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1. 发明授权

US5957764A Modular wafer polishing apparatus and method 失效
标题翻译：模块化晶圆抛光装置及方法
公开(公告)号：US5957764A
公开(公告)日：1999-09-28
申请号：US964930
申请日：1997-11-05
申请人： H. Alexander Anderson , Linh X. Can , Tsungnan Cheng , Garry K. Kwong , Albert Hu , David Chen , Shu-Wong S. Lee
发明人： H. Alexander Anderson , Linh X. Can , Tsungnan Cheng , Garry K. Kwong , Albert Hu , David Chen , Shu-Wong S. Lee
IPC分类号： B24B21/04 , B24B37/04 , B24B5/00 , B24B29/00
CPC分类号： B24B21/04 , B24B37/04
摘要： A wafer polishing apparatus includes a module frame; a continuous belt rotatable with respect to the frame, the belt having at least one vertically-oriented belt transverse portion including a polishing pad assembly; and at least one pivotable wafer-holding head drive within the frame and having a distal end portion movable to a vertical first position parallel and juxtaposed to the belt transverse portion. The head drive includes a wafer carrier for holding a wafer on the distal end portion of the head drive, while a drive moves the distal end portion and a held wafer into a vertical polishing position abutting the belt transverse portion and pressure is applied to the held-wafer against the polishing pad assembly while the wafer-holding distal end portion is rotated and swept side-by-side. After polishing the drive is reversed and the head drive is pivoted away from the belt transverse portion to a horizontal or other orientation and the then polished wafer removed. Multiple modules may be placed end-to-end or side-by-side with a robot pathway therebetween to load unpolished wafers and to unload polished wafers to a buffing station, to a cassette or other processing station.
摘要翻译：晶片抛光装置包括模块框架; 相对于框架可旋转的连续带，所述带具有包括抛光垫组件的至少一个垂直定向的带横向部分; 以及在所述框架内的至少一个可枢转的晶片保持头驱动器，并且具有可移动到平行并并列到所述带横向部分的垂直第一位置的远端部分。头驱动器包括用于将晶片保持在头驱动器的远端部分的晶片载体，同时驱动器将远端部分和保持的晶片移动到邻近带横向部分的垂直抛光位置，并且压力施加到保持的 - 在晶片保持前端部分旋转并且并排扫掠的同时，抵靠抛光垫组件。在抛光之后，驱动器被反转并且头驱动器从带横向部分转动到水平或其它方向，并且然后抛光晶片。多个模块可以端对端或并排地放置在其间的机器人通路以加载未抛光的晶片并将抛光的晶片卸载到抛光台，到盒或其它处理站。

2. 发明授权

US6159083A Polishing head for a chemical mechanical polishing apparatus 失效
标题翻译：抛光头用于化学机械抛光装置
公开(公告)号：US6159083A
公开(公告)日：2000-12-12
申请号：US116160
申请日：1998-07-15
申请人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
发明人： Gregory A. Appel , Charles J. Regan , David E. Weldon , Shou-sung Chang , Gregory C. Lee
IPC分类号： B24B37/30 , B24B7/22
CPC分类号： B24B37/30 , Y10S977/775 , Y10S977/888
摘要： A polishing head for a chemical mechanical polishing (CMP) apparatus. The polishing head includes a backplate, a retaining ring supported by the backplate, and a bladder member encircled by the retaining ring. The backplate of the polishing head comprises a driving plate biasedly coupled to a subcarrier by a bellows. The polishing head may further include a lift plate disposed on the subcarrier and beneath the bladder member. A method for polishing a substrate includes placing a substrate on the bladder member and positioning the substrate against a polishing pad such that the bladder member applies a selected pressure profile on the substrate.
摘要翻译：用于化学机械抛光（CMP）装置的抛光头。抛光头包括背板，由背板支撑的保持环和由保持环包围的气囊构件。抛光头的背板包括通过波纹管偏压耦合到副载波的驱动板。抛光头还可以包括设置在副载架上并在气囊构件下方的提升板。抛光衬底的方法包括将衬底放置在气囊构件上并将衬底定位在抛光垫上，使得气囊构件在衬底上施加选定的压力分布。

