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81. 发明申请

US20090190330A1 LIGHT SOURCE ASSEMBLY AND LIQUID CRYSTAL DISPLAY HAVING THE SAME 有权
标题翻译：光源组件和液晶显示器
公开(公告)号：US20090190330A1
公开(公告)日：2009-07-30
申请号：US12358794
申请日：2009-01-23
申请人： Yoon-Ho KIM , Jin-Woo Park , Chang-Hoi Kim
发明人： Yoon-Ho KIM , Jin-Woo Park , Chang-Hoi Kim
IPC分类号： G02F1/13357 , F21V21/00
CPC分类号： H05K3/325 , G02F1/133603 , G02F2001/133612 , H05K3/301 , H05K3/306 , H05K2201/10106 , H05K2201/10393
摘要： Provided is a light source assembly that may facilitate the coupling and the replacement of light source units, and may thus reduce the manufacturing time, and a liquid crystal display (LCD) having the same. The light source assembly includes a light source unit, a circuit board, and a supporting plate. The light source unit includes at least one light source chip, a first terminal connected to the light source chip, and a housing accommodating the light source chip therein and having at least one fixing protrusion on one side thereof. The circuit board includes a second terminal that is connected to the first terminal and transmits a driving voltage. The light source unit is mounted on the second terminal. The supporting plate is disposed on the circuit board and includes an opening into which the light source unit is inserted. At least a portion of the housing is fixed to the circuit board through the opening.
摘要翻译：提供了一种可以促进光源单元的耦合和更换并因此可以减少制造时间的光源组件，以及具有该光源组件的液晶显示器（LCD）。光源组件包括光源单元，电路板和支撑板。光源单元包括至少一个光源芯片，连接到光源芯片的第一端子和容纳其中的光源芯片的壳体，并且在其一侧具有至少一个固定突起。电路板包括连接到第一端子并传输驱动电压的第二端子。光源单元安装在第二端子上。支撑板设置在电路板上，并且包括插入有光源单元的开口。壳体的至少一部分通过开口固定到电路板。

82. 发明申请

US20090156026A1 CONTACT AND CONNECTING DEVICE 审中-公开
标题翻译：联系和连接设备
公开(公告)号：US20090156026A1
公开(公告)日：2009-06-18
申请号：US12258554
申请日：2008-10-27
申请人： Yasuhiro OHMORI
发明人： Yasuhiro OHMORI
IPC分类号： H05K1/00
CPC分类号： H05K3/301 , F21V19/008 , H01H85/202 , H01R33/0836 , H05K2201/10113 , H05K2201/10265 , H05K2201/10295 , H05K2201/10393
摘要： The present invention provides a contact for connection with an electronic component. The contact includes: a base part; a supporting part, provided on top of the base part for supporting a lead terminal of the electronic component; and at least two clamp parts, provided on top of the base part so as to be located on respective outer sides of the supporting part. The clamp parts are adapted to sandwich the lead terminal of the electronic component between themselves and the supporting part.
摘要翻译：本发明提供一种用于与电子部件连接的触点。联系人包括：基部; 支撑部，设置在基部的顶部，用于支撑电子部件的引线端子; 以及至少两个夹紧部件，其设置在基部的顶部上，以便位于支撑部分的相应的外侧上。夹持部件适于将电子部件的引线端子夹在其自身与支撑部件之间。

