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    • 81. 发明授权
    • Imaging device and imaging system
    • 成像设备和成像系统
    • US09305953B2
    • 2016-04-05
    • US14579969
    • 2014-12-22
    • CANON KABUSHIKI KAISHA
    • Kentarou SuzukiTomoyuki Tezuka
    • H04N5/335H01L27/146H04N5/369H04N5/225
    • H01L27/14623H01L27/14607H01L27/14636H04N5/2254H04N5/369
    • An imaging device includes a light-sensing pixel region; a first pixel region; a second pixel region; a first wiring layer disposed above the light-sensing pixel region; and a second wiring layer disposed above the topmost wiring layer of the wiring layer disposed above the light-sensing pixel region, above the second pixel region. The first pixel region is disposed between the light-sensing pixel region and the second pixel region, adjacent to the light-sensing pixel region and the second pixel region, wherein the first pixel region overlaps, in plan view, a first shielding portion included in the first wiring layer. The second pixel region overlaps, in plan view, a second shielding portion included in the second wiring layer. An electroconductive pattern is formed at the first wiring layer at a position overlapping the second pixel region in plan view.
    • 一种成像装置包括一个感光像素区域; 第一像素区域; 第二像素区域; 设置在感光像素区域上方的第一布线层; 以及第二布线层,其布置在布置在所述第二像素区域上方的所述光感测像素区域上方的所述布线层的最上布线层的上方。 第一像素区域设置在与感光像素区域和第二像素区域相邻的光感测像素区域和第二像素区域之间,其中第一像素区域在平面图中与第一像素区域重叠,第一屏蔽部分包括在 第一布线层。 第二像素区域在平面图中与包括在第二布线层中的第二屏蔽部分重叠。 在平面图中与第二像素区域重叠的位置处,在第一布线层处形成导电图案。
    • 89. 发明授权
    • Solid-state imaging element and electronic apparatus
    • 固态成像元件和电子设备
    • US09215388B2
    • 2015-12-15
    • US14489156
    • 2014-09-17
    • Sony Corporation
    • Kazuichiro Itonaga
    • H01L27/00H04N5/369H01L31/0203H01L27/146
    • H04N5/369H01L27/14618H01L31/0203H01L2924/0002H01L2924/00
    • A method of manufacturing a solid-state imaging element includes: manufacturing an element chip in which photoelectric conversion units are arranged on a main surface side; preparing a base configured using a material with an expansion coefficient greater than the element chip and having an opening of which the periphery of the opening is shaped as a flat surface; expanding the base by heating, mounting the element chip on the flat surface of the base in a state where the opening of the base is covered; and three-dimensionally curving a portion corresponding to the opening in the element chip by cooling and contracting the base in a state where the element chip is fixed to the flat surface of the expanded base.
    • 制造固态成像元件的方法包括:制造其中光电转换单元布置在主表面侧上的元件芯片; 准备使用具有大于元件芯片的膨胀系数的材料构成的基部,并且开口的开口被形成为平坦表面; 通过加热来膨胀基座,在基部的开口被覆盖的状态下将元件芯片安装在基座的平坦表面上; 并且在元件芯片被固定到扩展基座的平坦表面的状态下通过冷却和收缩基座来三维地弯曲与元件芯片中的开口相对应的部分。