3. 发明授权

US6059643A Apparatus and method for polishing a flat surface using a belted polishing pad 失效
标题翻译：使用带状抛光垫对平坦表面进行抛光的装置和方法
公开(公告)号：US6059643A
公开(公告)日：2000-05-09
申请号：US803623
申请日：1997-02-21
申请人： Albert Hu , Burford J. Furman , Mohamed Abushaban
发明人： Albert Hu , Burford J. Furman , Mohamed Abushaban
IPC分类号： B24B21/06 , B24B21/12 , B24B37/04 , G11B5/84 , B24B21/04
CPC分类号： B24B21/12 , B24B21/06 , B24B37/04 , G11B5/84 , G11B5/8404
摘要： The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.
摘要翻译：本发明涉及一种用于晶片，平板显示器（FPD）和硬盘驱动盘（HDD）的化学机械平面化（“CMP”）的设备和方法。优选的装置包括相对于底层在垂直方向上空间取向的环状带。抛光垫胶合到带的外表面。在带的内表面上，存在多个晶片支撑件，以在抛光过程中支撑晶片。在抛光之前，使用处理结构将晶片从晶圆台装载到晶片头，并且在抛光之后从晶片头卸载到晶片台。使用电动机或等效物来驱动环形带运行在两个滑轮上。调节装置用于调节皮带的张力和位置，以使其平稳运行。这种新的CMP机器可以安装在多个方向，以节省制造空间。

4. 发明授权

US6149512A Linear pad conditioning apparatus 失效
标题翻译：线性调节装置
公开(公告)号：US6149512A
公开(公告)日：2000-11-21
申请号：US965514
申请日：1997-11-06
申请人： Ethan C. Wilson , H. Alexander Anderson , Gregory Appel
发明人： Ethan C. Wilson , H. Alexander Anderson , Gregory Appel
IPC分类号： B24B53/007 , B24B53/017 , B24B53/00
CPC分类号： B24B53/017 , Y10S977/775
摘要： A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.
摘要翻译：线性垫调节机构为安装在CMP设备的抛光带上的抛光垫提供线性原位或非原位调节。线性调节机构包括用于在与研磨带的行进方向正交的方向上驱动调节垫的线性振荡机构。在一个示例中，提供多个调节组件以各自提供梯形调节垫，并且调节组件被定位成使得抛光带的行进方向上的恒定宽度区域被设置。在该示例中，提供旋转机构以将调节垫定位在抵靠抛光垫的调节位置和清洗液槽中的清洁位置之间。此外，每个调理组件设置到调节器块的流体输送系统，使得可以在使用时输送调理液。

5. 发明授权

US6126527A Seal for polishing belt center support having a single movable sealed cavity 失效
标题翻译：用于抛光带中心支撑件的密封件具有单个可移动密封腔
公开(公告)号：US6126527A
公开(公告)日：2000-10-03
申请号：US113540
申请日：1998-07-10
申请人： Shu-Hsin Kao , William F. Lapson , Charles J. Regan , David E. Weldon
发明人： Shu-Hsin Kao , William F. Lapson , Charles J. Regan , David E. Weldon
IPC分类号： B24B21/06 , B24B37/04 , B24B49/16 , B24B21/00
CPC分类号： B24B49/16 , B24B21/06 , B24B37/04
摘要： A polishing tool uses a seal cavity containing a fluid that supports polishing pads against an object being polished. The boundaries of the cavity include a support structure, a portion of a polishing material, and a seal between the support structure and the polishing material. The polishing material moves relative to the support structure and seal. A variety of seal configurations can maintain the fluid within the cavity. In one embodiment the seal mechanism is a labyrinth seal including multiple ridges. In one embodiment, the seal mechanism is a face-sealing seal which includes a jacket with a u-shaped cross section with a compressible element positioned within it. The face-sealing seal is in a groove positioned outside of the cavity. Alternatively, the face-sealing seal forms the outer edge of the cavity. In a further embodiment, the seal is an o-ring seal positioned within a double dove-tailed groove.
摘要翻译：抛光工具使用包含支撑抛光垫的流体的密封腔，该抛光垫抵靠被抛光的物体。空腔的边界包括支撑结构，抛光材料的一部分以及支撑结构和抛光材料之间的密封。抛光材料相对于支撑结构移动并进行密封。各种密封构造可以将流体保持在空腔内。在一个实施例中，密封机构是包括多个脊的迷宫式密封件。在一个实施例中，密封机构是面密封，其包括具有U形横截面的夹套，其中可压缩元件位于其内。面密封处于位于空腔外部的槽中。或者，面密封形成空腔的外边缘。在另一个实施例中，密封件是位于双鸽尾槽内的O形圈密封件。