83. 发明申请

US20080310135A1 SHIELDED CIRCUIT ASSEMBLY AND METHOD 有权
标题翻译：屏蔽电路组件和方法
公开(公告)号：US20080310135A1
公开(公告)日：2008-12-18
申请号：US11837009
申请日：2007-08-10
申请人： Goran Walter SCHACK , Gustav FAGRENIUS
发明人： Goran Walter SCHACK , Gustav FAGRENIUS
IPC分类号： H05K7/14 , H05K3/36
CPC分类号： H05K7/14 , H05K1/141 , H05K1/147 , H05K9/0018 , H05K9/0024 , H05K2201/042 , H05K2201/10371 , H05K2201/10393 , H05K2201/2036 , Y10T29/49126
摘要： A shielded circuit assembly includes first and second circuit support structure, e.g. circuit boards having electrical or electronic components thereon, flexible connection between the circuit support structures, e.g., a flexible printed circuit (FPC), flat flexible cable (FFC), or other connection, the first and second circuit support structures adapted for positioning in generally overlying spaced apart relation with the flexible connection providing electrical connection therebetween while having floor plans that tend to efficiently conserve space between the circuit support structures, and electromagnetic energy shielding adapted to provide shielding of space between the circuit support structures in such generally overlying spaced apart relation. A method of making a shielded circuit assembly includes folding one printed circuit board that is flexibly attached to another printed circuit board to a generally parallel spaced apart relation and providing shielding of space between the circuit boards.
摘要翻译：屏蔽电路组件包括第一和第二电路支撑结构，例如。在其上具有电气或电子部件的电路板，电路支撑结构之间的柔性连接，例如柔性印刷电路（FPC），扁平柔性电缆（FFC）或其它连接，第一和第二电路支撑结构适于一般定位与柔性连接相互间隔开的关系提供电连接，同时具有倾向于有效地节省电路支撑结构之间的空间的平面图，以及电磁能屏蔽，其适于在这种通常重叠的间隔开的关系中提供电路支撑结构之间的空间屏蔽。制造屏蔽电路组件的方法包括将一个印刷电路板折叠成柔性地附接到另一个印刷电路板，以大致平行间隔的关系并且提供电路板之间的空间屏蔽。

84. 发明申请

US20080198619A1 Backlight module with tubes 审中-公开
标题翻译：带灯管的背光模块
公开(公告)号：US20080198619A1
公开(公告)日：2008-08-21
申请号：US11798043
申请日：2007-05-09
申请人： Ming-Chuan Chen , Kuo-Ann Chu
发明人： Ming-Chuan Chen , Kuo-Ann Chu
IPC分类号： F21S4/00
CPC分类号： F21V19/0085 , G02F1/133604 , H05K3/325 , H05K2201/10113 , H05K2201/10393 , H05K2201/10446 , H05K2201/10916
摘要： A tube installation of a backlight module allowing fast and easy assembly and disassembly of tube without depending on a soldering process is comprised of a substrate, multiple tubes and a locating means; a terminal of each tube being provided with a conductor comprised of a first bending portion and a second bending portion with a terminal of the second bending portion serving as a contact portion; the locating means being placed below the substrate for the contact portion to contact the substrate so to secure the tube to where above the substrate.
摘要翻译：背光模块的管装置包括：基板，多个管和定位装置，其能够快速且容易地组装和拆卸管而不依赖于焊接工艺。每个管的端子设置有由第一弯曲部和第二弯曲部构成的导体，第二弯曲部的端子用作接触部; 所述定位装置被放置在所述基板的下方以使所述接触部分接触所述基板，从而将所述管固定到所述基板上方的位置。

85. 发明申请

US20070254519A1 Pressing mechanism for LED chip 审中-公开
标题翻译： LED芯片按压机构
公开(公告)号：US20070254519A1
公开(公告)日：2007-11-01
申请号：US11413083
申请日：2006-04-28
申请人： Chung Wu , Meng-Cheng Huang , Zu-Chao Hsu
发明人： Chung Wu , Meng-Cheng Huang , Zu-Chao Hsu
IPC分类号： H01R13/62
CPC分类号： H05K3/325 , H05K1/0203 , H05K2201/10393 , H05K2201/10651
摘要： A pressing mechanism presses the LED chip firmly to the base and includes a pressing device. The pressing device includes two parallel metal plates extended integrally from topside of the base and disposed on two sides of the LED chip. The metal plate includes a first pin connected to the base and a second pin extended parallel atop the base. The separation between the pressing plate and the base is slightly larger than the thickness of the LED chip. According to another preferred embodiment of the present invention, the pressing plate is a pressing clip. The pressing clip includes a connection end of substantially L shape and a floating end of substantially U shape. According to still another preferred embodiment of the present invention, the pressing mechanism includes two screws to fix the LED chip to the base on two radial sides of the LED chip.
摘要翻译：按压机构将LED芯片牢固地按压到基座并且包括按压装置。按压装置包括从基座的顶部整体延伸并且设置在LED芯片的两侧上的两个平行的金属板。金属板包括连接到基座的第一销和平行于基座顶部延伸的第二销。按压板和基座之间的间隔略大于LED芯片的厚度。根据本发明的另一个优选实施例，按压板是按压夹。按压夹包括大致L形的连接端和大致U形的浮动端。根据本发明的另一个优选实施例，按压机构包括两个将LED芯片固定在LED芯片的两个径向侧上的基座的螺钉。

