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    • 1. 发明授权
    • Process for continuous production of a multilayer electric cable
    • 连续生产多层电缆的方法
    • US4469539A
    • 1984-09-04
    • US506584
    • 1983-06-22
    • Robert M. WadeGeorge N. BenjaminMarwick H. SolomonDaniel H. Jessop
    • Robert M. WadeGeorge N. BenjaminMarwick H. SolomonDaniel H. Jessop
    • H01B1/24H01B13/14
    • H01B1/24H01B13/141H01B13/145H01B13/148Y10T156/109Y10T428/2947
    • An improved multilayer electric cable is disclosed having a conductive core, an extruded strand shield (ESS) layer, an insulating layer of polymeric insulation material surrounding the core and coaxial therewith, a semiconductive insulation shield (EIS) layer strippably bonded to the insulation layer surrounding it and coaxial therewith and, preferably, a plurality of axially extending drain wires disposed within the semiconductive EIS layer. The semiconductive EIS layer is formed of a copolymer of an ethylene/acrylate/monoalkyl ester of 1,4-butenedioic acid copolymer, conductive carbon black, a peroxide curing agent and polyethylene or polyethylene copolymer. The semiconductive EIS layer is applied by extrusion at elevated temperature in a dry gas atmosphere. Such dry processing conditions are sufficiently severe that the copolymer of ethylene/acrylate/ester can reliably serve as a suitable basis for the semiconductive EIS layer, since other conventional semiconductive compositions are susceptible to being adversely affected by the severe conditions of dry processing.
    • 公开了一种改进的多层电缆,其具有导电芯,挤出线屏蔽(ESS)层,围绕芯并与其同轴的聚合物绝缘材料的绝缘层,可剥离地结合到绝缘层周围的半导体绝缘屏蔽(EIS)层 并且优选地,设置在半导体EIS层内的多个轴向延伸的漏极线。 半导体EIS层由1,4-丁烯二酸共聚物的乙烯/丙烯酸酯/单烷基酯,导电炭黑,过氧化物固化剂和聚乙烯或聚乙烯共聚物的共聚物形成。 半导体EIS层通过在干燥气体气氛中在升高的温度下挤出来施加。 这种干燥加工条件足够严重,使得乙烯/丙烯酸酯/酯的共聚物可以可靠地用作半导体EIS层的合适基础,因为其它常规的半导体组合物易受到干法处理的苛刻条件的不利影响。
    • 5. 发明授权
    • Process for continuous production of a multilayer electric cable and
materials therefor
    • 连续生产多层电缆及其材料的方法
    • US4469538A
    • 1984-09-04
    • US468777
    • 1983-02-22
    • Robert M. WadeGeorge N. BenjaminMarwick H. SolomonDaniel H. Jessop
    • Robert M. WadeGeorge N. BenjaminMarwick H. SolomonDaniel H. Jessop
    • H01B1/24H01B13/14
    • H01B13/145H01B1/24H01B13/141H01B13/148Y10T156/109Y10T428/2947
    • An improved multilayer electric cable is disclosed having a conductive core, an extruded strand shield (ESS) layer, an insulating layer of polymeric insulation material surrounding the core and coaxial therewith, a semi-conductive insulation shield (EIS) layer strippably bonded to the insulation layer surrounding it and coaxial therewith and, preferably, a plurality of axially extending drain wires disposed within the semiconductive EIS layer. The semi-conductive EIS layer is formed of a copolymer of an ethylene/alkylacrylate/monoalkyl ester of 1,4-butenedioic acid copolymer, conductive carbon black, and a peroxide curing agent and preferably also a copolymer of ethylene and propylene or a copolymer of ethylene, propylene and an unconjugated diene. The semi-conductive EIS layer is applied by extrusion at elevated temperature in a dry gas atmosphere. Such dry processing conditions are sufficiently severe that the copolymer of ethylene/acrylate/ester can reliably serve as a suitable basis for the semi-conductive EIS layer, since other conventional semi-conductive compositions are susceptible to being adversely affected by the severe conditions of dry processing.
    • 公开了一种改进的多层电缆,其具有导电芯,挤出线束屏蔽层(ESS)层,围绕芯并与其同轴的聚合物绝缘材料的绝缘层,可剥离地结合到绝缘体上的半导体绝缘屏蔽(EIS)层 并且优选地,设置在半导体EIS层内的多个轴向延伸的漏极线。 半导电性EIS层由1,4-丁烯二酸共聚物的乙烯/丙烯酸烷基酯/单烷基酯,导电性炭黑和过氧化物固化剂的共聚物形成,优选也可以是乙烯与丙烯的共聚物或共聚物 乙烯,丙烯和非共轭二烯。 半导电EIS层通过在干燥气体气氛中在升高的温度下挤出来施加。 这种干燥处理条件足够严重,使得乙烯/丙烯酸酯/酯的共聚物可以可靠地用作半导电EIS层的合适基础,因为其它常规的半导体组合物易受严重的干燥条件的不利影响 处理。