分析方法和系统
公开(公告)号：US07271012B2
公开(公告)日：2007-09-18
申请号：US10891828
申请日：2004-07-14
申请人： Gregory B. Anderson
发明人： Gregory B. Anderson
IPC分类号： G01R31/26
CPC分类号： B23K26/0665 , B23K26/03 , B23K26/032 , B23K26/082 , B23K26/0853 , B23K2101/40 , B23K2103/42 , B23K2103/50 , G01R31/2898 , G01R31/308
摘要： A method and system for exposing the delicate structures of a device encapsulated in a mold compound such as an integrated circuit (IC). A laser is used to ablate the mold compound and thus remove it, exposing the underlying structure. The laser beam can be steered in a desired raster pattern onto the surface of the device or the device can be moved in the desired pattern relative to the laser beam. Spectral analysis can be performed on the laser plume emitted by the ablation process in order to determine the composition of the ablated material. Thus, in addition to exposing defects in the underlying structure, the system can also be used to analyze the encapsulating material in order to determine whether it contained any defects or anomalies. A system for precisely cutting a circuit board or an IC in a user-selected pattern is also described. The system directs a laser along a path that a user can specify using a graphical interface.
摘要翻译：用于暴露封装在诸如集成电路（IC）的模具化合物中的器件的精细结构的方法和系统。激光用于烧蚀模具化合物，从而将其去除，暴露下面的结构。可以将激光束以期望的光栅图案转向装置的表面上，或者可以相对于激光束以期望的图案移动该装置。可以对由消融过程发射的激光羽流进行光谱分析，以便确定烧蚀材料的组成。因此，除了暴露底层结构中的缺陷之外，系统还可以用于分析封装材料，以便确定其是否包含任何缺陷或异常。还描述了以用户选择的图案精确地切割电路板或IC的系统。系统沿着用户可以使用图形界面指定的路径引导激光。

2. 发明申请

US20110089152A1 METHOD AND SYSTEM FOR EXPOSING DELICATE STRUCTURES OF A DEVICE ENCAPSULATED IN A MOLD COMPOUND 审中-公开
标题翻译：用于暴露在模具化合物中封装的器件的修饰结构的方法和系统
公开(公告)号：US20110089152A1
公开(公告)日：2011-04-21
申请号：US12580652
申请日：2009-10-16
申请人： Gregory B. Anderson
发明人： Gregory B. Anderson
IPC分类号： B23K26/00
CPC分类号： B23K26/009 , B23K26/082 , B23K26/144 , B23K26/146 , B23K26/40 , B23K2103/16 , H01L21/56 , H01L2924/0002 , H01L2924/00
摘要： A system utilizes a laser to remove the mold compound of an IC without damaging the internal die, wire leads, solder connections and any other critical structures encapsulated within the mold compound, thereby leaving them available for the provisional and electrical analysis. A laser beam is focused through appropriate optics onto a plane corresponding to the surface of an IC. A layer of material which is opaque at the wave length of the laser beam is applied at the surface of the IC chip to be ablated prior to each pass of the laser. A spray nozzle may be provided to move in synchronous motion ahead of the laser being to apply coat of the opaque material.
摘要翻译：系统利用激光器去除IC的模具化合物，而不会损坏内部模具，导线，焊接连接以及封装在模具化合物内的任何其他关键结构，从而使它们可用于临时和电气分析。激光束通过适当的光学器件聚焦到对应于IC表面的平面上。在激光束的每次通过之前，将在激光束的波长处不透明的材料层施加于待切割的IC芯片的表面。可以设置喷嘴以在激光之前以同步运动移动以施加不透明材料的涂层。

3. 发明申请

US20050064682A1 Failure analysis methods and systems 有权
标题翻译：故障分析方法和系统
公开(公告)号：US20050064682A1
公开(公告)日：2005-03-24
申请号：US10891828
申请日：2004-07-14
申请人： Gregory Anderson
发明人： Gregory Anderson
IPC分类号： B23K26/03 , B23K26/08 , B23K26/40 , G01R31/28 , G01R31/308 , H01L20060101 , H01L21/46
CPC分类号： B23K26/0665 , B23K26/03 , B23K26/032 , B23K26/082 , B23K26/0853 , B23K2101/40 , B23K2103/42 , B23K2103/50 , G01R31/2898 , G01R31/308
摘要： A method and system for exposing the delicate structures of a device encapsulated in a mold compound such as an integrated circuit (IC). A laser is used to ablate the mold compound and thus remove it, exposing the underlying structure. The laser beam can be steered in a desired raster pattern onto the surface of the device or the device can be moved in the desired pattern relative to the laser beam. Spectral analysis can be performed on the laser plume emitted by the ablation process in order to determine the composition of the ablated material. Thus, in addition to exposing defects in the underlying structure, the system can also be used to analyze the encapsulating material in order to determine whether it contained any defects or anomalies. A system for precisely cutting a circuit board or an IC in a user-selected pattern is also described. The system directs a laser along a path that a user can specify using a graphical interface.
摘要翻译：用于暴露封装在诸如集成电路（IC）的模具化合物中的器件的精细结构的方法和系统。激光用于烧蚀模具化合物，从而将其去除，暴露下面的结构。可以将激光束以期望的光栅图案转向装置的表面上，或者可以相对于激光束以期望的图案移动该装置。可以对由消融过程发射的激光羽流进行光谱分析，以便确定烧蚀材料的组成。因此，除了暴露底层结构中的缺陷之外，还可以使用该系统来分析封装材料，以便确定其是否包含任何缺陷或异常。还描述了以用户选择的图案精确地切割电路板或IC的系统。系统沿着用户可以使用图形界面指定的路径引导激光。

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