6. 发明授权

US6098901A Apparatus for dispensing slurry 失效
标题翻译：用于分配浆料的设备
公开(公告)号：US6098901A
公开(公告)日：2000-08-08
申请号：US113727
申请日：1998-07-10
申请人： Peter Mok , Jon Chun
发明人： Peter Mok , Jon Chun
IPC分类号： B01J4/00 , B24B37/04 , B24B57/02 , H01L21/302 , H01L21/304 , B05B3/02 , B05B3/10
CPC分类号： B24B37/04 , B24B57/02 , H01L21/302
摘要： A slurry dispenser dispensing slurry by a pair of counter-rotating wheels is provided in a chemical mechanical polishing process used in manufacturing integrated circuits. The slurry dispenser is driven by variable speed motors at a predetermined speed empirically determined to dispense a desired amount of slurry. The shape of the rotating wheels controls the vertical distribution of the spray. Openings in the housing of the slurry dispenser and the speed of rotation of the wheels controls the horizontal distribution of the spray. The slurry dispenser can be constructed out of materials chemically inert with respect to the slurry.
摘要翻译：在制造集成电路中使用的化学机械抛光工艺中提供了通过一对反向转轮分配浆料的浆料分配器。浆料分配器由变速马达以经验确定的预定速度驱动以分配所需量的浆料。旋转轮的形状控制喷雾的垂直分布。浆料分配器的壳体中的开口和车轮的旋转速度控制喷雾的水平分布。浆料分配器可以由相对于浆料化学惰性的材料构成。

7. 发明授权

US6042457A Conditioner assembly for a chemical mechanical polishing apparatus 失效
标题翻译：用于化学机械抛光装置的调节器组件
公开(公告)号：US6042457A
公开(公告)日：2000-03-28
申请号：US113614
申请日：1998-07-10
申请人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
发明人： Ethan C. Wilson , James A. Allen , David E. Weldon , Gregory C. Lee , Linh X. Can , Jeffrey M. L. Fontana , Shou-sung Chang , Jade Jaboneta
IPC分类号： B24B53/007 , B24B53/017 , B24B1/00
CPC分类号： B24B53/017
摘要： A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The bearing housing rotatably supports the linear torque bearing assembly such that a motor assembly can operatively drive the linear torque bearing assembly, the shaft, and the conditioning head.The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect. The conditioner back support further includes a polymeric compound disposed on the front surface of the backing plate for reducing the frictional force between the backing plate and the polishing belt.
摘要翻译：调节器组件和用于调节化学机械抛光装置的抛光垫的调节器背部支撑件。调节器组件包括具有万向节组件，接合到调节头的轴和可滑动地接收轴的线性扭矩轴承组件的调节头。线性扭矩轴承组件构造成可同时使轴组件可操作地旋转，允许轴从线性扭矩轴承组件的第一开口端延伸和缩回。调节器组件另外包括固定在第一开口端上并接合到调节头的波纹管和设置在线性扭矩轴承组件的第二开口端上的轴承壳体。轴承座可旋转地支撑线性扭矩轴承组件，使得马达组件可操作地驱动线性扭矩轴承组件，轴和调节头。调理器背部支撑分别与调节器组件相对，使得支撑抛光垫的抛光带设置在调节器背部支撑件和调节器组件的中间。护发背部支撑件包括可调节地支撑背板的框架组件。框架组件包括允许使用者调整背板的位置的定位组件。可以调节背板的位置，使得背板的前表面平行于并设置在由抛光带的背面限定的平面上或其附近。结果，当调节器组件压靠抛光垫时，抛光垫不会显着偏转。调理器背部支撑件还包括设置在背板的前表面上的聚合物，用于减小背板和抛光带之间的摩擦力。

8. 发明授权

US6146249A Apparatus and method for polishing a flat surface using a belted polishing pad 有权
公开(公告)号：US6146249A
公开(公告)日：2000-11-14
申请号：US177089
申请日：1998-10-22
申请人： Albert Hu , Burford J. Furman , Mohamed Abushaban
发明人： Albert Hu , Burford J. Furman , Mohamed Abushaban
IPC分类号： B24B21/06 , B24B21/12 , B24B37/04 , G11B5/84 , B24B1/00
CPC分类号： B24B21/12 , B24B21/06 , B24B37/04 , G11B5/84 , G11B5/8404
摘要： The present invention relates to an apparatus and method of Chemical Mechanical Planarization ("CMP") for wafer, flat panel display (FPD), and hard drive disk (HDD). The preferred apparatus comprises a looped belt spatially oriented in a vertical direction with respect to a ground floor. A polishing pad is glued to an outer surface of the belt. At an inner surface of the belt, there are a plurality of wafer supports to support the wafers while they are in polishing process. Wafers are loaded from a wafer station to a wafer head using a handling structure before polishing and are unloaded from the wafer head to the wafer station after polishing. An electric motor or equivalent is used to drive the looped belt running over two pulleys. An adjustment means is used to adjust the tension and position of the belt for smooth running. This new CMP machine can be mounted in multiple orientations to save manufacturing space.

