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    • 83. 发明申请
    • VLSI HOT-SPOT MINIMIZATION USING NANOTUBES
    • 使用NANOTUBES的VLSI HOT-SPOT最小化
    • US20080316711A1
    • 2008-12-25
    • US12169458
    • 2008-07-08
    • Christos Dimitrios DimitrakopoulosChristos John Georgiou
    • Christos Dimitrios DimitrakopoulosChristos John Georgiou
    • H05K7/20H01L21/50
    • F28F21/02F28D2015/0225F28D2021/0029F28F2255/00F28F2260/02H01L23/373H01L2924/0002H01L2924/00
    • The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area. The heat conductivity of the nanotubes is greater than the heat conductivity of the matrix material, with the distal ends of the nanotubes exposed to present a distal surface comprising the first heat conducting means for direct contact with a medium comprising a cooling fluid. The inventors also disclose processes for manufacturing and using the device and products produced by the processes.
    • 本发明涉及一种半导体器件,其包括具有位于管芯上的平面中的至少一个限定热点区域的管芯和包括在不同于热点区域的平面的平面内延伸的碳纳米管的纳米管的冷却结构 并从热点区域的平面向外。 纳米管与热点区域可操作地相关联,以降低由热点区域和模具上的至少一个其它区域之间的温度梯度,该温度梯度由低于热点区域的温度限定。 包括第二导热材料的基质材料基本上围绕纳米管,并且与由热点区域的温度限定的模具上的另一个区域可操作地相关联并与其导热。 纳米管的导热性大于基体材料的导热性,其中纳米管的远端暴露于远侧表面,该远端表面包括用于与包含冷却流体的介质直接接触的第一导热装置。 本发明人还公开了用于制造和使用由该方法生产的装置和产品的方法。
    • 85. 发明授权
    • Heat exchanger of ventilating system
    • 通风系统换热器
    • US07188666B2
    • 2007-03-13
    • US10538070
    • 2003-02-04
    • Seong-Hwan LeeMin-Chul ChoSoo-Yeon Shin
    • Seong-Hwan LeeMin-Chul ChoSoo-Yeon Shin
    • F28F3/02
    • F24F12/006F24F3/147F28D9/0062F28D21/0015F28F21/00F28F2255/00Y02B30/563Y10S165/905
    • A heat exchanger of a ventilating system includes: heat exchange plates having first air passage through which indoor air being discharged to outside of a building passes and a second air passage through which outdoor air being introduced to the interior of the building passes which are sequentially formed: first corrugation plates attached to the first air passage; and second corrugation plates attached to the second air passage, wherein the heat exchange plates are made of a paper material with numerous fine holes that are able to generate a capillary phenomenon and loess which radiates far infrared ray. Heat exchange and moisture exchange between the indoor air and the outdoor air are performed simultaneously, and a cleaning function of removing a harmful material contained in outdoor air can be carried out.
    • 通风系统的热交换器包括:热交换板,其具有第一空气通道,室内空气排出到建筑物外部通过;以及第二空气通道,室外空气通过该第二空气通道被引导到建筑物内部顺序地形成 :第一个波纹板附着在第一个空气通道上; 以及附接到第二空气通道的第二波纹板,其中热交换板由具有能够产生毛细管现象的许多细孔的纸材料和辐射远红外线的黄土制成。 同时进行室内空气和室外空气之间的热交换和湿气交换,并且可以进行除去室外空气中所含的有害物质的清洁功能。