86. 发明授权

US07241148B2 Modules for fixing flexible printed circuit boards and flat display devices utilizing the same 有权
公开(公告)号：US07241148B2
公开(公告)日：2007-07-10
申请号：US11002503
申请日：2004-12-02
申请人： Chih-Chung Chao , Che-Chih Chang
发明人： Chih-Chung Chao , Che-Chih Chang
IPC分类号： H01R12/00
CPC分类号： G02F1/13452 , H01R12/62 , H01R12/7076 , H05K1/118 , H05K3/361 , H05K2201/09081 , H05K2201/10393
摘要： Modules for fixing flexible printed circuit boards. A module comprises a casing and a flexible printed circuit board. The casing has a recess on a lateral side. The flexible printed circuit board has a flexible portion disposed in the recess, wherein the thickness of the flexible portion is substantially equal to the thickness of the recess.

87. 发明申请

US20070126118A1 Mounting flexible circuits onto integrated circuit substrates 有权
标题翻译：将柔性电路安装到集成电路基板上
公开(公告)号：US20070126118A1
公开(公告)日：2007-06-07
申请号：US11292893
申请日：2005-12-02
申请人： Daoqiang Lu , Henning Braunisch
发明人： Daoqiang Lu , Henning Braunisch
IPC分类号： H01L23/12 , H01L21/48
CPC分类号： H05K3/301 , H01L23/49833 , H01L23/4985 , H01L24/16 , H01L24/73 , H01L2224/13 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/01079 , H01L2924/14 , H01L2924/15192 , H05K3/341 , H05K3/361 , H05K3/365 , H05K2201/10393 , H05K2203/048 , H01L2924/014
摘要： A substrate may receive an integrated circuit and a flex circuit on the same side in the same vertical direction. In addition, in some embodiments, a flex circuit adapter and the integrated circuit may be surface mounted in one operation.
摘要翻译：衬底可以在同一垂直方向上的同一侧上接收集成电路和柔性电路。此外，在一些实施例中，柔性电路适配器和集成电路可以在一个操作中被表面安装。

88. 发明授权

US07202420B2 Methods to prevent mechanical flexure related BGA failure 有权
标题翻译：防止机械挠曲相关BGA故障的方法
公开(公告)号：US07202420B2
公开(公告)日：2007-04-10
申请号：US10738688
申请日：2003-12-16
申请人： Biju I. Chandran
发明人： Biju I. Chandran
IPC分类号： H05K7/12 , H05K7/20
CPC分类号： H05K1/0271 , H01L2924/15311 , H05K3/3436 , H05K2201/10393 , H05K2201/10734 , H05K2203/0278 , Y10T29/49126 , Y10T29/4913
摘要： Methods and associated apparatus of reducing stress in a package are described in which a package is provided comprising an array of interconnects that are connected to a substrate, and then reducing the stress of the interconnects located near a weak area in the package, during flexure of the substrate, by spring loading the weak area of the package.
摘要翻译：描述了减小封装中的应力的方法和相关联的装置，其中提供了包括连接到基板的互连阵列，然后在挠曲期间减小位于封装中的弱区附近的互连的应力的封装基板，通过弹簧加载包装的弱区域。