9. 发明授权

US6126512A Robust belt tracking and control system for hostile environment 失效
标题翻译：强大的皮带追踪和控制系统，用于敌对环境
公开(公告)号：US6126512A
公开(公告)日：2000-10-03
申请号：US113485
申请日：1998-07-10
申请人： Mike Chao , Tim H. Huynh , Chi Guo , Huey M. Tzeng
发明人： Mike Chao , Tim H. Huynh , Chi Guo , Huey M. Tzeng
IPC分类号： B24B21/20 , B24B37/005 , B24B49/10 , F16H7/18
CPC分类号： B24B37/005 , B24B21/20 , B24B49/10
摘要： An automated tracking and control system measures the lateral displacement of a moving belt, using non-contact sensing. The displacement signal is provided to an algorithm that adjusts the tilts of the belt pulleys and steers the belt laterally. Non-contact sensors include inductive proximity sensors, which respond to the metal belt but are immune to airborne slurry and other non-metallic debris in a hostile environment typical of wafer polishing. Other non-contact sensors include shielded optical sensors. Dual sensor configurations cancel response to non-lateral displacements. Instrumentation, such as tension sensors, cylinder pressure sensors, load transducers, and limit switches, provides input to the algorithm. Independent tension signals for each belt edge verify proper functioning of, e.g., pad conditioners. User-specified belt displacements, e.g., dither, sawtooth oscillation, step, ramp, and sweep, combine with selective texturing and other variable pad properties to provide a desired polishing rate profile.
摘要翻译：自动跟踪和控制系统使用非接触感测来测量移动皮带的横向位移。位移信号被提供给调整皮带轮的倾斜并且横向转向皮带的算法。非接触传感器包括电感式接近传感器，其响应于金属带，但是在典型的晶片抛光的恶劣环境中对空气中的浆料和其它非金属碎屑是免疫的。其他非接触式传感器包括屏蔽光学传感器。双传感器配置取消对非横向位移的响应。仪器仪表，例如张力传感器，气缸压力传感器，负载传感器和限位开关，为算法提供了输入。每个带边缘的独立张力信号验证例如垫调节器的正常功能。用户指定的带位移，例如抖动，锯齿波振荡，步进，斜坡和扫描，与选择性纹理化和其他可变焊盘属性组合以提供期望的抛光速率分布。

10. 发明授权

US6086456A Polishing method using a hydrostatic fluid bearing support having fluctuating fluid flow 失效
标题翻译：使用具有波动的流体流动的静液压轴承支架的抛光方法
公开(公告)号：US6086456A
公开(公告)日：2000-07-11
申请号：US187532
申请日：1998-11-06
申请人： David E. Weldon , Shu-Hsin Kao , Tim H. Huynh
发明人： David E. Weldon , Shu-Hsin Kao , Tim H. Huynh
IPC分类号： B24B21/04 , B24B21/10 , B24B37/04 , B24B41/04 , F16C32/06 , H01L21/302 , B24B21/00
CPC分类号： F16C32/06 , B24B21/10 , B24B37/04 , B24B37/042 , B24B41/04 , B24B41/042 , H01L21/302
摘要： A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing. Yet another aspect of the invention provides a hydrostatic bearing with spiral or partial cardiod drain grooves. This bearing has a non-uniform support pressure profile but provides a uniform average pressure to a wafer that is rotated relative to the center of the bearing. Another aspect of the invention provides a hydrostatic bearing with constant fluid pressure at inlets but a support pressure profile that is adjustable by changing the relative heights of fluid inlets to alter local fluid film thicknesses in the hydrostatic bearing.
摘要翻译：诸如化学机械带抛光机的抛光系统包括支撑抛光垫并且包含以下新颖方面中的一个或多个的静压流体轴承。一个方面使用围绕入口阵列的流体入口周围的顺应性表面来延伸围绕入口的升高的支撑压力的区域。另一方面调节或反转轴承中的流体流动，以减少时间平均支撑压力的偏差并且引起抛光垫中的振动以改善抛光性能。另一方面提供一种具有空腔的静压轴承，该空腔的横向范围大于被抛光物体的横向范围。可以调节空腔的深度和底部轮廓，以在由保持环支撑件包围的区域上提供几乎均匀的支撑压力。将流体压力改变到保持环支架可调节轴承的流体膜厚度。本发明的另一方面提供一种具有螺旋或部分心碘排泄槽的静压轴承。该轴承具有不均匀的支撑压力分布，但是相对于轴承的中心旋转的晶片提供均匀的平均压力。本发明的另一方面提供了一种静压轴承，其在入口处具有恒定的流体压力，但是支撑压力分布可通过改变流体入口的相对高度来调节，以改变静压轴承中的局部流体膜厚度。

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