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    • 81. 发明授权
    • Vertical transistors
    • 垂直晶体管
    • US08372710B2
    • 2013-02-12
    • US13329977
    • 2011-12-19
    • Werner Juengling
    • Werner Juengling
    • H01L21/8242H01L21/336H01L21/20
    • H01L29/7827H01L27/1052H01L27/10823H01L27/10876H01L27/11H01L27/115H01L27/11517H01L29/66621H01L29/78
    • A semiconductor structure having U-shaped transistors includes source/drain regions at the tops of pairs of pillars defined by crossing trenches in the substrate. One pillar is connected to the other pillar in the pair by a ridge that extends above the surrounding trenches. The ridge and lower portions of the pillars define U-shaped channels on opposite sides of the U-shaped structure, facing a gate structure in the trenches on those opposite sides, forming a two sided surround transistor. Optionally, the space between the pillars of a pair is also filled with gate electrode material to define a three-sided surround gate transistor. One of the source/drain regions of each pair extending to a digit line and the other extending to a memory storage device, such as a capacitor. Methods of forming semiconductor structures are also disclosed.
    • 具有U形晶体管的半导体结构包括由衬底中的交叉沟槽限定的柱对的顶部的源/漏区域。 一个支柱通过在周围的沟槽上方延伸的脊连接到一对中的另一个柱。 柱的脊和下部在U形结构的相对侧限定U形通道,面对在那些相对侧上的沟槽中的栅极结构,形成双面环绕晶体管。 可选地,一对柱之间的空间也用栅电极材料填充以限定三面环绕栅极晶体管。 每对的源极/漏极区之一延伸到数字线,而另一个延伸到诸如电容器的存储器存储器件。 还公开了形成半导体结构的方法。
    • 82. 发明授权
    • Method in depositing metal oxide materials
    • 沉积金属氧化物材料的方法
    • US08367561B2
    • 2013-02-05
    • US12663782
    • 2008-07-02
    • Jarmo MaulaKari Harkonen
    • Jarmo MaulaKari Harkonen
    • H01L21/31H01L21/00H01L21/8242H01L21/469H01L21/44
    • C23C16/45534C23C16/403C23C16/405
    • The present invention relates to a method for enhancing uniformity of metal oxide coatings formed by Atomic Layer Deposition (ALD) or ALD-type processes. Layers are formed using alternating pulses of metal halide and oxygen-containing precursors, preferably water, and purging when necessary. An introduction of modificator pulses following the pulses of the oxygen-containing precursor affects positively on layer uniformity, which commonly exhibits gradients, particularly in applications with closely arranged substrates. In particular, improvement in layer thickness uniformity is obtained. According to the invention, alcohols having one to three carbon atoms can be used as the modificator.
    • 本发明涉及一种增强由原子层沉积(ALD)或ALD型工艺形成的金属氧化物涂层的均匀性的方法。 使用金属卤化物和含氧前体,优选水的交替脉冲形成层,并且在必要时进行清洗。 在含氧前体的脉冲之后引入改性脉冲对层的均匀性产生积极影响,这通常表现出梯度,特别是在具有紧密排列的衬底的应用中。 特别地,获得了层厚均匀性的改善。 根据本发明,可以使用具有一至三个碳原子的醇作为改性剂。
    • 85. 发明授权
    • Semiconductor device and method for fabricating the same
    • 半导体装置及其制造方法
    • US08324049B2
    • 2012-12-04
    • US12641073
    • 2009-12-17
    • Jin-A KimSeok-Ho Jie
    • Jin-A KimSeok-Ho Jie
    • H01L21/8242
    • H01L27/10894H01L27/105H01L27/10852
    • A semiconductor device and a method for fabricating a semiconductor device are provided. The method for fabricating a semiconductor device includes forming an isolation layer over a semiconductor substrate defining first and second regions, etching the isolation layer at an edge of the first region to form a guard ring pattern, forming a buried guard ring filling the guard ring pattern, selectively etching the isolation layer of the first region to form a plurality of patterns, forming a plurality of conductive patterns in the respective patterns, and completely removing the isolation layer of the first region through a dip-out process.
    • 提供半导体器件和制造半导体器件的方法。 制造半导体器件的方法包括在限定第一和第二区域的半导体衬底上形成隔离层,在第一区域的边缘蚀刻隔离层以形成保护环图案,形成填充保护环图案的掩埋保护环 选择性地蚀刻第一区域的隔离层以形成多个图案,在各图案中形成多个导电图案,并且通过浸出工艺完全去除第一区域的隔离层。
    • 90. 发明授权
    • Method for manufacturing semiconductor memory device
    • 制造半导体存储器件的方法
    • US08283227B2
    • 2012-10-09
    • US13282814
    • 2011-10-27
    • Toshiyuki HirotaTakakazu Kiyomura
    • Toshiyuki HirotaTakakazu Kiyomura
    • H01L21/8242
    • H01L27/10817H01L27/10852H01L28/57
    • In a method for manufacturing a semiconductor memory device, a three dimensional lower electrode including a titanium nitride film is formed on a semiconductor substrate, and a dielectric film is formed on the surface of the lower electrode. After a first upper electrode is formed at a temperature that the crystal of the dielectric film is not grown on the surface of the dielectric film, the first upper electrode and the dielectric film are heat-treated at a temperature that the crystal of the dielectric film is grown to convert at least a portion of the dielectric film into a crystalline state. Thereafter, a second upper electrode is formed on the surface of the first upper electrode.
    • 在制造半导体存储器件的方法中,在半导体衬底上形成包括氮化钛膜的三维下电极,并且在下电极的表面上形成电介质膜。 在电介质膜的晶体不在电介质膜的表面上生长的温度下形成第一上电极之后,在电介质膜的晶体的温度下对第一上电极和电介质膜进行热处理 生长以将至少一部分电介质膜转化为结晶状态。 此后,在第一上电极的表面上形成第二上电极。