89. 发明申请

US20060163707A1 Method and apparatus for reducing stresses applied to bonded interconnects between substrates 审中-公开
标题翻译：减少施加到基板之间的接合互连的应力的方法和装置
公开(公告)号：US20060163707A1
公开(公告)日：2006-07-27
申请号：US11039975
申请日：2005-01-21
申请人： Kean Hooi
发明人： Kean Hooi
IPC分类号： H01L23/02
CPC分类号： H01L23/552 , H01L23/16 , H01L23/562 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/16152 , H01L2924/3025 , H05K3/301 , H05K2201/10371 , H05K2201/10393 , H05K2201/10734 , H05K2203/1105 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method (200) is provided for reducing stresses applied to one or more bonded interconnects (106) of a substrate (103) and a PCB (Printed Circuit Board) (104). The method comprises the steps of coupling (204) a compound (108) on a top surface of the substrate, wherein the compound has the property of expanding when a heat profile is applied thereto, coupling (206) a cover (102) to the PCB that overhangs at least a portion of the compound, and applying (208) the heat profile to the compound and optionally the cover and/or PCB. More than one apparatus implementing the method is also included.
摘要翻译：提供了一种方法（200），用于减小施加到衬底（103）和PCB（印刷电路板）（104）的一个或多个键合互连（106）的应力。该方法包括以下步骤：将化合物（108）偶联在基材的顶表面上，其中当加热分布被施加到其上时，该化合物具有膨胀的性质，将盖（206）与盖 PCB，其突出至少一部分化合物，并且将热分布施加（208）到化合物和任选的盖和/或PCB。还包括实现该方法的多个装置。

90. 发明授权

US06991473B1 Electrical connector with elastomeric pad having compressor fingers each including a filler member to mitigate relaxation of the elastomer 失效
标题翻译：具有弹性体垫的电连接器，其具有压缩机指状件，每个包括填充构件以减轻弹性体的松弛
公开(公告)号：US06991473B1
公开(公告)日：2006-01-31
申请号：US11000453
申请日：2004-11-30
申请人： Gregory Ervin Balcome , Joseph Kuczynski , Kevin Albert Splittstoesser , Timothy Jerome Tofil , Paul Alan Vermilyea
发明人： Gregory Ervin Balcome , Joseph Kuczynski , Kevin Albert Splittstoesser , Timothy Jerome Tofil , Paul Alan Vermilyea
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H01R12/62 , H01R13/24 , H01R13/6215 , H05K3/365 , H05K2201/10393
摘要： An electrical connector includes connector pads on a printed circuit board and contact members on an insulating substrate. The contact members are pressed against the contact pads by a compression mat having compressor fingers. A clamping arrangement forces the compressor fingers against the substrate and thereby presses the contact members against the contact pads. To counteract the inherent tendency of the compressor fingers to undergo stress relaxation after the compressor mat has been clamped, the connector also includes filler members disposed at least partially within the compressor fingers, essentially a “button-within-a-button” arrangement. Optionally, a filler deflection member may be interposed between the compression mat and a clamping plate of the clamping arrangement so that the filler deflection member abuts against the filler members. Alternatively, the filler members may be integral features of the deflection member.
摘要翻译：电连接器包括印刷电路板上的连接器焊盘和绝缘基板上的接触部件。接触构件通过具有压缩指状物的压缩垫压靠在接触垫上。夹紧装置迫使压缩机手指抵靠基板，从而将接触构件压靠在接触垫上。为了抵消在压缩机垫被夹紧之后压缩机手指经受应力松弛的固有趋势，连接器还包括至少部分地设置在压缩机指状件内的填充构件，基本上是“按钮内按钮”结构。可选地，填料偏转构件可插入在压缩垫和夹紧装置的夹紧板之间，使得填料偏转构件抵靠填料构件。或者，填充构件可以是偏转构件的整体特征。

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