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    • 81. 发明申请
    • LIGHT EMITTING DEVICE
    • 发光装置
    • US20110163342A1
    • 2011-07-07
    • US13049683
    • 2011-03-16
    • Kyung Jun KIMHyo Kun Son
    • Kyung Jun KIMHyo Kun Son
    • H01L33/60
    • H01L33/44H01L33/02H01L33/22H01L33/32H01L33/325H01L33/405
    • A light emitting device including a second metal layer, a second conduction type semiconductor layer on the second metal layer, an active layer on the second conduction type semiconductor layer, a first conduction type semiconductor layer on the active layer, a first metal layer on the first conduction type semiconductor layer, an insulating layer being disposed on a peripheral portion of an upper surface of the second metal layer and being disposed under a lower surface of the second conduction type semiconductor layer, and a passivation layer on lateral surfaces of the insulating layer, the second conduction type semiconductor layer, the active layer and the first conduction type semiconductor layer, the passivation layer being on an upper surface of the second metal layer, wherein a lateral surface of the insulating layer is adjacent to a lateral surface of the second metal layer.
    • 一种发光器件,包括第二金属层,第二金属层上的第二导电类型半导体层,第二导电型半导体层上的有源层,有源层上的第一导电类型半导体层,第一金属层 第一导电型半导体层,绝缘层设置在第二金属层的上表面的周边部分并且设置在第二导电类型半导体层的下表面下方,以及绝缘层的侧表面上的钝化层 所述第二导电类型半导体层,所述有源层和所述第一导电类型半导体层,所述钝化层位于所述第二金属层的上表面上,其中所述绝缘层的侧表面与所述第二导电类型半导体层的侧表面相邻, 金属层。
    • 89. 发明申请
    • Light-emitting device epitaxial wafer and light-emitting device
    • 发光元件外延片和发光元件
    • US20100224855A1
    • 2010-09-09
    • US12656674
    • 2010-02-12
    • Takashi TakeuchiTaichiroo Konnno
    • Takashi TakeuchiTaichiroo Konnno
    • H01L33/00
    • H01L33/325H01L33/025
    • A light-emitting device epitaxial wafer includes an n-type substrate, an n-type cladding layer stacked on the n-type substrate, a light-emitting layer including a quantum well structure stacked on the n-type cladding layer, and a p-type cladding layer stacked on the light-emitting layer. The n-type cladding layer includes an epitaxial layer doped with a mixture of 2 or more n-type dopants including Si, and is not less than 250 nm and not more than 750 nm in thickness. Alternatively, a light-emitting device epitaxial wafer includes an n-type substrate, an n-type cladding layer stacked on the n-type substrate, a light-emitting layer stacked on the n-type cladding layer, and a p-type cladding layer stacked on the light-emitting layer. The n-type cladding layer includes 2 or more n-type impurities including Si.
    • 发光器件外延晶片包括n型衬底,堆叠在n型衬底上的n型覆层,包括堆叠在n型覆层上的量子阱结构的发光层和p型 型覆盖层堆叠在发光层上。 n型包覆层包括掺杂有2种以上的包含Si的n型掺杂剂的混合物的外延层,并且厚度不小于250nm且不大于750nm。 或者,发光装置外延晶片包括n型衬底,堆叠在n型衬底上的n型覆层,堆叠在n型覆层上的发光层和p型覆层 层叠在发光层上。 n型包覆层包含2种以上含有Si的n型杂质。